/**
@page HiTOP5_STM3210E HiTOP Project Template for STM32F10x High-density devices
@verbatim
******************** (C) COPYRIGHT 2010 STMicroelectronics *******************
* @file readme.txt
* @author MCD Application Team
* @version V3.3.0
* @date 04/16/2010
* @brief This sub-directory contains all the user-modifiable files needed
* to create a new project linked with the STM32F10x Standard Peripherals
* Library and working with HiTOP software toolchain (version 5.32 and later).
******************************************************************************
* THE PRESENT FIRMWARE WHICH IS FOR GUIDANCE ONLY AIMS AT PROVIDING CUSTOMERS
* WITH CODING INFORMATION REGARDING THEIR PRODUCTS IN ORDER FOR THEM TO SAVE TIME.
* AS A RESULT, STMICROELECTRONICS SHALL NOT BE HELD LIABLE FOR ANY DIRECT,
* INDIRECT OR CONSEQUENTIAL DAMAGES WITH RESPECT TO ANY CLAIMS ARISING FROM THE
* CONTENT OF SUCH FIRMWARE AND/OR THE USE MADE BY CUSTOMERS OF THE CODING
* INFORMATION CONTAINED HEREIN IN CONNECTION WITH THEIR PRODUCTS.
******************************************************************************
@endverbatim
@par Directory contents
- Project.htp: A pre-configured project file with the provided library
structure that produces an executable image with HiTOP
- cstart_thumb2.asm: This file initializes the stack pointer and copy initialized
sections from ROM to RAM.
- Objects: This mandatory directory contains the executable images.
- Settings: This directory contains the linker and script files.
- arm_arch.lsl: This file is used to place program code (readonly)
in internal FLASH and data (readwrite, Stack and Heap)
in internal SRAM.
- flash_nor.scr: This file is a HiTOP script allowing the FSMC configuration.
It should be executed before programming the NOR flash of the
STM32 High-density devices.
- link.lnk: This file is the HiTOP linker it invokes the STM32F10x_hd.lsl.
- linkextsram.lnk: This file is the HiTOP linker it invokes the STM32F10x_extsram.lsl.
- linknor.lnk: This file is the HiTOP linker it invokes the STM32F10xnor.lsl.
- reset_appl.scr: This file is a HiTOP script it performs a target reset.
- reset_go_main.scr: This file is a HiTOP script and it sets the Program
Counter at the "main" instruction.
- StartupScript.scr: This file is a HiTOP script and it performs a target
reset before loading The executable image.
- STM32F10x_extsram.lsl: This file used to place program code (readonly) in
internal FLASH and data (readwrite, Stack and Heap)
in external SRAM.
It contains also the vector table of the STM32 high-density
devices.
You can customize this file to your need.
This file is used only with STM32 High-density devices.
- STM32F10x_hd.lsl: This file is used to place program code (readonly)
in internal FLASH and data (readwrite, Stack and Heap)
in internal SRAM.
It contains also the vector table of the STM32
High-Density devices.
You can customize this file to your need.
- STM32F10xnor.lsl: This file used to place program code (readonly) in
external NOR FLASH and data (readwrite, Stack and Heap)
in internal SRAM.
It contains also the vector table of the STM32 high-density
devices.
You can customize this file to your need.
This file is used only with STM32 High-density devices.
@par How to use it ?
- Open the HiTOP toolchain.
- Browse to open the project.htp
- A "Download application" window is displayed, click "cancel".
- Rebuild all files: Project->Rebuild all
- Load project image : Click "ok" in the "Download application" window.
- Run the "RESET_GO_MAIN" script to set the PC at the "main"
- Run program: Debug->Go(F5).
- When using High-density devices, it is mandatory to reset the target before
loading the project into target
- It is recommended to run the reset script ( click on TR button in the toolbar menu)
after loading the project into target.
@note
- Low-density Value line devices are STM32F100xx microcontrollers where the
Flash memory density ranges between 16 and 32 Kbytes.
- Low-density devices are STM32F101xx, STM32F102xx and STM32F103xx
microcontrollers where the Flash memory density ranges between 16 and 32 Kbytes.
- Medium-density Value line devices are STM32F100xx microcontrollers where
the Flash memory density ranges between 64 and 128 Kbytes.
