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DDR3

datasheet

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DDR3L SDRAM

MT41K2G4 – 256 Meg x 4 x 8 banks

MT41K1G8 – 128 Meg x 8 x 8 banks

MT41K512M16 – 64 Meg x 16 x 8 banks

Description

DDR3L (1.35V) SDRAM is a low voltage version of the

DDR3 (1.5V) SDRAM. Refer to a DDR3 (1.5V) SDRAM

data sheet specifications when running in 1.5V com-

patible mode.

Features

•V

= V

DDQ

= 1.35V (1.283–1.45V)

• Backward compatible to V

= V

DDQ

= 1.5V ±0.075V

– Supports DDR3L devices to be backward com-

patible in 1.5V applications

• Differential bidirectional data strobe

•8n-bit prefetch architecture

• Differential clock inputs (CK, CK#)

• 8 internal banks

• Nominal and dynamic on-die termination (ODT)

for data, strobe, and mask signals

• Programmable CAS (READ) latency (CL)

• Programmable posted CAS additive latency (AL)

• Programmable CAS (WRITE) latency (CWL)

• Fixed burst length (BL) of 8 and burst chop (BC) of 4

(via the mode register set [MRS])

• Selectable BC4 or BL8 on-the-fly (OTF)

• Self refresh mode

•T

of 95°C

– 64ms, 8192-cycle refresh up to 85°C

– 32ms, 8192-cycle refresh at >85°C to 95°C

• Self refresh temperature (SRT)

• Automatic self refresh (ASR)

• Write leveling

• Multipurpose register

• Output driver calibration

Options Marking

• Configuration

– 2 Gig x 4 2G4

– 1 Gig x 8 1G8

– 512 Meg x 16 512M16

• FBGA package (Pb-free) – x4, x8

– 78-ball (9mm x 13.2mm) SN

• FBGA package (Pb-free) – x16

– 96-ball (9mm x 14mm) HA

• Timing – cycle time

– 1.25ns @ CL = 11 (DDR3-1600) -125

– 1.07ns @ CL = 13 (DDR3-1866) -107

• Operating temperature

– Commercial (0°C ื T

ื +95°C) None

– Industrial (–40°C ื T

ื +95°C) IT

• Revision :A

Table 1: Key Timing Parameters

Speed Grade Data Rate (MT/s) Target

RCD-

RP-CL

RCD (ns)

RP (ns) CL (ns)

-107

1866 13-13-13 13.91 13.91 13.91

-125 1600 11-11-11 13.75 13.75 13.75

Note:

1. Backward compatible to 1600, CL = 11 (-125).

8Gb: x4, x8, x16 DDR3L SDRAM

Description

09005aef8591dc1f

8Gb_DDR3L.pdf - Rev. D 8/17 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

Contents

State Diagram ................................................................................................................................................ 11

Functional Description ................................................................................................................................... 12

Industrial Temperature ............................................................................................................................... 12

General Notes ............................................................................................................................................ 12

Functional Block Diagrams ............................................................................................................................. 14

Ball Assignments and Descriptions ................................................................................................................. 16

Package Dimensions ....................................................................................................................................... 22

Electrical Specifications .................................................................................................................................. 24

Absolute Ratings ......................................................................................................................................... 24

Input/Output Capacitance .......................................................................................................................... 25

Thermal Characteristics .................................................................................................................................. 26

Electrical Specifications – I

Specifications and Conditions ........................................................................... 27

Electrical Characteristics – 1.35V/1.5V I

Specifications ................................................................................. 38

Electrical Specifications – DC and AC .............................................................................................................. 39

DC Operating Conditions ........................................................................................................................... 39

Input Operating Conditions ........................................................................................................................ 40

DDR3L 1.35V AC Overshoot/Undershoot Specification ................................................................................ 44

DDR3L 1.35V Slew Rate Definitions for Single-Ended Input Signals .............................................................. 47

DDR3L 1.35V Slew Rate Definitions for Differential Input Signals ................................................................. 49

ODT Characteristics ....................................................................................................................................... 50

1.35V ODT Resistors ................................................................................................................................... 51

ODT Sensitivity .......................................................................................................................................... 52

ODT Timing Definitions ............................................................................................................................. 52

Output Driver Impedance ............................................................................................................................... 56

34 Ohm Output Driver Impedance .............................................................................................................. 57

DDR3L 34 Ohm Driver ................................................................................................................................ 58

DDR3L 34 Ohm Output Driver Sensitivity .................................................................................................... 59

DDR3L Alternative 40 Ohm Driver ............................................................................................................... 60

DDR3L 40 Ohm Output Driver Sensitivity .................................................................................................... 60

