USB PD3.0 pps协议规范

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包含 typec接口定义使用方法,usb pd2.0 pd3.0协议详细规范,以及PPS详细协议说明。
Andrea Colognese Davide ghedin Canova tech Nicola scantamburlo Canova tech Yi-Feng lin Canyon Semiconductor Yuhung lin canyon Semiconductor Anup Nayak Cypress semiconductor Jagadeesan Raj Cypress semiconductor Pradeep bajpai Cypress semiconductor Rushi Kadakia Cypress semiconductor Steven Wong Cypress Semiconductor Subu sankaran Cypress semiconductor Sumeet gupta Cypress semiconductor Venkat Mandagulathar Cypress Semiconductor Adolfo montero Dell inc Bruce Montag Dell inc Gary verdun Dell inc Merle wood Dell inc Mohammed hijazi Dell inc Siddhartha redd Dell inc Dan ellis Display link Jason Young Display link Kevin Jacobs Display Link Peter Burgers Displaylink Richard petrie Display Link PD Chair/ device policy lead Abel Astley Ellisys Chuck trefts Enlists Emmanucl durin Ellisys Mario p li Ellisys Tim wei Ellisys Chien-Cheng ruo Etron Technology, Inc. Jack Yang Etron Technology, Inc Richard crisp Etron Technology, Inc. Shanjia Chen Etron Technology Inc TsungTa lu Etron Technology, Inc. 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Dian kurniawan Fresco Logic Inc Adam rodriguez Alec berg Google inc David schneider Google Inc Jim gI Google Inc Juan Fantin google Inc Ken wu Mark Hayter Google Inc Nithya Jagannathan Google Ir Todd broch Vincent palatin Google Inc Mike engebretson Granite river labs Rajaraman v Granite river labs Alan berkema Hewlett Packard Lee atkinson Hewlett packard Rahul lakdawa Hewlett Packard Robin castell Hewlett Packard Roger Benson Hewlett Packard Ron schoole Hewlett Packard Suketu partiwala Hewlett Packard Vaibhay malik Hewlett packard Walter Fry Hewlett Packard Bob dunstan Intel Corporation PD Chair/protocol WG Lead Brad saunders Intel Corporation Chee lim nge Intel Corporation Christine krause Intel Corporation Dan froclich Intel Corporation David harriman Intel corporation David hines Intel Corporation David thompson Intel Corporation Guobin liu Intel Corporation Harry Skinner Intel Corporation Henrik Leegaard Intel Corporation Jervis lin Intel Corporation John howard Intel Corporation Karthi vadivelu Intel Corporation Leo heiland Intel Corporation Maarit harkonen Intel Corporation Nge chee li Intel Corporation Paul durley Intel Corporation Rahman ismail Intel Corporation System Policy Lead Ronald swartz Intel Corporation Sarah Sharp Intel Corporation Page 4 USB Power Delivery Specification Revision 3.0, Version 1.1 Sridharan Ranganathan Intel Corporation Steve me Intel corporati Tim Mckee Intel Corporation PD Chair/Compliance lead Toby opfer man Intel Corporation Intersil c ator Kenta minejima Japan Aviation Electronics Industry Ltd. 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Babu mailachalam Lattice Semiconductor Corp Gianluca mariani Lattice Semiconductor Corp Del coplen Lattice Semiconductor Corp Thomas watza Lattice Semiconductor Corp Vesa lauri Lattice Semiconductor Corp Daniel H Jacobs LeCroy corporation Jake jacobs Lecroy Corporation Kimberley McKay Le croy corporation Mic cheletti Le Croy corporation Roy chestnut LeCroy Corporation Tyler joe Le croy corporation Phil jakes Lenovo Dave Thompson LSI Corporation Alan winningham Luxshare-ICT Daniel chen Luⅹ share-lCT Josue