内容
1. 功能图.........................................................................................................................................................3
2. 传感器规格.................................................................................................................................................4
3. 电气特性.....................................................................................................................................................5
4. 绝对最大额定值.........................................................................................................................................5
5. 引脚顺序和引脚说明.................................................................................................................................6
6. 功能说明.....................................................................................................................................................6
6.1 磁性传感器 ..................................................................................................................................6
6.2 申请方式 ......................................................................................................................................7
6.3 I
2
C总线接口 .................................................................................................................................8
6.4 内存映射 ....................................................................................................................................11
7. 典型应用...................................................................................................................................................14
7.1 典型应用电路 ............................................................................................................................14
8. 封包装信息...............................................................................................................................................14
8.1 ST480MS WL-CSP 0.95 x 0.95mm封装外形尺寸 ...................................................................14
8.2 封装激光标记 ............................................................................................................................15
8.3 芯片的包装 ................................................................................................................................15
8.4 回流焊曲线 ................................................................................................................................16
8.5 储存情况 ....................................................................................................................................17
9. 可靠性.......................................................................................................................................................17
10. 环境合规....................................................................................................................................................18
11. 修订记录....................................................................................................................................................18
12. 免责声明....................................................................................................................................................18
