1 2 3 4
A
B
C
D
4321
D
C
B
A
+3.3V
SD_CMD
SD_CLK
SD_DAT
CD
10
D0
7
VDD
4
CLK
5
VSS
6
D1
8
D3/CS
2
CMD
3
WP
9
D2
1
Sheet
11
TF1
SD-TF
+
M1
MIC
C33
104
MIC
DACVDD
Power
Key
、
LED
LSPK+
LSPK-
R19
4.7R
R25
1K
VIN
D4
RED
R20
3.3K
C41
224/105
C23 105/224
C22 105/224
MCU
MIC
、
TF-CARD
R17
6.8K
C3
NC
注:原理图中注释说明设计时需特别注意
C5
105/NC
J2
SPK
C4
NC
D3
IN5822
VBATVIN
GND
5
LIN_R
4
AGND
3
LIN_L
2
6
+5V
1
6
6
6
J1
BT1
3.4V~4.2V
LIN_R
DACL
MIC
DACVDD
VCOM
AGND
+3.3V
C29
2.7P
BT_ANT
BT_ANT
L5
NC
L3 0RC25
105/225
C26 105/225
VBAT
BT_AVDD
C1
NC
C2
NC
BT_OSCO BT_OSCI
Y1 24M
BT_OSCO
BT_OSCI
USBDP
USBDM
SD_CLK
SD_CMD
SD_DAT
C24
105/224
C28 104/224
LIN_R
MUTE
ADKEY
晶振选型:
封装:可兼容3225,M49S,HC49 S等不同封装
要求:稳定性、一致性要好,频偏偏差:±10PPM 以内
电容:晶振匹配电容位置请预留
R21
4.7R
Q1
8850C/9015C
R22
10K
VBAT
R24
NC
GND、AGND在电源入口处短接在 一起!
设计注意事项:
1、主控所有电源的退耦 电容必须靠近芯片放置,退耦电容的回路地必须最短回到该电源地
2、蓝牙匹配电路参数以 调试结果为准
3、为保证产品的安全可 靠性,电池必须使用带保护 板的电池。
L2
6.8uH
L6
FB
L8
FB
C36
1nF
C34
1nF
GND
PA
RSPK+
RSPK-
J3
SPK
L7
FB
L9
FB
C37
1nF
C35
1nF
LIN_L
DACR
LINP
6
LINN
7
RINP
4
RINN
5
ENB
19
ENA
17
MODE
18
BYP
3
BYP
8
AGND
20
PGND
12
SS
2
COMP
1
ROUTN
15
ROUTP
14
LOUTN
10
MIX3901
LOUTP
11
FB
21
AVDD
24
SW
22
PVDD
9
PGND
16
PGND
23
PVDD
13
U2
MIX3901
R5
30K
C13 104
R9
30K
C15 104
R6
30K
C16 104
R3 22K
C12 104
C6
105
R1
22K
DACL
R10
30K
C17 104
R4 22K
C14 104
C9
105
R2
22K
DACR
C7
104
C20
106
C18
220uF
VBAT
C19
470uF
C8
104
C21
106
PVDD
R8
12K 1%
R7
56K 1%
D1
SS54
LSPK+
LSPK-
RSPK+
RSPK-
R11
4.7K
C30
473
C31
472
C11
105
C10
105
MUTE
VBAT
PC5/SD1CLK
1
PC4/SD1CMD/ADC4
2
VDDIO
12
PWMH2H/ADC9/AUX0R/PB5
13
ADC12/PR2
19
PWM3/ADC8/AUX0L/PB4
14
VCOMO
8
RTCVDD
17
DACVSS
11
DACVDD
9
PA0/MIC/PA3/AUX1L/ADC0
5
USBDM/PC3/SD1DAT/ADC10
3
USBDP
4
BT_OSCI
23
BT_OSCO
24
BT_RF
21
VSSIO
22
BT_AVDD
20
DACR
6
DACL
7
VCOM
10
ADC6/PB0
15
VBAT
16
ADC12/PR1
18
U1
AC6925C_QSOP24
C40
224/105 LIN_L
VCOMO
RTCVDD
R13
22K
R14
24K
R15
33K
R16
51K
S1
P/P/POWER
S3
PREV/V-
S4
NEXT/V+
S2
MODE
1.7V
2.0V
0V
2.3V
ADKEY
R18
100K
S5
TALK
2.7V
C27
NC/100P
D2
BLUE
LED
LED
R12
30K
USB预留测试点
RTCVDD
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