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ENABLE

LMH0302

SD/HD

SDO

SDI

ENABLE

SDO

750:

75: 75:

75:

SD/HD

Differential

Input

REF

49.9:

1.0 PF

0.1 PF

4.7 PF

6.8 nH

0.1 PF

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

Reference

Design

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SNLS247

LMH0302

ZHCSAK2H –APRIL 2007–REVISED JUNE 2016

LMH0302 3Gbps HD/SD SDI 电电缆缆驱驱动动器器

1 特特性性

• 支持 ST 424 (3G)、292 (HD) 和 259 (SD)

• 数据速率高达 2.97Gbps

• 支持 DVB-ASI（270Mbps 时）

• 100Ω 差分输入

• 75Ω 单端输出

• 可选转换率

• 输出驱动器掉电控制

• 3.3V 单电源运行

• 工业温度范围：-40°C 至 85°C

• 典型功耗：125mW（SD 模式），165mW（HD 模

式）

• 16 引脚超薄型四方扁平无引线 (WQFN) 封装

• 封装与 LMH0002SQ 兼容

• 替代 Gennum GS2978

2 应应用用

• ST 424、ST 292、ST 344 和 ST 259 串行数字接

口

• 数字视频路由器和交换机

• 分布式放大器

3 说说明明

LMH0302 3Gbps HD/SD SDI 电缆驱动器设计用于 ST

424、ST 292、ST 344 和 ST 259 串行数字视频应

用。LMH0302 以高达 2.97Gbps 的数据速率驱动

75Ω 传输线路（Belden 1694A、Belden 8281 或等效

电缆）。

LMH0302 提供有两种可选转换率，以符合 ST 259 和

ST 424/292。输出驱动器可通过输出驱动器使能引脚

实现掉电。

LMH0302 由 3.3V 单电源供电运行。SD 模式下的典型

功耗为 125mW；HD 模式下的典型功耗为 165mW。

LMH0302 采用 16 引脚 WQFN 封装。

器器件件信信息息

(1)

器器件件型型号号封封装装封封装装尺尺寸寸（（标标称称值值））

LMH0302 WQFN (16) 4.00mm x 4.00mm

(1) 要了解所有可用封装，请参见数据表末尾的可订购产品附录。

典典型型应应用用

LMH0302

ZHCSAK2H –APRIL 2007–REVISED JUNE 2016

www.ti.com.cn

目目录录

1 特特性性.......................................................................... 1

2 应应用用.......................................................................... 1

3 说说明明.......................................................................... 1

4 修修订订历历史史记记录录 ........................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information ................................................. 4

6.5 Electrical Characteristics – DC ................................. 4

6.6 Electrical Characteristics – AC.................................. 5

6.7 Typical Characteristics ............................................. 5

7 Detailed Description.............................................. 6

7.1 Overview .................................................................. 6

7.2 Functional Block Diagram ........................................ 6

7.3 Feature Description .................................................. 6

7.4 Device Functional Modes.......................................... 7

8 Application and Implementation .......................... 8

8.1 Application Information ............................................ 8

8.2 Typical Application ................................................... 8

9 Power Supply Recommendations...................... 10

10 Layout................................................................... 10

10.1 Layout Guidelines ................................................ 10

10.2 Layout Example ................................................... 11

11 器器件件和和文文档档支支持持 ..................................................... 12

11.1 社区资源................................................................ 12

11.2 商标 ....................................................................... 12

11.3 静电放电警告......................................................... 12

11.4 Glossary................................................................ 12

12 机机械械、、封封装装和和可可订订购购信信息息....................................... 12

4 修修订订历历史史记记录录

注：之前版本的页码可能与当前版本有所不同。

Changes from Revision G (April 2013) to Revision H Page

• 已添加 ESD

额定值

表，

特性描述

部分，

器件功能模式

，

应用和实施

部分，

电源相关建议

部分，

布局

部分，

器件和文

档支持

部分以及

机械、封装和可订购信息

部分........................................................................................................................ 1

Changes from Revision F (April 2013) to Revision G Page

• 已更改国家数据表的版面布局至 TI 格式................................................................................................................................ 1

LMH0302

ZHCSAK2H –APRIL 2007–REVISED JUNE 2016

www.ti.com.cn

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN MAX UNIT

Supply voltage –0.5 3.6 V

Input voltage (all inputs) –0.3 V

+ 0.3 V

Output current 28 mA

Lead temperature, soldering (4 s) 260 °C

Junction temperature, T

125 °C

Storage temperature, T

stg

–65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE UNIT

(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001

(1)

±4500

VCharged-device model (CDM), per JEDEC specification JESD22-C101

(2)

±2000

Machine model (MM) ±250

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

Supply voltage (V

– V

) 3.13 3.3 3.46 V

Operating junction temperature 100 °C

Operating free air temperature, T

–40 25 85 °C

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC

(1)

LMH0302

UNITRUM (WQFN)

16 PINS

θJA

Junction-to-ambient thermal resistance 47.8 °C/W

θJC(top)

Junction-to-case (top) thermal resistance 47.2 °C/W

θJB

Junction-to-board thermal resistance 25.6 °C/W

Junction-to-top characterization parameter 1.7 °C/W

Junction-to-board characterization parameter 25.7 °C/W

θJC(bot)

Junction-to-case (bottom) thermal resistance 14.5 °C/W

(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated

referenced to V

= 0 V.

(2) Typical values are stated for V

= 3.3 V and T

= 25°C.

6.5 Electrical Characteristics – DC

Over supply voltage and operating free-air temperature range (unless otherwise noted)

(1)(2)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

CMIN

Input common mode voltage SDI, SDI 1.1 + V

SDI

/2 V

– V

SDI

/2 V

SDI

Input voltage swing Differential, SDI, SDI 100 2200 mV

P−P

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