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基于蓝牙无线通信技术接收设备的设计.doc
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基于蓝牙无线通信技术接收设备的设计.doc
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摘 要
蓝牙技术提供低功耗、低成本、安全可靠的无线接入方式,工作在全球通用
的 2.4GHzsIM(工业、科学、医疗)频段,可以使个人数字设备在小范围内真正地
移动起来,建立完善的无线局域网(WAPN)。
本设计详细阐述了射频(Radio Frequency)技术和基带(Baseband)技术,它是蓝
牙技术的基础和核心,正确理解和掌握射频技术和基带技术是应用蓝牙技术的前
提。蓝牙技术研究和开发过程中的重要内容—射频测试完全符合蓝牙的射频技术
规范;基带技术定义了信道控制、分组结构、跳频选择等规范。
基于模块化设计思路,本文完成了 TTB102 蓝牙模块设计、TTB103 蓝牙模
块设计工作。蓝牙模块是将蓝牙芯片及通用外围电路集成到一块电路板,最小化
电路板尺寸,最佳化定制对外接口和封装,并能完成主要的射频电路设计和测试
工作。TTB102 蓝牙模块主要用于蓝牙鼠标和蓝牙 USB 适配器。根据所使用的蓝
牙芯片不同,TTB103 蓝牙模块具有不同用途,当使用 BC2—AUDIO 芯片时用
于蓝牙耳机,当使用 BC3—ROM 芯片时用于蓝牙 USB 适配器。
本设计以 TTB102 蓝牙模块为基础开发了蓝牙无线通信教学实验室,确定实
验系统的硬件运作模型,开发相应的硬件和软件设备,紧密结合通信原理的基本
知识点,定制以蓝牙的射频、基带技术为主要内容的蓝牙无线通信实验项目。
关键词:蓝牙技术;射频技术和基带技术;模块化设计;蓝牙模块;
蓝牙无线通信
![](https://csdnimg.cn/release/download_crawler_static/87945616/bg2.jpg)
Abstract
Operating in 2.4GHz ISM(Industrial, Scientific, Medicine)band, Bluetooth
system supports lower power,lower cost,safe and credible wireless access way. It
makes personal digital devices moveable and creates a perfect Wireless Personal Area
Network(WPAN).
This paper described Radio Frequency technology and Baseband technology
particularly, which were the base and core of Bluetooth system. It was necessary to
grasp the Radio Frequency and Baseband technologies before you can apply
Bluetooth technology all right. Bluetooth RF Test Specification would fully comform
to the Radio Frequency technology,which was a most important process in Bluetooth
research and application. Baseband technology defined channel control, packet format,
hopping selection and so on.
Based on modularization design method, this paper finished TTB102 Bluetooth
module and TTB103 Bluetooth module. Bluetooth module integrated Bluetooth IC
and general outer circuits, minimized the demision of PCB, defined the best module
interface and package, finished main RF circuit and test process.TTB102 Bluetooth
module was designed mainly for Bluetooth mouse and USB dongle.TTB103 module
was used in different application basing on different Bluetooth IC.TTB103 can be
applied in Bluetooth headset using BC2—AUDIO, and be applied in Bluetooth USB
dongle using BC3—ROM.
This paper developed Bluetooth Wireless Communication Teaching Laboratory
basing on TTB102 Bluetooth module. It defined the software and hardware model of
Bluetooth laboratory, developed related software and hardware equipments. What’s
more, it designed the Bluetooth experiment classes taking Bluetooth Radio Frequency
and Baseband technologies as main practice contents and combining entirely with
the basic knowlodges of Communication Theroy.
KEYWORDS : Bluetooth technology, RF Technology and Baseband Technology,
![](https://csdnimg.cn/release/download_crawler_static/87945616/bg3.jpg)
Modularization Design, Bluetooth Module,
Bluetooth Wireless Communication.
![](https://csdnimg.cn/release/download_crawler_static/87945616/bg4.jpg)
目 录
摘 要.........................................................................................................................i
Abstract ..........................................................................................................................ii
第 1 章 绪论................................................................................................................1
1.1 引言..................................................................................................................1
1.2 本论文完成的工作 ........................................................................................................1
第 2 章 蓝牙技术简介..............................................................................................................3
2.1 蓝牙技术标准..................................................................................................3
2.2 蓝牙技术参数..................................................................................................4
2.3 蓝牙网络模式..................................................................................................4
2.3.1 点对点模式.......................................................................................................4
2.3.2 匹克网模式.......................................................................................................5
2.3.3 散射网模式.......................................................................................................5
2.4 蓝牙标准实现方式..........................................................................................5
第 3 章 射频技术和基带技术....................................................................................6
3.1 射频技术..........................................................................................................6
3.1.1 概述.....................................................................................................................6
3.1.2 频带和信道分配..............................................................................................6
3.1.3 发射机特性.......................................................................................................6
3.1.4 接收机特性.......................................................................................................9
3.2 基带技术..........................................................................................................9
3.2.1 蓝牙时钟..........................................................................................................10
3.2.2 蓝牙设备地址 ................................................................................................10
3.2.3 物理信道..........................................................................................................11
3.2.4 跳频选择..........................................................................................................12
3.2.5 逻辑传输..........................................................................................................15
3.2.6 分组...................................................................................................................15
3.2.7 比特流处理.....................................................................................................17
第 4 章 模块设计......................................................................................................19
![](https://csdnimg.cn/release/download_crawler_static/87945616/bg5.jpg)
4.1 模块化设计思路............................................................................................19
4.1.1 总体原则...........................................................................................................19
4.1.2 PCB 工艺因素.................................................................................................19
4.1.3 原理图设计.....................................................................................................25
4.1.4 对外接口定义及封装...................................................................................26
4.1.5 射频信号处理 ................................................................................................27
4.1.6 拼板处理..........................................................................................................28
4.2 CSR 蓝牙芯片 ................................................................................................28
4.2.1 BC01 ..................................................................................................................28
4.2.2 BC2 系列芯片 .................................................................................................29
4.2.3 BC3 系列芯片 .................................................................................................31
4.3 基于 BC2—EXTERNAL 蓝牙模块设计(TTB102) .....................................33
4.3.1 设计目标..........................................................................................................33
4.3.2 对外接口定义及封装...................................................................................33
4.3.3 原理图 ..............................................................................................................33
4.3.4 Bill of Materials (BOM) ................................................................................36
4.3.5 PCB 设计 ..........................................................................................................37
4.3.6 测试...................................................................................................................39
4.3.7 应用举例..........................................................................................................43
总 结......................................................................................................................45
致 谢......................................................................................................................46
参考文献......................................................................................................................47
附录 1 系统电路原理图...........................................................................................48
附录 2 系统电路 PCB 图 .........................................................................................49
附录 3 原器件清单...................................................................................................50
附录 4 参考翻译.......................................................................................................51
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