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tms320f28335 dsp中文数据手册
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高性能的静态CMOS技术，指令周期为6．67 ns，主频达150 MHz； 高性能的32位CPU，单精度浮点运算单元(FPU)，采用哈佛流水线结构，能够快速执行中断响应，并具有统一的内存管理模式，可用C／C++语言实现复杂的数学算法；
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TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
数数字字信信号号控控制制器器 (DSC)
Data Manual
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Literature Number: ZHCS889M
June 2007–Revised August 2012
TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
www.ti.com.cn
ZHCS889M –JUNE 2007–REVISED AUGUST 2012
内内容容
1 TMS320F2833x，，TMS320F2823x DSC .................................................................................. 10
1.1 特性 ......................................................................................................................... 10
1.2 开始使用 .................................................................................................................... 11
2 简简介介 .................................................................................................................................. 12
2.1 引脚分配 .................................................................................................................... 14
2.2 信号说明 .................................................................................................................... 23
3 功功能能概概述述 ............................................................................................................................ 33
3.1 内存映射 .................................................................................................................... 34
3.2 简要说明 .................................................................................................................... 41
3.2.1 C28x CPU ....................................................................................................... 41
3.2.2 内存总线（哈弗总线架构） .................................................................................... 41
3.2.3 外设总线 ......................................................................................................... 41
3.2.4 实时 JTAG 和分析 .............................................................................................. 42
3.2.5 外部接口(XINTF) ................................................................................................ 42
3.2.6 闪存 ............................................................................................................... 42
3.2.7 M0，M1 SARAM ............................................................................................... 42
3.2.8 L0, L1, L2, L3, L4, L5, L6, L7SARAM ........................................................................ 43
3.2.9 引导 ROM ........................................................................................................ 43
3.2.9.1 引导加载器使用的外设引脚 ....................................................................... 44
3.2.10 安全性 ............................................................................................................ 44
3.2.11 外设中断扩展 (PIE) 块 ......................................................................................... 46
3.2.12 外部中断 (XINT1-XINT7，XNMI) ............................................................................. 46
3.2.13 振荡器和锁相环 (PLL) .......................................................................................... 46
3.2.14 安全装置 ......................................................................................................... 46
3.2.15 外设时钟 ......................................................................................................... 46
3.2.16 低功率模式 ....................................................................................................... 46
3.2.17 外设帧 0，1，2，3 (PFn) ...................................................................................... 47
3.2.18 通用输入/输出 (GPIO) 复用器 ................................................................................. 47
3.2.19 32 位 CPU 定时器 (0，1，2) .................................................................................. 47
3.2.20 控制外设 ......................................................................................................... 48
3.2.21 串行端口外设 .................................................................................................... 48
3.3 寄存器映射 ................................................................................................................. 49
3.4 器件仿真寄存器 ............................................................................................................ 51
3.5 中断 .......................................................................................................................... 52
3.5.1 外部中断 ......................................................................................................... 56
3.6 系统控制 .................................................................................................................... 57
3.6.1 OSC 和 PLL 块 .................................................................................................. 58
3.6.1.1 外部基准振荡器时钟选项 .......................................................................... 59
3.6.1.2 基于 PLL 的时钟模块 .............................................................................. 60
3.6.1.3 输入时钟损失 ....................................................................................... 61
3.6.2 安全装置块 ....................................................................................................... 62
3.7 低功率模式块 ............................................................................................................... 63
4 外外设设 .................................................................................................................................. 64
4.1 DMA 概述 ................................................................................................................... 64
4.2 32 位 CPU 定时器 0，CPU 定时器 1，CPU 定时器 2 ............................................................... 66
4.3 增强型 PWM 模块 ......................................................................................................... 68
4.4 高分辨率 PWM (HRPWM) ................................................................................................ 72
4.5 增强型 CAP 模块 .......................................................................................................... 73
4.6 增强型 QEP 模块 .......................................................................................................... 75
4.7 模数转换器 (ADC) 模块 ................................................................................................... 77
4.7.1 如果 ADC 未被使用，ADC 连接 .............................................................................. 81
2
内容
版权 © 2007–2012, Texas Instruments Incorporated
TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
www.ti.com.cn
ZHCS889M –JUNE 2007–REVISED AUGUST 2012
4.7.2 ADC 寄存器 ..................................................................................................... 82
4.7.3 ADC 校准 ........................................................................................................ 83
