LP2980-N
SNOS733O –APRIL 2000–REVISED JUNE 2015
www.ti.com
Table of Contents
7.4 Device Functional Modes........................................ 12
1 Features.................................................................. 1
8 Application and Implementation ........................ 13
2 Applications ........................................................... 1
8.1 Application Information............................................ 13
3 Description ............................................................. 1
8.2 Typical Application ................................................. 13
4 Revision History..................................................... 2
9 Power Supply Recommendations...................... 20
5 Pin Configuration and Functions......................... 3
10 Layout................................................................... 20
6 Specifications......................................................... 3
10.1 Layout Guidelines ................................................. 20
6.1 Absolute Maximum Ratings ...................................... 3
10.2 Layout Example .................................................... 20
6.2 ESD Ratings.............................................................. 4
11 Device and Documentation Support ................. 21
6.3 Recommended Operating Conditions....................... 4
11.1 Device Support...................................................... 21
6.4 Thermal Information.................................................. 4
11.2 Community Resources.......................................... 21
6.5 Electrical Characteristics........................................... 4
11.3 Trademarks........................................................... 21
6.6 Typical Characteristics.............................................. 6
11.4 Electrostatic Discharge Caution............................ 21
7 Detailed Description............................................ 11
11.5 Glossary................................................................ 21
7.1 Overview ................................................................. 11
12 Mechanical, Packaging, and Orderable
7.2 Functional Block Diagram ....................................... 11
Information ........................................................... 21
7.3 Feature Description................................................. 11
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision N (December 2014) to Revision O Page
• Changed pin names VOUT to OUT and VIN to IN per TI nomenclature; correct typos ....................................................... 1
• Changed format of ESD Ratings table .................................................................................................................................. 4
• Changed "1" to "0.5"............................................................................................................................................................. 11
• Changed Vin to IN (name of pin).......................................................................................................................................... 13
• Changed Vin to IN (name of pin).......................................................................................................................................... 16
• Deleted (the TO-220 package alone will safely dissipate this) - no TO-220 package for this part ...................................... 18
Changes from Revision M (April 2013) to Revision N Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section; add updated
Thermal Information .............................................................................................................................................................. 1
Changes from Revision L (April 2013) to Revision M Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 19
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