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LMZ10503
ZHCS551L –JANUARY 2010–REVISED APRIL 2019
www.ti.com.cn
Copyright © 2010–2019, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 7
7 Detailed Description............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 13
8 Application and Implementation ........................ 14
8.1 Application Information............................................ 14
8.2 Typical Application .................................................. 14
8.3 System Examples ................................................... 20
9 Power Supply Recommendations...................... 23
10 Layout................................................................... 23
10.1 Layout Guidelines ................................................. 23
10.2 Layout Examples................................................... 24
10.3 Estimate Power Dissipation and Thermal
Considerations ......................................................... 26
10.4 Power Module SMT Guidelines ............................ 27
11 器器件件和和文文档档支支持持 ..................................................... 28
11.1 器件支持................................................................ 28
11.2 文档支持................................................................ 28
11.3 接收文档更新通知 ................................................. 28
11.4 社区资源................................................................ 28
11.5 商标 ....................................................................... 28
11.6 静电放电警告......................................................... 29
11.7 术语表 ................................................................... 29
12 机机械械、、封封装装和和可可订订购购信信息息....................................... 29
4 修修订订历历史史记记录录
注:之前版本的页码可能与当前版本有所不同。
Changes from Revision K (May 2017) to Revision L Page
• 仅有编辑更改;无技术性更改 ................................................................................................................................................ 1
Changes from Revision J (September 2015) to Revision K Page
• 已更改 WEBENCH 列表项的语言;在产品说明书中进一步添加了有关 WEBENCH 的其他内容和链接 ................................ 1
• Changed equation 1 in Enable and UVLO .......................................................................................................................... 10
Changes from Revision I (October 2013) to Revision J Page
• 已添加
引脚配置和功能
部分、ESD
额定值
表、
特性 说明
部分、
器件功能模式
、
应用和实施
部分、
电源相关建议
部
分、
布局
部分、
器件和文档支持
部分以及
机械、封装和可订购信息
部分 ................................................................................ 1
• 删除了易用型 PFM 7 引脚封装图 ........................................................................................................................................... 1
Changes from Revision H (April 2013) to Revision I Page
• Deleted 10 mils....................................................................................................................................................................... 4
• Changed 10 mils................................................................................................................................................................... 23
• Added Power Module SMT Guidelines................................................................................................................................. 27
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