castillo Luxshare-ICT Scott shuey Luxshare-ICT Chris yolum MCCI Corporation Geert Knapen MCCI Corporation Terry moore MCCI Corporation Velmurugan Selvaraj MCCI Corporation Brian Marley Microchip Technology Inc Dave perchlik Microchip Technology Inc Don perkins Microchip Technology Inc John sisto Microchip Technology Inc Josh Averyt Microchip Technology Inc Kiet tran Microchip technology Inc Mark bohm Microchip Technology In Matthew kalibat Microchip Technology Inc Mick davis Microchip technology Inc Rich Wahler Microchip Technology Inc Ronald kunin Microchip technology nc Shannon cash Microchip Technology Inc Anthony Chen Microsoft Corporation USB Power Delivery Specification Revision 3.0, Version 1.1 Page 5 Dave perchlik Microsoft Corporation David voth Microsoft corporation Geoff shew Microsoft corporation lawson Kastens Microsoft Corporation Kai inh Microsoft Corporation Marwan Kadado Microsoft Corporation Michelle bergeron Microsoft Corporation Rahul ramadas Microsoft Corporation Randy aull Microsoft corporation lIu Ng i Timo toivola Microsoft Corporation Toby nixon Microsoft Corporation Vivek Gupta Microsoft corporation Yang you Microsoft corporation Dan wa Motorola mobility Ir Ben crowe MQP Electr Ltd Pat crowe MQP Electronics Ltd Sten carlsen MQP Electronics Ltd Frank borngraber Nokia corporation Kai inha Nokia corporation Pekka leinonen Nokia Corporation Richard petrie Nokia Corporation PD Vice-Chair/Device Policy Lead Sten carlsen Nokia Corporation Physical Laycr WG Lcad Abhijeet Kulkarni NXP Semiconductors Ahmad yazdi NXP Semiconductors Bart vertentes NXP Semiconductors N ong nguyen NXP Semiconductors Guru prasad NXP Semiconductors Ken jaramillo NXP Semiconductors Krishnan tN NXP Semiconductors Michael Joehren NXP Semiconductors robert de nie NXP Semiconductors Rod Whitby NXP Semiconductors Vijendra Kuroodi NXP Semiconductors Robert heaton Obsidian Technology Bryan McCoy ON Semiconductor Christian Klein ON Semiconductor Cor voorwinden ON Semiconductor Edward berrios ON Semiconductor Power Supply WG lead Oscar freitas ON Semiconductor Tom duffy ON Semiconductor Craig Wiley Parade Technologies Inc Aditya Kulkarni Power Integrations Rahul joshi Power Integrations Page 6 USB Power Delivery Specification Revision 3.0, Version 1.1 Ricardo pregite Por Chris Sporck Qualcomm, Inc. Craig Aike Quale George paparrizos Qualcomm, In Gio Qualcomm, In James goal Qualcomm, Inc Joshua Warner Qualcomm, Inc Narendra mehta Qualcomm, Inc Terry remple Qu alcomm in Will Ky Qual Yoram rimoni Qualcomm, Inc Atsushi mitamura Renesas Electronics Corp Bob dunstan Renesas Electronics Corp Dan aoki Renesas Electronics Corp Kiichi muto Renesas electronics c Masami Katagi Renesas electronics cor Nobuo furuya Renesas Electronics Corp Patrick Yu Renesas Electronics Corp Peter Teng Renesas electronics Corp Philip leung Renesas Electronics Corp Steve roux Renesas Electronics Corp Tetsu sato Renesas Electronics Corp Toshifumi Yamaoka Renesas Electronics Corp Chunan kuo Richtek Technology Corporation Heinz wei Richtek Technology Corporation Tatsuya Irisawa Ricoh Company Ltd Akihiro ono Rohm co, ltd Chris lir Rohm co, ltd Hidenori nishimoto Rohm co ltd Kris bahar Rohm co, ltd Manabu miyata Rohm co, ltd Ruben balbuena Rohm co, ltd Takashi sato Rohm co, ltd Vijendra Kuroodi