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Session_18_mmWave_and_subTHz_for_Wireless_and_Sensing.pdf
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Session 18 Overview:
mm-Wave & Sub-THz for Wireless and Sensing
WIRELESS SUBCOMMITTEE
mm-Wave/sub-THz technologies advance existing and enable emerging applications. The first paper presents a W-band
FMCW radar transceiver array enabling great scalability. The second paper features a fully integrated D-band receiver with
ultra-high data-rates and energy efficiency, followed by an E-band RFDAC for high output power and efficiency. The final paper
presents a CMOS THz receiver for high-resolution imaging applications.
Session Chair: Jane Gu
University of California, Davis, CA
Session Co-Chair: Giuseppe Gramegna
imec, Leuven, Belgium
280
• 2023 IEEE International Solid-State Circuits Conference
ISSCC 2023 / SESSION 18 / mm-WAVE & SUB-THz FOR WIRELESS AND SENSING / OVERVIEW
978-1-6654-9016-0/23/$31.00 ©2023 IEEE
2:00 PM
18.2 A 128Gb/s 1.95pJ/b D-Band Receiver with Integrated PLL and ADC in 22nm FinFET
Abhishek Agrawal, Intel, Hillsboro, OR
In Paper 18.2, Intel features a D-band receiver with integrated low-noise quadrature PLL and energy-efficient high-speed time-
interleaved ADC in 22nm FinFET. The complete receiver demonstrates a data-rate of 128Gb/s and energy efficiency of 1.95pJ/b.
2:30 PM
18.3 71-to-89GHz 12Gb/s Double-Edge-Triggered Quadrature RFDAC with LO Leakage Suppression Achieving
20.5dBm Peak Output Power and 20.4% System Efficiency
Bingzheng Yang,
University of Electronic Science and Technology of China, Chengdu, China
In Paper 18.3, the University of Electronic Science and Technology of China shows a high-efficiency 71-to-89GHz transmitter
in 40nm CMOS. The full transmitter achieves 20.5dBm peak output power and 20.4% system efficiency.
2:45 PM
18.4 A 4×4 607GHz Harmonic Injection-Locked Receiver Array Achieving 4.4pW/√Hz NEP in 28nm CMOS
Ariane De Vroede, KU Leuven ESAT-MICAS, Heverlee, Belgium
In Paper 18.4, KU Leuven presents a 4×4 607GHz harmonic injection-locked receiver array in 28nm CMOS for imaging
applications. The achieved average NEP of the array is 4.4pW/√Hz.
1:30 PM
18.1 A W-Band Transceiver Array with 2.4GHz LO Synchronization Enabling Full Scalability for FMCW Radar
Jingzhi Zhang,
Stanford University, Stanford, CA
In Paper 18.1, Stanford University presents a W-band FMCW radar transceiver array with 2.4GHz LO synchronization to facilitate
large array scalability in 40nm CMOS. The 4-receiver chip and 1-transmitter chip are demonstrated.
ISSCC 2023 / February 21, 2023 / 1:30 PM
281 DIGEST OF TECHNICAL PAPERS •
18
282
• 2023 IEEE International Solid-State Circuits Conference
ISSCC 2023 / SESSION 18 / mm-WAVE & SUB-THz FOR WIRELESS AND SENSING / 18.1
18.1 A W-Band Transceiver Array with 2.4GHz LO Synchronization
Enabling Full Scalability for FMCW Radar
Jingzhi Zhang, Ajay Singhvi, Sherif S. Ahmed, Amin Arbabian
Stanford University, Stanford, CA
Closing the angular resolution gap between CMOS radar and optical imaging systems
can enable an entirely new cost-effective radar-centric perception solution, but requires
extremely large transceiver (TRX) arrays to achieve LiDAR-like angular resolution. Multi-
chip cascading of mm-wave radars [1-3] has become the norm to enable these large
TRX arrays, but the size of these arrays is still limited due to challenges in achieving low-
cost signal distribution across a large aperture. Today, multi-chip radar cascading
solutions use mm-wave LO frequencies (20GHz [1,2], 40GHz [3]) along with on-chip
frequency multipliers with modest multiplication factors (×4 [1,2], ×2 [3]). However,
operating at these frequencies is cost-prohibitive and severely limits the size of the array
[1]. For example, for a 64-TX and 64-RX array, the calculated path loss on a Rogers 3003
substrate in an H-tree distribution network reaches 87dB at 40GHz, which requires more
than 70 amplifiers with 15dBm output power and 25dB gain alongside the distribution
network to compensate the loss. Moreover, maintaining phase coherency required for
FMCW systems is also infeasible for such amplifier implementations. Thus, enabling
truly scalable TRX arrays requires signal distribution at much lower LO frequencies,
which introduces fundamental performance challenges.
