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Cover
User’s Manual
32
All information contained in these materials, including products and product specifications,
represents information on the product at the time of publication and is subject to change by
Renesas Electronics Corp. without notice. Please review the latest information published by
Renesas Electronics Corp. through various means, including the Renesas Electronics Corp.
website (http://www.renesas.com).
www.renesas.com
Renesas microcontroller
RH850 Family
RH850/F1KH,
RH850/F1KM
User’s Manual: Hardware
Rev.1.30 Sep, 2021
© 2021 Renesas Electronics Corporation. All rights reserved.
Notice
1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products
and application examples. You are fully responsible for the incorporation or any other use of the circuits, software, and information in the design of your
product or system. Renesas Electronics disclaims any and all liability for any losses and damages incurred by you or third parties arising from the use of
these circuits, software, or information.
2. Renesas Electronics hereby expressly disclaims any warranties against and liability for infringement or any other claims involving patents, copyrights, or
other intellectual property rights of third parties, by or arising from the use of Renesas Electronics products or technical information described in this
document, including but not limited to, the product data, drawings, charts, programs, algorithms, and application examples.
3. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or
others.
4. You shall be responsible for determining what licenses are required from any third parties, and obtaining such licenses for the lawful import, export,
manufacture, sales, utilization, distribution or other disposal of any products incorporating Renesas Electronics products, if required.
5. You shall not alter, modify, copy, or reverse engineer any Renesas Electronics product, whether in whole or in part. Renesas Electronics disclaims any
and all liability for any losses or damages incurred by you or third parties arising from such alteration, modification, copying or reverse engineering.
6. Renesas Electronics products are classified according to the following two quality grades: “Standard” and “High Quality”. The intended applications for
each Renesas Electronics product depends on the product’s quality grade, as indicated below.
"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home
electronic appliances; machine tools; personal electronic equipment; industrial robots; etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control (traffic lights); large-scale communication equipment; key
financial terminal systems; safety control equipment; etc.
Unless expressly designated as a high reliability product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas
Electronics document, Renesas Electronics products are not intended or authorized for use in products or systems that may pose a direct threat to
human life or bodily injury (artificial life support devices or systems; surgical implantations; etc.), or may cause serious property damage (space system;
undersea repeaters; nuclear power control systems; aircraft control systems; key plant systems; military equipment; etc.). Renesas Electronics disclaims
any and all liability for any damages or losses incurred by you or any third parties arising from the use of any Renesas Electronics product that is
inconsistent with any Renesas Electronics data sheet, user’s manual or other Renesas Electronics document.
7. No semiconductor product is absolutely secure. Notwithstanding any security measures or features that may be implemented in Renesas Electronics
hardware or software products, Renesas Electronics shall have absolutely no liability arising out of any vulnerability or security breach, including but not
limited to any unauthorized access to or use of a Renesas Electronics product or a system that uses a Renesas Electronics product. RENESAS
ELECTRONICS DOES NOT WARRANT OR GUARANTEE THAT RENESAS ELECTRONICS PRODUCTS, OR ANY SYSTEMS CREATED USING
RENESAS ELECTRONICS PRODUCTS WILL BE INVULNERABLE OR FREE FROM CORRUPTION, ATTACK, VIRUSES, INTERFERENCE,
HACKING, DATA LOSS OR THEFT, OR OTHER SECURITY INTRUSION (“Vulnerability Issues”). RENESAS ELECTRONICS DISCLAIMS ANY AND
ALL RESPONSIBILITY OR LIABILITY ARISING FROM OR RELATED TO ANY VULNERABILITY ISSUES. FURTHERMORE, TO THE EXTENT
PERMITTED BY APPLICABLE LAW, RENESAS ELECTRONICS DISCLAIMS ANY AND ALL WARRANTIES, EXPRESS OR IMPLIED, WITH
RESPECT TO THIS DOCUMENT AND ANY RELATED OR ACCOMPANYING SOFTWARE OR HARDWARE, INCLUDING BUT NOT LIMITED TO THE
IMPLIED WARRANTIES OF MERCHANTABILITY, OR FITNESS FOR A PARTICULAR PURPOSE.