4.8 多通道缓冲串行端口 (McBSP) 模块 ..................................................................................... 83
4.9 增强型控制器局域网 (eCAN) 模块（eCAN-A 和 eCAN-B） ......................................................... 86
4.10 串行通信接口 (SCI) 模块 (SCI-A，SCI-B，SCI-C) .................................................................... 91
4.11 串行外设接口 (SPI) 模块 (SPI-A) ........................................................................................ 95
4.12 内部集成电路 (I2C) ........................................................................................................ 98
4.13 GPIO MUX ................................................................................................................. 99
4.14 外部接口 (XINTF) ........................................................................................................ 106
5 器器件件支支持持 .......................................................................................................................... 108
5.1 器件和开发支持工具命名规则 .......................................................................................... 108
5.2 文档支持 ................................................................................................................... 110
5.3 社区资源 ................................................................................................................... 115
6 电电气气规规范范 .......................................................................................................................... 116
6.1 最大绝对额定值 .......................................................................................................... 116
6.2 建议的运行条件 .......................................................................................................... 117
6.3 电气特性 ................................................................................................................... 117
6.4 流耗 ........................................................................................................................ 118
6.4.1 减少流耗 ........................................................................................................ 120
6.4.2 流耗图 .......................................................................................................... 121
6.4.3 散热设计考虑 .................................................................................................. 122
6.5 在没有针对DSP的信号缓冲的情况下，仿真器连接 .................................................................. 123
6.6 时序参数符号安排 ........................................................................................................ 124
6.6.1 定时参数的通用注释 .......................................................................................... 124
6.6.2 测试负载电路 .................................................................................................. 124
6.6.3 器件时钟表 ..................................................................................................... 125
6.7 时钟要求和特性 .......................................................................................................... 126
6.8 电源排序 ................................................................................................................... 127
6.8.1 电源管理和监控电路解决方案 ................................................................................ 128
6.9 通用输入/输出 (GPIO) ................................................................................................... 131
6.9.1 GPIO - 输出时序 ............................................................................................... 131
6.9.2 GPIO - 输入时序 ............................................................................................... 132
6.9.3 针对输入信号的采样窗口宽度 ................................................................................ 133
6.9.4 低功耗模式唤醒时序 .......................................................................................... 134
6.10 增强型控制外设 ........................................................................................................... 138
6.10.1 增强型脉宽调制器 (ePWM) 时序 ............................................................................ 138
6.10.2 触发区输入时序 ................................................................................................ 138
6.10.3 高分辨率 PWM 时序 .......................................................................................... 139
6.10.4 增强型捕捉 (eCAP) 时序 ..................................................................................... 139
6.10.5 增强型正交编码器脉冲 (eQEP) 时序 ........................................................................ 140
6.10.6 ADC 转换开始时序 ............................................................................................ 141
6.11 外部中断时序 ............................................................................................................. 141
6.12 I2C 电气特性和时序 ..................................................................................................... 142
6.13 串行外设接口 (SPI) 模块 ................................................................................................ 142
6.13.1 主模式时序 ..................................................................................................... 142
6.13.2 SPI 受控模式时序 ............................................................................................. 147
6.14 外部接口 (XINTF) 时序 .................................................................................................. 151
6.14.1 USEREADY = 0 ............................................................................................... 151
6.14.2 同步模式 (USEREADY=1，READYMODE=0) ............................................................ 152
6.14.3 异步模式 (USEREADY=1，READYMODE=1) ............................................................ 153
6.14.4 XINTF 信号与 XCLKOUT 一致 .............................................................................. 155
6.14.5 外部接口读取时序 ............................................................................................. 156
6.14.6 外部接口写入时序 ............................................................................................. 158
版权 © 2007–2012, Texas Instruments Incorporated
内容
3
TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
ZHCS889M –JUNE 2007–REVISED AUGUST 2012
www.ti.com.cn
6.14.7 带有一个外部等待状态的外部接口读取准备就绪时序 ..................................................... 160
6.14.8 带有一个外部等待状态的外部接口写入准备就绪时序 ..................................................... 163
6.14.9 XHOLD和XHOLDA定时 ...................................................................................... 166
6.15 片载模数转换器 ........................................................................................................... 169
6.15.1 ADC 加电控制位时序 ......................................................................................... 170
6.15.2 定义 ............................................................................................................. 171
6.15.3 顺序采样模式（单通道） (SMODE = 0) .................................................................... 172
6.15.4 同步采样模式（双通道）(SMODE=1) ...................................................................... 173
