NXP-MIMXRT1175AVM8A.pdf
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NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMXRT1170CEC
Rev. 0, 12/2020
MIMXRT1176DVMAA MIMXRT1175DVMAA
MIMXRT1172DVMAA MIMXRT1171DVMAA
Package Information
Plastic Package
289-pin MAPBGA, 14 x 14 mm, 0.8 mm pitch
Ordering Information
See Table 1 on page 6
© 2020 NXP Semiconductors. All rights reserved.
1 i.MX RT1170 introduction
The i.MX RT1170 is a new high-end processor of i.MX
RT family, which features NXP’s advanced
implementation of a high performance Arm
Cortex
®
-M7 core operating at speeds up to 1 GHz and a
power efficient Cortex
®
-M4 core up to 400 MHz.
The i.MX RT1170 processor has 2 MB on-chip RAM in
total, including a 768 KB RAM which can be flexibly
configured as TCM (512 KB RAM shared with M7 TCM
and 256 KB RAM shared with M4 TCM) or
general-purpose on-chip RAM. The i.MX RT1170
integrates advanced power management module with
DCDC and LDO regulators that reduce complexity of
external power supply and simplifies power sequencing.
The i.MX RT1170 also provides various memory
interfaces, including SDRAM, RAW NAND FLASH,
NOR FLASH, SD/eMMC, Quad/Octal SPI, Hyper
RAM/Flash, and a wide range of other interfaces for
connecting peripherals, such as WLAN, Bluetooth™,
GPS, displays, and camera sensors. The i.MX RT1170
also has rich audio and video features, including MIPI
CSI/DSI, LCD display, graphic accelerator, camera
interface, SPDIF, and I2S audio interface.
i.MX RT1170 Crossover
Processors Data Sheet
for Consumer Products
1. i.MX RT1170 introduction . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6
1.3. Package marking information . . . . . . . . . . . . . . . . 9
2. Architectural overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
3. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. Special signal considerations . . . . . . . . . . . . . . . 20
3.2. Recommended connections for unused analog
interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 24
4.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 24
4.2. System power and clocks . . . . . . . . . . . . . . . . . . 36
4.3. I/O parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
4.4. System modules . . . . . . . . . . . . . . . . . . . . . . . . . 54
4.5. External memory interface . . . . . . . . . . . . . . . . . . 58
4.6. Display and graphics . . . . . . . . . . . . . . . . . . . . . . 68
4.7. Audio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
4.8. Analog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
4.9. Communication interfaces . . . . . . . . . . . . . . . . . . 85
4.10. Timers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
4.11. SNVS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
5. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . 104
5.1. Boot mode configuration pins . . . . . . . . . . . . . . 104
5.2. Boot device interface allocation . . . . . . . . . . . . . 104
6. Package information and contact assignments . . . . . . 110
6.1. 14 x 14 mm package information . . . . . . . . . . . . 110
7. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
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