Output Characteristics and Operating Conditions ............................................................................................ 62

Reference Output Load ............................................................................................................................... 65

Slew Rate Definitions for Single-Ended Output Signals ................................................................................. 65

Slew Rate Definitions for Differential Output Signals .................................................................................... 67

Speed Bin Tables ............................................................................................................................................ 68

Electrical Characteristics and AC Operating Conditions ................................................................................... 72

Command and Address Setup, Hold, and Derating ........................................................................................... 90

Data Setup, Hold, and Derating ....................................................................................................................... 97

Commands – Truth Tables ............................................................................................................................. 105

Commands ................................................................................................................................................... 108

DESELECT ................................................................................................................................................ 108

NO OPERATION ........................................................................................................................................ 108

ZQ CALIBRATION LONG ........................................................................................................................... 108

ZQ CALIBRATION SHORT .......................................................................................................................... 108

ACTIVATE ................................................................................................................................................. 108

READ ........................................................................................................................................................ 108

WRITE ...................................................................................................................................................... 109

PRECHARGE ............................................................................................................................................. 110

REFRESH .................................................................................................................................................. 110

SELF REFRESH .......................................................................................................................................... 111

DLL Disable Mode ..................................................................................................................................... 112

8Gb: x4, x8, x16 DDR3L SDRAM

Description

09005aef8591dc1f

8Gb_DDR3L.pdf - Rev. D 8/17 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Input Clock Frequency Change ...................................................................................................................... 116

Write Leveling ............................................................................................................................................... 118

Write Leveling Procedure ........................................................................................................................... 120

Write Leveling Mode Exit Procedure ........................................................................................................... 122

Initialization ................................................................................................................................................. 123

Voltage Initialization / Change ....................................................................................................................... 125

Voltage Switching ............................................................................................................................... 126

Mode Registers .............................................................................................................................................. 127

Mode Register 0 (MR0) ................................................................................................................................... 128

Burst Length ............................................................................................................................................. 128

Burst Type ................................................................................................................................................. 129

DLL RESET ................................................................................................................................................ 130

Write Recovery .......................................................................................................................................... 130

Precharge Power-Down (Precharge PD) ...................................................................................................... 131

CAS Latency (CL) ....................................................................................................................................... 131

Mode Register 1 (MR1) ................................................................................................................................... 132

DLL Enable/DLL Disable ........................................................................................................................... 132

Output Drive Strength ............................................................................................................................... 133

OUTPUT ENABLE/DISABLE ...................................................................................................................... 133

TDQS Enable ............................................................................................................................................. 133

On-Die Termination .................................................................................................................................. 134

WRITE LEVELING ..................................................................................................................................... 134

POSTED CAS ADDITIVE Latency ................................................................................................................ 134

Mode Register 2 (MR2) ................................................................................................................................... 135

CAS Write Latency (CWL) ........................................................................................................................... 136

AUTO SELF REFRESH (ASR) ....................................................................................................................... 136

SELF REFRESH TEMPERATURE (SRT) ........................................................................................................ 136

SRT vs. ASR ............................................................................................................................................... 137

DYNAMIC ODT ......................................................................................................................................... 137

Mode Register 3 (MR3) ................................................................................................................................... 137

MULTIPURPOSE REGISTER (MPR) ............................................................................................................ 138

MPR Functional Description ...................................................................................................................... 139

MPR Register Address Definitions and Bursting Order ................................................................................. 140

MPR Read Predefined Pattern .................................................................................................................... 145

MODE REGISTER SET (MRS) Command ........................................................................................................ 145

ZQ CALIBRATION Operation ......................................................................................................................... 146

ACTIVATE Operation ..................................................................................................................................... 147

READ Operation ............................................................................................................................................ 149

WRITE Operation .......................................................................................................................................... 160

DQ Input Timing ....................................................................................................................................... 168

PRECHARGE Operation ................................................................................................................................. 170

SELF REFRESH Operation .............................................................................................................................. 170

Extended Temperature Usage ........................................................................................................................ 172

Power-Down Mode ........................................................................................................................................ 173

RESET Operation ...........................................................................................................................................

181

On-Die Termination (ODT) ............................................................................................................................ 183

Functional Representation of ODT ............................................................................................................. 183

Nominal ODT ............................................................................................................................................ 183

Dynamic ODT ............................................................................................................................................... 185

Dynamic ODT Special Use Case ................................................................................................................. 185

Functional Description .............................................................................................................................. 185

Synchronous ODT Mode ................................................................................................................................ 191

8Gb: x4, x8, x16 DDR3L SDRAM

Description

09005aef8591dc1f

8Gb_DDR3L.pdf - Rev. D 8/17 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.