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PREFACE
Microsystems packaging is a $125 billion worldwide market, employing more than a
million people. If one were to include all the microsystem devices in end products, the
market is even bigger, accounting for more than $300 billion; yet, microsystems pack-
aging is not considered an academic subject. A typical academic subject such as micro-
electronics or VLSI has extensive courses, educational tracks, fundamental books,
software tools, and hands-on facilities. None of these exist in microsystems packaging.
The number of universities offering research programs and one or more courses, however,
is increasing rapidly. It is estimated that this number in the United States, Europe and
the Far East is about 50, having grown from less than ten universities about 10 years
ago.
The Fundamentals of Microsystems Packaging is the first fundamental textbook written
to meet the academic needs, at undergraduate and graduate levels, for this burgeoning
technology. While there have been many books since my first modern book entitled
Microelectronics Packaging Handbook, most, if not all, are considered reference books.
They typically deal with one or more topics in a review fashion. However, microsystems
packaging is not a narrow subject. The topic spans integrated circuit packaging to system
board packaging, package assembly, and all the variations in between. It also deals with
electrical design, thermomechanical design, cooling, materials and their processes, reli-
ability, and so on. This was the case 10–20 years ago when I wrote the first book. Today’s
systems are more than microelectronics.
This book defines ‘‘microsystems’’ to include microelectronics, photonics, RF, and
MEMS. All these devices need to be packaged, however, until they are systems at that
level. Systems need to provide such functions as digital, optical, RF, analog and MEMS.
This is exactly what this book is all about. It deals with all these technologies at the
fundamental level—defining each, illustrating the key concepts in each, and introducing
the critical nomenclature in a systematic fashion. Each topical chapter includes funda-
mental equations, homework problems, and future trends.
I am grateful to all the 50 global authors from industry and academia. This is perhaps
the first book ever written by so many authors; although, I hope it reads as if written by
one. I am thankful to the PRC staff, particularly to Nancy Trent who headed the book
project from start to finish, to Angie Hughes (PRC), and to Mahesh Varadarajan from
the Indian Institute of Science. They have put in endless hours coordinating with all of
the 50 authors from around the world.
I am also grateful to Steve Chapman, the Executive Editor of McGraw-Hill, who met
every one of my demands, including the two colors and the very affordable low cost for
such a book that goes from wafers to systems and all the adjoining complementary
technologies. I thank my wife, Anne, for her patience and full support during the course
of the book.
My final thanks are to NSF for granting their national ERC to us at Georgia Tech and
for challenging us with a need for this book.
Prof. Rao R. Tummala
Georgia Institute of Technology
Atlanta
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