In this work, we propose a fully scalable radar TRX architecture with an on-chip ×35
frequency multiplier to enable 2.4GHz LO synchronization while overcoming unique
challenges posed by using multiplication factors an order of magnitude higher than
previously demonstrated [1-3]. The conceptual MIMO array is shown in Fig. 18.1.1,
where multiple 4-channel RX chips form a dense array with antennas spaced by half the
wavelength, and multiple 1-channel TX chips form a sparse array. The LO distribution
network is formed by on-board transmission lines and commercial power-divider MMIC.
An external 2.4GHz FMCW chirp feeds the board as the common reference. In the RX
chip, the distributed 2.4GHz chirp goes into an LO generation circuit, where the 2.4GHz
signal is multiplied by 35. Then, the generated signal is split into four, goes into an I/Q
Hybrid, and drives an N-path mixer-first RX [4]. An IF amplifier finally amplifies the
downconverted signal. In the TX chip, the same LO generation circuit multiplies the input
signal by 35. A quadrature mixer, which can act as a phase-shifter, a variable gain
amplifier, a modulator, or an RF switch to increase the system functionality, processes
the LO signal and drives a PA.
A key element of the TRX architecture is the ×35 frequency multiplier. Although frequency
multipliers have been widely used in radars [1-3], a high-factor frequency multiplier
results in fundamentally new challenges related to the phase noise (PN) and harmonic
rejection ratio (HRR) for wideband FMCW radar systems, as shown in Fig. 18.1.2. As a
coherent system, the PN from the common reference is removed after de-chirping, while
the PN from the frequency multiplier, which is uncorrelated, adds to IF noise floor and
decreases the system SNR. Therefore, an extremely low-PN frequency multiplier is
needed. A PLL is thus unsuitable due to its high noise property. On the other hand,
undesired harmonic spurs generated by frequency multipliers become spurs in IF [5]
and limit the system’s SFDR. This problem becomes even worse in a high-factor
frequency multiplier because the closest harmonic falls in-band of RF channels and
cannot be removed by filtering. As a result, we cannot simply cascade frequency
multipliers for a higher multiplication factor. From a system perspective, the achievable
SFDR is equal to twice the HRR in dB scale, which means a 50dBc HRR is required for
a 100dB SFDR. To alleviate the PN and harmonic rejection challenges, in this work, we
propose an injection-locked frequency-multiplier (ILFM)-based high-factor frequency
multiplication with enhanced harmonic rejection.
The LO generation is achieved by cascading a ×7 low-frequency ILFM (LF-ILFM) and a
×5 high-frequency ILFM (HF-ILFM) as shown in Fig. 18.1.2. A single-ended sinusoidal
signal feeds into a pulse generator (PG) and generates harmonic-rich differential pulses,
which contain the desired 7
th
harmonic. The pulses flow into an LF-ILFM and lock the
ILFM at the 7
th
harmonic frequency. Circuit schematics for LO generation are shown in
Fig. 18.1.3. Since the LF-ILFM will be followed by a ×5 HF-ILFM, a 14dB (20logN) HRR
degradation appears, which means a 64dB HRR is required for a 100dB SFDR. Note that
the undesired harmonics from LF-ILFM are spaced by 2.4GHz from the center frequency,
and they will be inside the RF band after HF-ILFM. Therefore, the harmonics must be
suppressed before the HF-ILFM. We adopt two mechanisms to improve the HRR: a duty-
cycle correction (DCC) circuit and an injection-locked buffer (IL-BUF).
First, the DCC circuit adjusts the pulse position after the PG. Because the PG generates
differential pulses, any mismatch in the pulse position may lead to the increase of even
harmonics, which are the closest harmonics (6
th
and 8
th
harmonics) to the desired 7
th
harmonic. By sensing the pulse position through an AND gate and converting it to a
differential square wave by a D-latch, the pulse-position information is within the duty-
cycle of the square wave and can be captured by observing its DC value by a lowpass
filter. The error signal is then used to control the bias of the input buffer to set the
threshold of the inverter and adjust the duty-cycle of the square wave after the input
buffer. Thus, the pulse position is adjusted accordingly and even harmonics can be
further reduced. Second, the IL-BUF acts as a buffer and a filter [6], which is identical to
LF-ILFM. Therefore, the IL-BUF and the LF-ILFM have the same frequency response and
harmonic-filtering property. From the simulation, the IL-BUF can achieve an additional
30dB HRR, and the overall HRR from LF-ILFM plus IL-BUF reaches 65dBc. The schematic
of the LF-ILFM and IL-BUF is shown in Fig. 18.1.3, consisting of a dual-resonance load
to increase the locking range (LR) to 1.4GHz, and a 3-bit switch capacitor array to cover
any PVT variation. The 7
th
harmonic then goes to a ×5 HF-ILFM.
