On-The-Go Supplement to the
USB 2.0 Specification
Revision 1.3
December 5, 2006
On-The-Go Supplement to the USB 2.0 Specification December 5, 2006
Revision 1.3
ii
Revision History
Revision Issue Date Comment
0.7 11/07/2000 initial draft
1.0 12/18/01
first release
1.0a June 24, 2003 Add definition of “OTG Device”, clarify short versus long debounce,
Update contributor list, set copyright information, and apply minor
editorial changes to all sections
1.2 April 4, 2006 Reformat all sections. Clarify sections 3.3, 5.1.1 and 6.9.1.1. Add
section 5.3.12. Skip version 1.1 to eliminate ongoing confusion with
rev 1.1 of the USB core specification. Replace “DRD” and “Dual Role
Device” with “OTG and “On-The-Go Device”. Clarify SRP and HNP
usage in section 5.3.1 and 6.1, respectively. Add section 6.6.6.1 HS
Electrical Test Mode Support – text from Embedded HSET
document. Delete classes from TPL.
1.3 December 5, 2006 Refer to the USB 2.0 specification and the Micro-USB supplement for
all connector and cable assembly information and replace mini-
connector references with micro-connector references
Universal Serial Bus Specification Supplement
Copyright © 2001, 2006 USB Implementers Forum, Inc. (USB-IF).
All rights reserved.
INTELLECTUAL PROPERTY DISCLAIMER
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES WHATSOEVER,
INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR
ANY PARTICULAR PURPOSE. THE AUTHORS OF THIS SPECIFICATION DISCLAIM ALL
LIABILITY, INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS,
RELATING TO USE OR IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. THE
PROVISION OF THIS SPECIFICATION TO YOU DOES NOT PROVIDE YOU WITH ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY
RIGHTS.
All product names are trademarks, registered trademarks, or servicemarks of their respective owners.
On-The-Go Supplement to the USB 2.0 Specification December 5, 2006
Revision 1.3
iii
Contributors
Glen Chandler, Advanced-Connectek (Acon) James Scales, Nokia
Chris Kolb, ARC International Sree Iyer, OnSpec
Maria Pohlman, Aten Peter Yi, Opti
Ray Asbury, Cypress Semiconductor Bill Stanley, Palm
Dave Cobbs, Cypress Semiconductor Geert Knapen, Philips
Kosta Koeman, Cypress Semiconductor Eric Lu, Philips
David Wright, Cypress Semiconductor Chris Schell, Philips (Co-Chair)
Israel Zilberman, Cypress Semiconductor Rik Stopel, Philips
Morten Christiansen, Ericsson Kenneth Tan, Philips
Ed Beeman, Hewlett-Packard Jerome Tjia, Philips
Matt Nieberger, Hewlett-Packard David Wang, Philips
Trung Le, Imation Hilbert Zhang, Philips
Eric Huang, InSilicon/Synopsys (Chair) Keith Gallardo, Qualcomm
Dan Froelich, Intel Corp Terry Remple, Qualcomm (Co-Chair)
Venkat Iyer, Intel Corp Joe Meza, SoftConnex
Richard Lawrence, Intel Corp Dan Harmon, Texas Instruments
Jeff Miller, Intel Corp Jeff Kacines, Texas Instruments
Francesco Liburdi, Lumberg Clarence Lewis, Texas Instruments
Ryan Hashimoto, Maxim Richard Nie, Texas Instruments
Paul E. Berg, MCCI Sue Vining, Texas Instruments
Terry Moore, MCCI Joon Kim, TransDimension
Rob Douglas, Mentor Graphics Hyun Lee, TransDimension
Ian Parr, Mentor Graphics Bill McInerney, TransDimension
Mark Hanson, Microsoft Dave Murray, TransDimension
Akira Aso, Molex Jing Wang, TransDimension
Mark Carlson, Motorola David Wooten, TransDimension
Eric Overtoom, Motorola Zong Liang Wu, TransDimension
Kazumasa Saito, NEC Systems Charles Brill, Tyco Electronics
Esa Harma, Nokia Mark Paxson, USB-IF
Mark Jenkins, Nokia
On-The-Go Supplement to the USB 2.0 Specification December 5, 2006
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On-The-Go Supplement to the USB 2.0 Specification December 5, 2006
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Table of Contents
1.
Introduction................................................................................................................................................1
1.1 General...............................................................................................................................................1
1.2 Objective of the Supplement ..............................................................................................................1
1.3 Intended Audience .............................................................................................................................1
1.4 Related Documents............................................................................................................................1
2. Acronyms and Terms................................................................................................................................2
3. Significant Features ..................................................................................................................................4
3.1 USB 2.0 Specification Compliance ....................................................................................................4
3.2 On-The-Go Device .............................................................................................................................4
3.3 Targeted Peripheral List .....................................................................................................................4
3.4 No Silent Failures ...............................................................................................................................4
3.5 Supplying Current on VBUS...............................................................................................................5
3.6 Session Request Protocol ..................................................................................................................5
3.7 Host Negotiation Protocol...................................................................................................................5
3.8 Connectors, Cable Assemblies, and Cable Adapters ........................................................................5
3.9 Hubs ...................................................................................................................................................5
3.10 Mandated Functionality ......................................................................................................................5
4. Cables and Connectors ............................................................................................................................6
5. Electrical Requirements............................................................................................................................7
5.1 A-Device Electrical Requirements......................................................................................................7
5.1.1 VBUS Output Voltage and Current.......................................................................................7
5.1.2 VBUS Input Impedance ........................................................................................................7
5.1.3 VBUS Rise and Fall Time .....................................................................................................8
5.1.4 VBUS Capacitance ...............................................................................................................9
5.1.5 VBUS Leakage Voltage ........................................................................................................9
5.1.6 Data Line Pull-down Resistance...........................................................................................9
5.1.7 Data Line Pull-up Resistance ...............................................................................................9
5.1.8 Data Line Leakage Voltage ..................................................................................................9
5.1.9 Data Line Discharge Time ..................................................................................................10
5.1.10 VBUS Input Current Without Battery ..................................................................................10
5.2 B-Device Electrical Requirements....................................................................................................10
5.2.1 VBUS Average Input Current .............................................................................................10
5.2.2 VBUS Peak Input Current...................................................................................................11
5.2.3 VBUS Capacitance .............................................................................................................11
5.2.4 Data Line Pull-down Resistance.........................................................................................11
5.2.5 Data Line Pull-up Resistance .............................................................................................11
5.2.6 Data Line Leakage Voltage ................................................................................................11
5.2.7 VBUS Input Current Without Battery ..................................................................................11
5.3 Session Request Protocol ................................................................................................................12
5.3.1 Introduction .........................................................................................................................12
5.3.2 Initial Conditions .................................................................................................................12
5.3.3 Data-line Pulsing.................................................................................................................13
5.3.4 VBUS
Pulsing......................................................................................................................13
5.3.5 B-Device VBUS Pulsing Current ........................................................................................14
5.3.6 A-Device Session Valid ......................................................................................................14
5.3.7 B-Device Session Valid ......................................................................................................14
5.3.8 Duration of SRP..................................................................................................................14
5.3.9 Order of Methods................................................................................................................14
5.3.10 Response Time of A-device ...............................................................................................14
5.3.11 Repetition of SRP ...............................................................................................................15
