DA、AD转换芯片资料和典型应用电路资源-CSDN文库

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**DA和AD转换芯片概述** 在电子工程领域，数字模拟(DA)转换器和模拟数字(AD)转换器是至关重要的组件，它们负责在数字系统和模拟世界之间架起桥梁。DA转换器将数字信号转化为模拟信号，而AD转换器则执行相反的操作，将模拟信号转化为数字信号。在标题中提到的"DAC0832"、"DAC0808"和"ADC0809"都是常见的转换芯片，广泛应用于各种电子设备，如音频系统、数据采集系统和工业自动化。 **DAC0832——数字模拟转换器** DAC0832是一款8位线性DA转换器，能够将8位二进制数字输入转换为相应的模拟电压输出。它通常采用电流输出型设计，可通过外部电阻网络转换为电压输出。这种芯片通常具有高精度和低噪声特性，适用于需要将数字信号转化为模拟电压的应用。在压缩包中的"DAC0832.pdf"文件应该包含了详细的芯片规格、工作原理和应用电路示例。 **DAC0808——数字模拟转换器** DAC0808同样是8位的DA转换器，与DAC0832相似，它也用于将数字数据转化为模拟电压。这款芯片的特点可能包括可编程增益、独立的输入数据线以及多种工作模式。"DAC0808.pdf"文档应该会提供关于如何配置和使用该芯片的信息，包括接口设计和实际应用中的注意事项。 **ADC0809——模拟数字转换器** ADC0809是一款8位逐次比较型AD转换器，可以将模拟电压输入转换为8位数字输出。它的主要特点是高速、低功耗，并且包含内部采样保持电路，适合实时数据采集。"ADC0809.pdf"文件可能涵盖了ADC0809的工作原理、转换时间和精度等技术细节，同时提供了一些典型的应用电路设计。 **应用电路** "dac0832应用电路.pdf"文件则专门探讨了DAC0832的实用电路设计。这些电路可能包括如何连接外部电阻网络来设定输出范围、如何处理数字输入以及如何优化电源和滤波电路以提升性能。通过这份文档，工程师们可以学习到如何在实际项目中有效利用DAC0832进行信号转换。总结，这个压缩包提供的资料对于理解和使用DA和AD转换芯片非常有价值。它不仅涵盖了芯片的基本功能和规格，还提供了实用的电路设计，有助于工程师在设计数字信号处理系统时选择合适的转换器并正确地实现它们。

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DA、AD转换资料.rar （4个子文件）

DAC0808.pdf 228KB

dac0832应用电路.pdf 131KB

ADC0809.pdf 265KB

DAC0832.pdf 554KB

DAC0830/DAC0832

8-Bit µP Compatible, Double-Buffered D to A Converters

General Description

The DAC0830 is an advanced CMOS/Si-Cr 8-bit multiplying

DAC designed to interface directly with the 8080, 8048,

8085, Z80

, and other popular microprocessors. A deposited

silicon-chromium R-2R resistor ladder network divides the

reference current and provides the circuit with excellent

temperature tracking characteristics (0.05% of Full Scale

Range maximum linearity error over temperature). The cir-

cuit uses CMOS current switches and control logic to

achieve low power consumption and low output leakage

current errors. Special circuitry provides TTL logic input volt-

age level compatibility.

Double buffering allows these DACs to output a voltage

corresponding to one digital word while holding the next

digital word. This permits the simultaneous updating of any

number of DACs.

The DAC0830 series are the 8-bit members of a family of

microprocessor-compatible DACs (MICRO-DAC

™

Features

n Double-buffered, single-buffered or flow-through digital

data inputs

n Easy interchange and pin-compatible with 12-bit

DAC1230 series

n Direct interface to all popular microprocessors

n Linearity specified with zero and full scale adjust

only—NOT BEST STRAIGHT LINE FIT.

n Works with

10V reference-full 4-quadrant multiplication

n Can be used in the voltage switching mode

n Logic inputs which meet TTL voltage level specs (1.4V

logic threshold)

n Operates “STAND ALONE” (without µP) if desired

n Available in 20-pin small-outline or molded chip carrier

package

Key Specifications

n Current settling time: 1 µs

n Resolution: 8 bits

n Linearity: 8, 9, or 10 bits (guaranteed over temp.)

n Gain Tempco: 0.0002% FS/˚C

n Low power dissipation: 20 mW

n Single power supply: 5 to 15 V

Typical Application

00560801

BI-FET

™

and MICRO-DAC

™

are trademarks of National Semiconductor Corporation.

