FSL91030M 芯片数据手册 武汉飞思灵微电子技术有限公司
手册版本: G 版权所有©武汉飞思灵微电子技术有限公司 II
8.16 复用管脚 ................................................................................................................................... 33
9 寄存器说明 ......................................................................................................................................... 36
10 接口时序 ............................................................................................................................................ 37
10.1 时序图例 ................................................................................................................................... 37
10.2 DDR3 接口 ............................................................................................................................... 37
10.2.1 写操作时序 ................................................................................................................... 37
10.2.2 读操作时序 ................................................................................................................... 39
10.2.3 时序参数 ...................................................................................................................... 39
10.3 SPI 接口 ................................................................................................................................... 40
10.3.1 接收方向 ...................................................................................................................... 40
10.3.2 发送方向 ...................................................................................................................... 40
10.4 I2C 接口 ................................................................................................................................... 41
10.5 JTAG 接口 ................................................................................................................................ 42
10.6 UART 接口 ............................................................................................................................... 43
10.7 MDIO 接口 ............................................................................................................................... 43
11 电气特性 ............................................................................................................................................ 45
11.1 极限范围 ................................................................................................................................... 45
11.2 建议工作范围 ........................................................................................................................... 45
11.3 振荡器 ...................................................................................................................................... 46
11.4 热特性 ...................................................................................................................................... 47
11.5 DDR3 特性 ............................................................................................................................... 48
11.6 SerDes (SGMII)特性 ................................................................................................................ 48
11.7 LVCMOS 特性 .......................................................................................................................... 52
11.8 上电和重启特性 ........................................................................................................................ 52
12 封装信息 ............................................................................................................................................ 54
12.1 WBBGA676.............................................................................................................................. 54
13 订购信息 ............................................................................................................................................ 55
