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产品分类 分立半导体产品 晶体管 封装/外壳 TO-220-3 FET类型 N沟道 漏源极电压(Vdss) 40V 栅源电压 Vgss ±20V 安装类型 通孔(THT)
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0
2
4
6
8
10
12
0 2 4 6 8 10 12 14 16 18 20
V
GS
- Gate-to- Source Voltage (V)
R
DS(on)
- On-State Resistance (mΩ)
T
C
= 25°C Id = 100A
T
C
= 125ºC Id = 100A
G001
0
2
4
6
8
10
0 5 10 15 20 25 30 35 40 45 50 55
Q
g
- Gate Charge (nC)
V
GS
- Gate-to-Source Voltage (V)
I
D
= 100A
V
DS
= 20V
G001
Gate
(Pin 1)
Drain (Pin 2)
Source (Pin 3)
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CSD18502KCS
SLPS367B –AUGUST 2012–REVISED JULY 2014
CSD18502KCS 40-V N-Channel NexFET™ Power MOSFET
1 Features
Product Summary
1
• Ultra-Low Q
g
and Q
gd
T
A
= 25°C TYPICAL VALUE UNIT
• Low Thermal Resistance
V
DS
Drain-to-Source Voltage 40 V
• Avalanche Rated
Q
g
Gate Charge Total (10V) 52 nC
Q
gd
Gate Charge Gate-to-Drain 8.4 nC
• Logic Level
V
GS
= 4.5 V 3.3 mΩ
• Pb Free Terminal Plating
R
DS(on)
Drain-to-Source On Resistance
V
GS
= 10 V 2.4 mΩ
• RoHS Compliant
V
GS(th)
Threshold Voltage 1.8 V
• Halogen Free
• TO-220 Plastic Package
Ordering Information
(1)
Device Package Media Qty Ship
2 Applications
TO-220 Plastic
CSD18502KCS Tube 50 Tube
Package
• DC-DC Conversion
(1) For all available packages, see the orderable addendum at
• Secondary Side Synchronous Rectifier
the end of the data sheet.
• Motor Control
Absolute Maximum Ratings
3 Description
T
A
= 25°C VALUE UNIT
This 2.4 mΩ, 40 V, TO-220 NexFET™ power
V
DS
Drain-to-Source Voltage 40 V
MOSFET is designed to minimize losses in power
V
GS
Gate-to-Source Voltage ±20 V
conversion applications.
Continuous Drain Current (Package limited) 100
Continuous Drain Current (Silicon limited),
212
I
D
T
C
= 25°C A
Continuous Drain Current (Silicon limited),
150
T
C
= 100°C
I
DM
Pulsed Drain Current
(1)
400 A
P
D
Power Dissipation 259 W
T
J
, Operating Junction and
–55 to 175 °C
T
stg
Storage Temperature Range
Avalanche Energy, single pulse
E
AS
330 mJ
I
D
= 81 A, L = 0.1 mH, R
G
= 25 Ω
(1) Max R
θJC
= 0.6ºC/W, pulse duration ≤100 μs, duty cycle
≤1%
R
DS(on)
vs V
GS
Gate Charge
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CSD18502KCS
SLPS367B –AUGUST 2012–REVISED JULY 2014
www.ti.com
Table of Contents
5.3 Typical MOSFET Characteristics.............................. 4
1 Features.................................................................. 1
6 Device and Documentation Support.................... 7
2 Applications ........................................................... 1
6.1 Trademarks............................................................... 7
3 Description ............................................................. 1
6.2 Electrostatic Discharge Caution................................ 7
4 Revision History..................................................... 2
6.3 Glossary.................................................................... 7
5 Specifications......................................................... 3
7 Mechanical, Packaging, and Orderable
5.1 Electrical Characteristics........................................... 3
Information ............................................................. 8
5.2 Thermal Information.................................................. 3
7.1 KCS Package Dimensions........................................ 8
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (October 2012) to Revision B Page
• Increased the T
C
= 25º continuous drain current to 212 A .................................................................................................... 1
• Increased the T
C
= 125º continuous drain current to 150 A .................................................................................................. 1
• Increased the pulsed drain current to 400 A ......................................................................................................................... 1
• Increased the max power dissipation to 259 W ..................................................................................................................... 1
• Increased the max operating junction and storage temperature to 175º ............................................................................... 1
• Updated the pulsed current conditions .................................................................................................................................. 1
• Updated Figure 1 from a normalized R
θJA
to an R
θJC
curve ................................................................................................... 4
• Updated Figure 6 to extend to 175°C .................................................................................................................................... 5
• Updated Figure 8 to extend to 175°C .................................................................................................................................... 5
• Updated the SOA in Figure 10 .............................................................................................................................................. 6
• Updated Figure 12 to extend to 175°C .................................................................................................................................. 6
Changes from Original (August 2012) to Revision A Page
• Changed the Transconductance TYP value From: 149 S To: 138 S..................................................................................... 3
• Changed R
θJA
From: 65°C/W To: 62°C/W.............................................................................................................................. 3
2 Submit Documentation Feedback Copyright © 2012–2014, Texas Instruments Incorporated
Product Folder Links: CSD18502KCS
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