8. When using Renesas Electronics products, refer to the latest product information (data sheets, user’s manuals, application notes, “General Notes for
Handling and Using Semiconductor Devices” in the reliability handbook, etc.), and ensure that usage conditions are within the ranges specified by
Renesas Electronics with respect to maximum ratings, operating power supply voltage range, heat dissipation characteristics, installation, etc. Renesas
Electronics disclaims any and all liability for any malfunctions, failure or accident arising out of the use of Renesas Electronics products outside of such
specified ranges.
9. Although Renesas Electronics endeavors to improve the quality and reliability of Renesas Electronics products, semiconductor products have specific
characteristics, such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Unless designated as a high reliability
product or a product for harsh environments in a Renesas Electronics data sheet or other Renesas Electronics document, Renesas Electronics products
are not subject to radiation resistance design. You are responsible for implementing safety measures to guard against the possibility of bodily injury,
injury or damage caused by fire, and/or danger to the public in the event of a failure or malfunction of Renesas Electronics products, such as safety
design for hardware and software, including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging
degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult and impractical, you are
responsible for evaluating the safety of the final products or systems manufactured by you.
10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas
Electronics product. You are responsible for carefully and sufficiently investigating applicable laws and regulations that regulate the inclusion or use of
controlled substances, including without limitation, the EU RoHS Directive, and using Renesas Electronics products in compliance with all these
applicable laws and regulations. Renesas Electronics disclaims any and all liability for damages or losses occurring as a result of your noncompliance
with applicable laws and regulations.
11. Renesas Electronics products and technologies shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is
prohibited under any applicable domestic or foreign laws or regulations. You shall comply with any applicable export control laws and regulations
promulgated and administered by the governments of any countries asserting jurisdiction over the parties or transactions.
12. It is the responsibility of the buyer or distributor of Renesas Electronics products, or any other party who distributes, disposes of, or otherwise sells or
transfers the product to a third party, to notify such third party in advance of the contents and conditions set forth in this document.
13. This document shall not be reprinted, reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
14. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas
Electronics products.
(Note1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its directly or indirectly controlled
subsidiaries.
(Note2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
(Rev.5.0-1 October 2020)
Corporate Headquarters
Contact information
TOYOSU FORESIA, 3-2-24 Toyosu,
Koto-ku, Tokyo 135-0061, Japan
www.renesas.com
For further information on a product, technology, the most up-to-date
version of a document, or your nearest sales office, please visit:
www.renesas.com/contact/.
Trademarks
Renesas and the Renesas logo are trademarks of Renesas
Electronics Corporation. All trademarks and registered trademarks
are the property of their respective owners.
General Precautions in the Handling of Microprocessing Unit and Microcontroller
Unit Products
The following usage notes are applicable to all Microprocessing unit and Microcontroller unit products from Renesas. For detailed usage notes on the
products covered by this document, refer to the relevant sections of the document as well as any technical updates that have been issued for the products.
1. Precaution against Electrostatic Discharge (ESD)
A strong electrical field, when exposed to a CMOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps
must be taken to stop the generation of static electricity as much as possible, and quickly dissipate it when it occurs. Environmental control must be
adequate. When it is dry, a humidifier should be used. This is recommended to avoid using insulators that can easily build up static electricity.
Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work benches and floors must be grounded. The operator must also be grounded using a wrist strap. Semiconductor devices must not be
touched with bare hands. Similar precautions must be taken for printed circuit boards with mounted semiconductor devices.
2. Processing at power-on
The state of the product is undefined at the time when power is supplied. The states of internal circuits in the LSI are indeterminate and the states of
register settings and pins are undefined at the time when power is supplied. In a finished product where the reset signal is applied to the external reset
pin, the states of pins are not guaranteed from the time when power is supplied until the reset process is completed. In a similar way, the states of pins in
a product that is reset by an on-chip power-on reset function are not guaranteed from the time when power is supplied until the power reaches the level
at which resetting is specified.
3. Input of signal during power-off state
Do not input signals or an I/O pull-up power supply while the device is powered off. The current injection that results from input of such a signal or I/O
pull-up power supply may cause malfunction and the abnormal current that passes in the device at this time may cause degradation of internal elements.
Follow the guideline for input signal during power-off state as described in your product documentation.
4. Handling of unused pins
Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is possible that an internal input level may be generated
due to noise, etc., causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to power supply or GND via a resistor if there is a possibility
that it will be an output pin. All handling related to unused pins must be judged separately for each device and according to related specifications
governing the device.
