SmartSens
TM
SC132GS 数据手册
V1.9
2019.5.9
Company Confidential
SC132GS 数据手册
Copyright © 2019 SmartSens Technology Co., Ltd.
2
SC132GS 数据手册 V1.9 2019.5.9
应用
机器视觉
条码扫描
汽车电子
安防监控系统
高速摄影系统
特性
全局曝光
高光敏度
支持高动态输出
高信噪比
850 nm/940 nm 近红外增强
支持外部控制曝光及多 sensor 同步
自动曝光/增益控制,支持小于一行曝光
支持 LED STROBE
水平/垂直窗口调整
28x 模拟增益,32x 数字增益
I
2
C 接口寄存器编程
低功耗
内置温度传感器
关键指标(典型值)
分辨率: 130 万
有效像素阵列:1080H x 1280V
像素尺寸:2.7 μm x 2.7 μm BSI
镜头光学尺寸:1/4”
最大图像传输速率:
Non-HDR
1080H x 1280V@10bit 120fps
HDR
1080H x 1280V@10bit < 60fps (HDRC on)
1080H x 1280V@10bit 120fps (HDRC off)
输出接口:
12/10/8-bit 4lane MIPI
12/10/8-bit 4lane LVDS
输出格式:RAW/MONO
CRA:25°
灵敏度:7000 mV/lux·s
满阱电荷:9000e-
动态范围:
普通模式:66 dB
HDR 模式:>100 dB
信噪比:40 dB
工作温度范围:-40ºC ~ +85ºC
最佳工作温度范围:-20ºC ~ +60ºC
电源电压(to PAD):
AVDD = 2.5V±0.1V
DVDD = 1.2V±0.06V
DOVDD = 1.8V±0.1V
封装信息:
COB/Fan-out
Company Confidential
SC132GS 数据手册
Copyright © 2019 SmartSens Technology Co., Ltd.
3
SC132GS 数据手册 V1.9 2019.5.9
目录
目录 ................................................................................................................................................... 3
图片索引 ........................................................................................................................................... 5
表格索引 ........................................................................................................................................... 6
1. 芯片简述 ................................................................................................................................... 7
1.1. 芯片概述 ................................................................................................................................. 7
1.2. 系统框架 ................................................................................................................................. 7
1.3. 芯片初始化 ............................................................................................................................. 8
1.3.1.
上电时序
......................................................................................................................... 8
1.3.2. I/O
引脚上电状态
........................................................................................................... 8
1.3.3.
睡眠模式
......................................................................................................................... 8
1.3.4.
复位模式
......................................................................................................................... 9
1.4. 配置接口 ................................................................................................................................. 9
1.5. Sensor ID ................................................................................................................................ 11
1.6. 数据接口 ............................................................................................................................... 11
1.6.1. MIPI ............................................................................................................................... 11
1.6.2. LVDS ............................................................................................................................... 15
1.7. 锁相环 ................................................................................................................................... 17
2. 功能介绍 ................................................................................................................................. 18
2.1. LED STROBE ............................................................................................................................ 18
2.2. 外触发全局曝光模式 ........................................................................................................... 18
2.3. 高动态模式 ........................................................................................................................... 20
2.4. AEC/AGC ................................................................................................................................. 22
2.4.1. AEC/AGC
的控制策略
.................................................................................................... 22
2.4.2. AEC
控制寄存器说明
.................................................................................................... 22
2.4.3. AGC
控制寄存器说明
................................................................................................... 23
2.5. GROUP_HOLD ........................................................................................................................ 28
2.6. HDR Calibration ...................................................................................................................... 29
2.7. TEMP SENSOR ........................................................................................................................ 29
2.8. 视频输出模式 ....................................................................................................................... 30
2.8.1.
读取顺序
....................................................................................................................... 30
2.8.2.
输出窗口
....................................................................................................................... 31
2.9. 帧率计算 ............................................................................................................................... 31
2.10. 测试模式 ............................................................................................................................... 32
3. 电气特性 ................................................................................................................................. 33
4. 光学特性 ................................................................................................................................. 35
5. 封装信息 ................................................................................................................................. 36
5.1. COB 封装 ............................................................................................................................... 36
5.2. Fan-out 封装 ......................................................................................................................... 39
5.2.1.
芯片封装信息
............................................................................................................... 39
Company Confidential
SC132GS 数据手册
Copyright © 2019 SmartSens Technology Co., Ltd.
4
SC132GS 数据手册 V1.9 2019.5.9
5.2.2.
芯片引脚信息
............................................................................................................... 41
6. 版本变更记录 .......................................................................................................................... 44
Company Confidential
SC132GS 数据手册
Copyright © 2019 SmartSens Technology Co., Ltd.
5
SC132GS 数据手册 V1.9 2019.5.9
图片索引
图 1-1 SC132GS 结构图 ........................................................................................................... 7
图 1-2 上电时序图 .................................................................................................................. 8
图 1-3 I
2
C 接口时序 ............................................................................................................... 10
图 1-4 MIPI 时序示意图 ........................................................................................................ 11
图 1-5 MIPI 底层数据包示意图 ............................................................................................ 12
图 1-6 MIPI 长/短数据包结构示意图 ................................................................................... 12
图 1-7 MIPI 1/2/4 Lane 模式数据包传输示意图 .................................................................. 13
图 1-8 MIPI 数据包 DI 结构 ................................................................................................... 13
图 1-9 LVDS 1 个 lane 数据结构示意图(以 10-bit 为例) ................................................ 15
图 1-10 PLL 控制示意图 ........................................................................................................ 17
图 2-1 外部触发全局模式时序图......................................................................................... 18
图 2-2 HDR 功能说明 ............................................................................................................ 20
图 2-3 HDR 功能控制 ............................................................................................................ 21
图 2-4 像素阵列图一 ............................................................................................................ 30
图 2-5 镜像和倒置实例 ........................................................................................................ 30
图 2-6 测试模式 .................................................................................................................... 32
图 4-1 QE Curve...................................................................................................................... 35
图 5-1 pad 脚位图 ................................................................................................................. 36
图 5-2 封装示意图 ............................................................................................................... 39
图 5-3 引脚图 ....................................................................................................................... 43
- 1
- 2
前往页