Z80

is a registered trademark of Zilog Corporation.

March 2002

DAC0830/DAC0832 8-Bit µP Compatible, Double-Buffered D to A Converters

Connection Diagrams (Top Views)

Dual-In-Line and

Small-Outline Packages

00560821

Molded Chip Carrier Package

00560822

DAC0830/DAC0832

www.national.com 2

Absolute Maximum Ratings (Notes 1,

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

Supply Voltage (V

)17V

Voltage at Any Digital Input V

to GND

Voltage at V

REF

Input

25V

Storage Temperature Range −65˚C to +150˚C

Package Dissipation

at T

=25˚C (Note 3) 500 mW

DC Voltage Applied to

OUT1

or I

OUT2

(Note 4) −100 mV to V

ESD Susceptability (Note 4) 800V

Lead Temperature (Soldering, 10 sec.)

Dual-In-Line Package (plastic) 260˚C

Dual-In-Line Package (ceramic) 300˚C

Surface Mount Package

Vapor Phase (60 sec.) 215˚C

Infrared (15 sec.) 220˚C

Operating Conditions

Temperature Range T

MIN

≤T

MAX

Part numbers with “LCN” suffix 0˚C to +70˚C

Part numbers with “LCWM” suffix 0˚C to +70˚C

Part numbers with “LCV” suffix 0˚C to +70˚C

Part numbers with “LCJ” suffix −40˚C to +85˚C

Part numbers with “LJ” suffix −55˚C to +125˚C

Voltage at Any Digital Input V

to GND

Electrical Characteristics

REF

=10.000 V

unless otherwise noted. Boldface limits apply over temperature, T

MIN

≤T

MAX

. For all other limits

=25˚C.

Parameter Conditions

See

Note

= 4.75 V

= 15.75 V

=5V

=12V

to 15 V

Limit

Units

Typ

(Note 12)

Tested

Limit

(Note 5)

Design

Limit

(Note 6)

CONVERTER CHARACTERISTICS

Resolution 8 8 8 bits

Linearity Error Max Zero and full scale adjusted 4, 8

−10V≤V

REF

≤+10V

DAC0830LJ & LCJ 0.05 0.05 % FSR

DAC0832LJ & LCJ 0.2 0.2 % FSR

DAC0830LCN, LCWM &

LCV

0.05 0.05 % FSR

DAC0831LCN 0.1 0.1 % FSR

DAC0832LCN, LCWM &

LCV

0.2 0.2 % FSR

Differential Nonlinearity Zero and full scale adjusted 4, 8

Max −10V≤V

REF

≤+10V

DAC0830LJ & LCJ 0.1 0.1 % FSR

DAC0832LJ & LCJ 0.4 0.4 % FSR

DAC0830LCN, LCWM &

LCV

0.1 0.1 % FSR

DAC0831LCN 0.2 0.2 % FSR

DAC0832LCN, LCWM &

LCV

0.4 0.4 % FSR

Monotonicity −10V≤V

REF

LJ & LCJ 4 88bits

≤+10V LCN, LCWM &

LCV

8 8 bits

Gain Error Max Using Internal R

0.2

1 %FS

−10V≤V

REF

≤+10V

Gain Error Tempco Max Using internal R

0.0002 0.0006 %

DAC0830/DAC0832

www.national.com3

Electrical Characteristics (Continued)

REF

=10.000 V

unless otherwise noted. Boldface limits apply over temperature, T

MIN

≤T

MAX

. For all other limits

=25˚C.

