Single-Supply, Dual Rail-to-Rail I/O
Precision Operational Amplifier
2
SGM8582
SG Micro Limited
www.sg-micro.com
PACKAGE/ORDERING INFORMATION
MODEL ORDER NUMBER
PACKAGE
DESCRIPTION
PACKAGE OPTION
MARKING
INFORMATION
SGM8582XS8G/TR SOP8 Tape and Reel, 2500 SGM8582XS8
SGM8582
SGM8582XMS8G/TR MSOP8 Tape and Reel, 3000 SGM8582XMS8
ABSOLUTE MAXIMUM RATINGS
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . -V
S
to (+V
S
) + 0.1V
Differential Input Voltage. . . . . . . . . . . . . . . . . . . . . . -5V to 5V
Storage Temperature Range . . . . . . . . . . . . . .-65℃ to +150℃
Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . .150℃
Operating Temperature Range. . . . . . . . . . . . .-40℃ to +125℃
Lead Temperature Range (Soldering 10 sec)
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260℃
ESD Susceptibility
HBM (SOP8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8000V
HBM (MSOP8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7000V
MM. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .400V
NOTE:
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods may
affect device reliability.
CAUTION
This integrated circuit can be damaged by ESD if you don’t pay
attention to ESD protection. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure to observe proper handling and installation procedures
can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
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