- Medium-density devices are STM32F101xx, STM32F102xx and STM32F103xx
microcontrollers where the Flash memory density ranges between 64 and 128 Kbytes.
- High-density devices are STM32F101xx and STM32F103xx microcontrollers where
the Flash memory density ranges between 256 and 512 Kbytes.
- XL-density devices are STM32F101xx and STM32F103xx microcontrollers where
the Flash memory density ranges between 512 and 1024 Kbytes.
- Connectivity line devices are STM32F105xx and STM32F107xx microcontrollers.
* <h3><center>© COPYRIGHT 2010 STMicroelectronics</center></h3>
*/
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STM32_2.4G.rar_2.4g通信_STM32单片机 (202个子文件)
cstart_thumb2.asm 4KB
cstart_thumb2.asm 4KB
cstart_thumb2.asm 4KB
cstart_thumb2.asm 4KB
cstart_thumb2.asm 4KB
24G无线通信实验.axf 527KB
Project_uvopt.bak 179KB
Project_uvproj.bak 167KB
24G无线通信实验_sct.Bak 479B
Project.cspy.bat 2KB
main.c 12KB
NRF24L01.c 7KB
stm32f10x_it.c 4KB
spi.c 3KB
delay.c 1KB
.cproject 22KB
.cproject 19KB
.cproject 18KB
.cproject 18KB
.cproject 18KB
main.crf 293KB
stm32_eval.crf 289KB
stm32f10x_i2c.crf 282KB
stm32f10x_sdio.crf 280KB
stm32f10x_rcc.crf 275KB
stm32f10x_usart.crf 274KB
stm32f10x_fsmc.crf 274KB
nrf24l01.crf 273KB
stm32f10x_spi.crf 272KB
stm32f10x_gpio.crf 272KB
stm32f10x_dma.crf 271KB
system_stm32f10x.crf 270KB
stm32f10x_exti.crf 269KB
spi.crf 269KB
misc.crf 268KB
delay.crf 268KB
stm32f10x_it.crf 268KB
core_cm3.crf 3KB
stm32_eval.d 2KB
main.d 2KB
stm32f10x_usart.d 2KB
stm32f10x_fsmc.d 2KB
stm32f10x_gpio.d 2KB
stm32f10x_exti.d 2KB
stm32f10x_sdio.d 2KB
stm32f10x_dma.d 2KB
stm32f10x_spi.d 2KB
stm32f10x_i2c.d 2KB
stm32f10x_rcc.d 2KB
system_stm32f10x.d 1KB
stm32f10x_it.d 1KB
nrf24l01.d 1KB
misc.d 1KB
delay.d 1KB
spi.d 1KB
core_cm3.d 132B
startup_stm32f10x_hd.d 128B
Project.dbgdt 5KB
Project_神舟III号.dep 31KB
Project_神舟I号.dep 31KB
Project.dep 18KB
Project.dni 705B
Backup of Project.ewd 95KB
Project.ewd 87KB
Backup of Project.ewp 114KB
Project.ewp 114KB
Project.eww 161B
Patch.exe 20KB
NRF24L01.h 5KB
stm32f10x_conf.h 3KB
stm32f10x_it.h 2KB
spi.h 823B
delay.h 260B
24G无线通信实验.hex 13KB
24G无线通信实验.htm 47KB
Release_Notes_for_STM32F10x_StdPeriph_Template.html 19KB
Project.htp 60KB
Project.htp 53KB
Project.htp 53KB
Project.htp 51KB
Project.htp 51KB
stm32f10x_flash_extsram.icf 1KB
stm32f10x_nor.icf 1KB
stm32f10x_flash.icf 1KB
stm32f10x_ram.icf 1KB
JLinkSettings.ini 285B
Project_STM32100B-EVAL.jlink 205B
STM32100B-EVAL Debug.launch 3KB
STM3210C-EVAL Debug.launch 3KB
STM3210B-EVAL Debug.launch 3KB
STM3210E-EVAL Debug.launch 3KB
STM3210X_XL Debug.launch 3KB
stm32f10x_flash_extsram.ld 7KB
stm32f10x_flash_extsram.ld 5KB
stm32_flash.ld 5KB
stm32_flash.ld 5KB
stm32_flash.ld 5KB
stm32_flash.ld 5KB
stm32_flash.ld 5KB
linkextsram.lnk 89B
共 202 条
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