Parameter Conditions

See

Note

= 4.75 V

= 15.75 V

=5V

=12V

to 15 V

Limit

Units

Typ

(Note 12)

Tested

Limit

(Note 5)

Design

Limit

(Note 6)

CONVERTER CHARACTERISTICS

FS/˚C

Power Supply Rejection All digital inputs latched high

=14.5V to 15.5V 0.0002 0.0025 %

11.5V to 12.5V 0.0006 FSR/V

4.5V to 5.5V 0.013 0.015

Reference Max 15 20 20 kΩ

Input Min 15 10 10 kΩ

Output Feedthrough

Error

REF

=20 Vp-p, f=100 kHz

All data inputs latched low

3 mVp-p

Output

Leakage

Current Max

OUT1

All data inputs LJ & LCJ 10 100 100 nA

latched low LCN, LCWM &

LCV

50 100

OUT2

All data inputs LJ & LCJ 100 100 nA

latched high LCN, LCWM &

LCV

50 100

Output I

OUT1

All data inputs 45 pF

Capacitance I

OUT2

latched low 115

OUT1

All data inputs 130 pF

OUT2

latched

high

DIGITAL AND DC CHARACTERISTICS

Digital Input Max Logic Low LJ: 4.75V 0.6

Voltages LJ: 15.75V 0.8

LCJ: 4.75V 0.7 V

LCJ: 15.75V 0.8

LCN, LCWM, LCV 0.95 0.8

Min Logic High LJ & LCJ 2.0 2.0 V

LCN, LCWM, LCV 1.9 2.0

Digital Input Max Digital inputs

0.8V

Currents LJ & LCJ −50 −200 −200 µA

LCN, LCWM, LCV −160 −200 µA

Digital inputs

2.0V

LJ & LCJ 0.1 +10 +10 µA

LCN, LCWM, LCV +8 +10

Supply Current Max LJ & LCJ 1.2 3.5 3.5 mA

Drain LCN, LCWM, LCV 1.7 2.0

DAC0830/DAC0832

www.national.com 4

Electrical Characteristics

REF

=10.000 V

unless otherwise noted. Boldface limits apply over temperature, T

MIN

≤T

MAX

. For all other limits

=25˚C.

Symbol Parameter Conditions

See

Note

=15.75 V

=12

5% to 15

=4.75 V

Limit

Units

Typ

(Note 12)

Tested

Limit

(Note 5)

Design Limit

(Note 6)

Typ

(Note 12)

Tested

Limit

(Note 5)

Design

Limit

(Note 6)

AC CHARACTERISTICS

Current Setting V

=0V,

=5V

1.0 1.0 µs

Time

Write and XFER V

=0V,

=5V

11 100 250 375 600

Pulse Width Min 9 320 320 900 900

Data Setup Time V

=0V,

=5V

100 250 375 600

Min 320 320 900 900

Data Hold Time V

=0V,

=5V

30 50

Min 30 50

Control Setup

Time

=0V,

=5V

110 250 600 900

Min 320 320 1100 1100

Control Hold Time V

=0V,

=5V

10 0

Min 00

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating

the device beyond its specified operating conditions.

Note 2: All voltages are measured with respect to GND, unless otherwise specified.

Note 3: The maximum power dissipation must be derated at elevated temperatures and is dictated by T

JMAX

, θ

, and the ambient temperature, T

. The maximum

allowable power dissipation at any temperature is P

=(T

JMAX

−T

)/θ

or the number given in the Absolute Maximum Ratings, whichever is lower. For this device,

JMAX

= 125˚C (plastic) or 150˚C (ceramic), and the typical junction-to-ambient thermal resistance of the J package when board mounted is 80˚C/W. For the N

package, this number increases to 100˚C/W and for the V package this number is 120˚C/W.

Note 4: For current switching applications, both I

OUT1

and I

OUT2

must go to ground or the “Virtual Ground” of an operational amplifier. The linearity error is degraded

by approximately V

÷V

REF

. For example, if V

REF

=10Vthena1mVoffset, V

,onI

OUT1

or I

OUT2

will introduce an additional 0.01% linearity error.

Note 5: Tested limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).

Note 6: Guaranteed, but not 100% production tested. These limits are not used to calculate outgoing quality levels.

Note 7: Guaranteed at V

REF

10 V

and V

REF

Note 8: The unit “FSR” stands for “Full Scale Range.” “Linearity Error” and “Power Supply Rejection” specs are based on this unit to eliminate dependence on a

particular V

REF

value and to indicate the true performance of the part. The “Linearity Error” specification of the DAC0830 is “0.05% of FSR (MAX)”. This guarantees

that after performing a zero and full scale adjustment (see Sections 2.5 and 2.6), the plot of the 256 analog voltage outputs will each be within 0.05%xV

REF

of a

straight line which passes through zero and full scale.