Rohm co ltd Yu Rohm co, ltd Matti kulmala Salcomp plc Toni lehimo Salcomp plc Tong kin Samsung Electronics Co Ltd Alvin cox Seagate Technology LLC Cab Con wg lead John hein Seagate Technology LLC Marc noblitt Seagate Technology llc Ronald rueckert ate Technology llc Tony Priborsky Seagate Technology LLC Chin chang Semtech Corporation USB Power Delivery Specification Revision 3.0, Version 1.1 Page 7 Kafai Leung Silicon laboratories. Inc Abhishek Sardeshpande SiliConch Systems Private Limited Jaswant ammine SiliConch Systems Private Limited Kaustubh kumar SiliConch Systems Private Limited Pavitra balasubramanian SiliConch Systems Private Limited Rakesh polasa SiliConch Systems Private Limited Vishnu pusuluri Sili Conch Systems Private Limited John sisto SMSC Ken gay SMSC Mark bohm SMSC Richard Wahler SMSC Shannon cash SMSC Tim Knowlton SMSC William chiechi SMSC Bob dunstan Fabien friess ST-Ericsson Giuseppe platania ST-Ericsson Jean-Francois gatto ST-Ericssor Milan stamenkovic ST-Ericsson Nicolas florenchie ST-Ericsson Patrizia milazzo ST-Ericsson Christophe lorin ST-Microelectronics John Bloomfield ST-Microelectronics Massimo panzica ST-Microelectronics Meriem mersel ST-Microelectronics Nathalie ballot ST-Microelectronics Pascal legrand ST-Microelectronics Patrizia milazzo ST-Microclectronics Richard oconnor ST-Microelectronics Zongyao Wen Synopsys, InC. Joan marrinan Tektronix Kimberley mck Teledyne-LeCroy Matthew dunn Teledyne-LeCl Tony Winchell Teledyne-Lecroy Anand dabak Texas Instruments Bill waters Texas Instruments Bing lu Texas Instruments Deric Waters Texas instruments Physical Layer WG Lead Grant Ley Texas Instruments Ingolf frank Texas instruments Ivo Huber Texas Instruments Javed Ahmad Texas instruments Jean picard Texas Instruments Martin patoka Texas Instruments Page 8 USB Power Delivery Specification Revision 3.0, Version 1.1 Mike Campbell Texas Instruments Scott Jackson Texas instruments Srinath hos T Steven tom Texas instruments Chris yokum Total phase Brad cox Ventev mobil Colin vose Ventey mobile Dydron lin VIA Technologies Inc Fong-Jim Wang VIA Technol ly Tseng VIA Technologies inc Rcx Ch VIA Technologics. in Terrance shih VIA Technologies, Inc Jeng Cheng Weltrend semiconductor Wayne lo Weltrend semiconductor Charles neumann Western Digital Technologies, Inc. Curtis stevens Western Digital Technologies, Inc. John maroney Western Digital Technologies, Inc USB Power Delivery Specification Revision 3.0, Version 1.1 Page 9 Revision History Revision Version Comments Issue date 1.0 1.0 Initial release revision 1.0 5July,2012 1.0 1.1 Including errata through 31-October-2012 31 October 2012 1.0 1.2 Including errata through 26-June-2013 26june,2013 1.0 1.3 Including errata through 11-March-2014 11 March 2014 2.0 1.0 Initial release revision 2.0 11 August 2014 2.0 1.1 Including errata through 7-May 2015 7May2015 2.0 1.2 Including errata through 25-March-2016 25 March 2016 2.0 1.3 Including errata through 11-January-2017 11 January 2017 3.0 1.0 Initial release revision 3.0 1 1 December 2015 3.0 1.0a Including errata through 25-March-2016 25 March 2016 3.0 1.1 Including errata through 12-January- 2016 12 January 2017 Page 10 USB Power Delivery Specification Revision 3.0, Version 1.1

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