5. Voltage application waveform at input pin
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between V
IL
(Max.)
and V
IH
(Min.) due to noise, for example, the device may malfunction. Take care to prevent chattering noise from entering the device when the input level
is fixed, and also in the transition period when the input level passes through the area between V
IL
(Max.) and V
IH
(Min.).
6. Prohibition of access to reserved addresses
Access to reserved addresses is prohibited. The reserved addresses are provided for possible future expansion of functions. Do not access these
addresses as the correct operation of the LSI is not guaranteed.
7. Power ON/OFF sequence
In the case of a device that uses different power supplies for the internal operation and external interface, as a rule, switch on the external power supply
after switching on the internal power supply. When switching the power supply off, as a rule, switch off the external power supply and then the internal
power supply. Use of the reverse power on/off sequences may result in the application of an overvoltage to the internal elements of the device, causing
malfunction and degradation of internal elements due to the passage of an abnormal current. The correct power on/off sequence must be judged
separately for each device and according to related specifications governing the device.
How to Use This Manual
1. Purpose and Target Readers
This manual is designed to provide the user with an understanding of the hardware functions and electrical
characteristics of the MCU. It is intended for users designing application systems incorporating the MCU. A
basic knowledge of electric circuits, logical circuits, and MCUs is necessary in order to use this manual.
The manual comprises an overview of the product; descriptions of the CPU, system control functions,
peripheral functions, and electrical characteristics; and usage notes.
Particular attention should be paid to the precautionary notes when using the manual. These notes occur within
the body of the text, at the end of each section, and in the Usage Notes section.
The following documents apply to the RH850/F1KH, RH850/F1KM. Make sure to refer to the latest
versions of these documents. The newest versions of the documents listed may be obtained from the
Renesas Electronics Web site.
Document
Type Description Document Title Document No.
User’s manual
for Hardware
Hardware specifications (pin assignments, memory maps,
peripheral function specifications, electrical characteristics,
timing charts) and operation description
Note: Refer to the application notes for details on using
peripheral functions.
xxx/xx Group
User’s Manual:
Hardware
This User’s manual
User’s manual
for Hardware
Hardware specifications of flash memory programming and
erasure
RH850/F1KH,
RH850/F1KM,
RH850/F1K
Flash Memory
User’s Manual:
Hardware
Interface
R01UH0622EJxxxx
User’s manual
for Hardware
Hardware specifications of intelligent cryptographic
unit/master D(ICUMD)
RH850/F1KH,
RH850/F1KM
ICUMD User's
Manual:
Hardware
R01UH0705EJxxxx
User’s manual
for Software
Description of CPU instruction set
RH850G3KH
User’s Manual:
Software
R01US0165EJxxxx
Application
Note
Information on using peripheral functions and application
examples
Sample programs
Information on writing programs in assembly language and C
Available from Renesas Electronics
Web site.
Renesas
Technical
Update
Product specifications, updates on documents, etc.
How to read this
manual
Conventions
This RH850/F1KH, RH850/F1KM Hardware User’s Manual corresponds to Rev.1.30.
The RH850/F1KM-S2 description relates to a revision level of Rev.1.00.
The xxA section describes the functionality of RH850/F1KH-D8.
The xxB section describes the functionality of RH850/F1KM-S4 and RH850/F1KM-S2.
The xxC section describes the functionality of RH850/F1KM-S1.
The xxAB section describes the functionality of RH850/F1KH-D8, RH850/F1KM-S4 and
RH850/F1KM-S2.
The xxBC section describes the functionality of RH850/F1KM-S4, RH850/F1KM-S2 and
RH850/F1KM-S1.
The xxx section describes the functionality of all related products.
Data significance: Higher digits on the left and lower digits on the right
Active low representation: xxx (overscore over pin or signal name)
Note: Footnote for item marked with Note in the text
Caution: Information requiring particular attention
Remark: Supplementary information
Numeric representation: Binary ... xxxx or xxxx
B
Decimal ... xxxx
Hexadecimal ... xxxx
H
Prefix indicating power of 2 (address space, memory capacity):
K (kilo): 2
10
= 1,024
M (mega): 2
20
= 1,024
2
G (giga): 2
30
= 1,024
3
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