A current chopper [6] is adopted as a high-efficiency harmonic generator. As shown in
Fig. 18.1.3, on each side of the injection devices, a differential signal is fed to the stacked
transistors and chops the drain current to generate a harmonic-rich current. The level of
each harmonic can be tuned by changing the bias of the injection transistors. Therefore,
by properly designing the biasing point, we can generate a high-level 35
th
harmonic, and
significantly suppress the 7
th
, 21
st
, and 49
th
harmonics. The generated 35
th
harmonic finally
goes into the HF-ILFM to achieve the ×35 frequency multiplication. Similarly, the HF-
ILFM has a dual-resonance load to increase the LR to around 10GHz. Since the undesired
harmonics from the HF-ILFM are out-of-band, they will be removed by the following RF
stages.
The chips are fabricated in a 40nm CMOS process. The TX chip has a 1.9×0.45mm
2
area,
and the RX chip area is 1.9×1.26mm
2
. The power consumption for the TX and RX chips
is 160mW and 420mW, respectively. Figure 18.1.4 shows the measured LO performance,
and all the spectrums are captured after an external downconversion mixer. The HRR is
55dBc at 81.2GHz, and the output PN curve tracks the reference PN well from 1kHz to
100MHz offset, with -112.4dBc/Hz at 1MHz offset. This proves that the proposed
frequency multiplier generates negligible PN compared to the reference, and it is suitable
for a coherent radar system. The FMCW chirp performance is also measured, and we
can generate an ultra-fast chirp with 1.17GHz/μs chirp-rate and 0.34% maximum
frequency deviation. Note that the maximum chirp-rate is limited by the signal generator.
The maximum achievable chirp bandwidth (BW) is 5.2GHz.
The TX and RX chip performance are shown in Fig. 18.1.5. The TX has 10dBm output
power and covers an 80-to-90GHz band by switching the LF-ILFM bands with more than
6GHz BW in each sub-band. The HRR is above 50dBc from 80.5 to 82.5GHz, and above
45dBc from 80.5 to 86GHz. The RX has a 20dB gain with 8GHz BW, 8.3dB noise figure
(NF), and a wideband return loss. The measured input P
1dB
is -0.7dBm at 20kHz IF (out-
of-band), and -7dBm at 1MHz IF (in-band). The I/Q phase mismatch in the RX, measured
at 1MHz IF, is less than 5 degrees.
Figure 18.1.6 compares the chip performance with prior art. Our chip uses a 2.4GHz LO
synchronization frequency, which is >8× lower than the state-of-the-art, enabling superior
scalability to create large TRX arrays. Meanwhile, we achieve the fastest FMCW chirp
(>3×) with good linearity. Additionally, due to the use of an N-path mixer-first receiver,
our RX shows 6dB better input P
1dB
, comparable NF, and much lower power consumption
than other architectures thereby enabling cost-effective, highly scalable, and high-
performance next generation radar perception systems with improved angular resolution
for ubiquitous autonomous sensing applications.
Acknowledgement:
This work was supported in part by ComSenTer, one of six centers in JUMP, a
Semiconductor Research Corporation (SRC) program sponsored by DARPA. Authors
acknowledge the TSMC University Shuttle program for chip fabrication. Thanks to Prof.
Ali Niknejad and his research group from UC Berkeley, Dr. Lorenzo Iotti from Nokia,
Christophe Erdmann from AMD, Prof. Liam Madden, Prof. Thomas Lee, and Yinuo Xu
from Stanford University for valuable feedback and support on design and testing.
References:
[1] S. Ahmed et al., “Fully Electronic E-band Personnel Imager of 2 m
2
Aperture Based
on a Multistatic Architecture,” IEEE T-MTT, vol. 61, no. 1, pp. 651-657, Jan. 2013.
[2] K. Dandu et al., “High-Performance and Small Form-Factor mm-Wave CMOS Radars
for Automotive and Industrial Sensing in 76-to-81GHz and 57-to-64GHz Bands,” ISSCC,
pp. 40-41, 2021.
[3] Z. Duan et al., “A 76-to-81GHz 2×8 FMCW MIMO Radar Transceiver with Fast Chirp
Generation and Multi-Feed Antenna-in-Package Array,” ISSCC, pp. 228-229, 2021.
[4] L. Iotti et al., “A 12mW 70-to-100GHz Mixer-First Receiver Front-End for mm-Wave
Massive-MIMO Arrays in 28nm CMOS,” ISSCC, pp. 414-415, 2021.
[5] J. Zhang et al., “Effects of Reference Frequency Harmonic Spurs in FMCW Radar
Systems,” IEEE Radar Conference, 2021.
978-1-6654-9016-0/23/$31.00 ©2023 IEEE
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