6.15.5 详细说明 ........................................................................................................ 174
6.16 多通道缓冲串行端口 (McBSP) 模块 ................................................................................... 175
6.16.1 McBSP 发送和接收时序 ...................................................................................... 175
6.16.2 McBSP 作为 SPI 主控或者受控时序 ........................................................................ 178
6.17 闪存定时 ................................................................................................................... 182
6.18 F2833x 器件和 F2823x 器件之间的迁移 .............................................................................. 184
7 L-到到-M 的的修修订订历历史史记记录录 ....................................................................................................... 185
8 K-到到-L 修修订订历历史史记记录录 .......................................................................................................... 186
9 散散热热和和机机械械数数据据 ................................................................................................................. 187
4
内容
版权 © 2007–2012, Texas Instruments Incorporated
TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
www.ti.com.cn
ZHCS889M –JUNE 2007–REVISED AUGUST 2012
图图片片列列表表
2-1 F2833x，F2823x 176 引脚 PGF/PTP 薄型四方扁平封装 (LQFP)（顶视图）............................................ 14
2-2 F2833x，F2823x 179 焊球 ZHH MicroStar BGA™ （左上象限）（底视图） ........................................... 16
2-3 F2833x，F2823x 179 焊球 ZHH MicroStar BGA™ （右上象限）（底视图） ........................................... 17
2-4 F2833x, F2823x 179 焊球 ZHH MicroStar BGA™ （左下象限）（底视图） ............................................ 18
2-5 F2833x，F2823x 179 焊球 ZHH MicroStar BGA ™（右下象限）（底视图） ........................................... 19
2-6 F2833x，F2823x 176 焊球 ZJZ 塑料 BGA （左上象限）（底视图） ..................................................... 20
2-7 F2833x，F2823x 176 焊球 ZJZ 塑料 BGA （右上象限）（底视图） ..................................................... 21
2-8 F2833x，F2823x 176 焊球 ZJZ 塑料 BGA （左下象限）（底视图） ..................................................... 22
2-9 F2833x，F2823x 176 焊球 ZJZ 塑料 BGA （右上象限）（底视图） ..................................................... 22
3-1 功能方框图 ....................................................................................................................... 34
3-2 F28335，F28235 内存映射 .................................................................................................... 36
3-3 F28334，F28234 内存映射 .................................................................................................... 37
3-4 F28332，F28232 内存映射 .................................................................................................... 37
3-5 外部和 PIE 中断源................................................................................................................ 53
3-6 外部中断 ........................................................................................................................... 53
3-7 使用 PIE 块的中断复用 .......................................................................................................... 54
3-8 时钟和复位域...................................................................................................................... 57
3-9 OSC 和 PLL 块方框图 ........................................................................................................... 58
3-10 使用一个 3.3V 外部振荡器 ...................................................................................................... 59
3-11 使用一个1.9V外部振荡器 ....................................................................................................... 59
3-12 使用内部振荡器 ................................................................................................................... 59
3-13 安全装置模块...................................................................................................................... 62
4-1 DMA 功能方框图 ................................................................................................................. 65
4-2 CPU 定时器 ....................................................................................................................... 66
4-3 CPU 定时器中断信号和输出信号 ............................................................................................... 66
4-4 时基计数器同步方案 3 .......................................................................................................... 68
4-5 ePWM 子模块显示关键内部信号互连.......................................................................................... 71
4-6 eCAP 功能方框图 ................................................................................................................ 73
4-7 eQEP 功能方框图 ................................................................................................................ 75
4-8 ADC 模块的方框图 ............................................................................................................... 78
4-9 带有内部基准的 ADC 引脚连接................................................................................................. 79
4-10 带有外部基准的 ADC 引脚连接 ................................................................................................. 80
4-11 McBSP 模块 ...................................................................................................................... 84
4-12 eCAN 方框图和接口电路图...................................................................................................... 87
4-13 eCAN-A 内存映射 ................................................................................................................ 88
4-14 eCAN-B 内存映射 ................................................................................................................ 89
4-15 串行通信接口 (SCI) 模块方框图 ................................................................................................ 94
4-16 SPI 模块方框图（受控模式） ................................................................................................... 97
4-17 I2C 外设模块接口................................................................................................................. 98
4-18 GPIO MUX 方框图 .............................................................................................................. 100
4-19 使用采样窗口的限定： ......................................................................................................... 105
4-20 外部接口方框图 ................................................................................................................. 106
4-21 典型的 16 位数据总线 XINTF 连接 ........................................................................................... 107
4-22 典型的 32 位数据总线 XINTF 连接 ........................................................................................... 107
5-1 F2833x, F2823x的器件命名法示例 ........................................................................................... 109
6-1 典型运行电流与频率间的关系（F28335，F28235，F28334，F28234） ............................................... 122
6-2 典型运行功率与频率间的关系（F28335，F28235，F28334，F28234） ............................................... 122
版权 © 2007–2012, Texas Instruments Incorporated
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