RTL8213B-CG
10/100/1000M Copper
to
100Base-FX/1000Base-X Fiber
Media Converter
DRAFT DATASHEET
(CONFIDENTIAL: Development Partners Only)
Rev. 1.0
30 Dec. 2018
Track ID: xxxx-xxxx-xx
Realtek Semiconductor Corp.
No. 2, Innovation Road II, Hsinchu Science Park, Hsinchu 300, Taiwan
Tel.: +886-3-578-0211 Fax: +886-3-577-6047
www.realtek.com
RTL8213B
DRAFT Datasheet
Unmanaged Gigabit Media Converter
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Track ID: xxxx-xxxx-xx Rev. 1.0
COPYRIGHT
©2018 Realtek Semiconductor Corp. All rights reserved. No part of this document may be reproduced,
transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any
means without the written permission of Realtek Semiconductor Corp.
DISCLAIMER
Realtek provides this document ‘as is’, without warranty of any kind. Realtek may make improvements
and/or changes in this document or in the product described in this document at any time. This document
could include technical inaccuracies or typographical errors.
TRADEMARKS
Realtek is a trademark of Realtek Semiconductor Corporation. Other names mentioned in this document
are trademarks/registered trademarks of their respective owners.
USING THIS DOCUMENT
This document is intended for the hardware and software engineer’s general information on the Realtek
RTL8213B IC.
Though every effort has been made to ensure that this document is current and accurate, more information
may have become available subsequent to the production of this guide.
ELECTROSTATIC DISCHARGE (ESD) WARNING
This product can be damaged by Electrostatic Discharge (ESD). When handling, care must be taken.
Damage due to inappropriate handling is not covered by warranty.
Do not open the protective conductive packaging until you have read the following, and are at an approved
anti-static workstation.
Use an approved anti-static mat to cover your work surface.
Use a conductive wrist strap attached to a good earth ground
Always discharge yourself by touching a grounded bare metal surface or approved anti-static mat before picking up
an ESD-sensitive electronic component
If working on a prototyping board, use a soldering iron or station that is marked as ESD-safe
Always disconnect the microcontroller from the prototyping board when it is being worked on
REVISION HISTORY
Revision
Release Date
Summary
1.0
2018/12/30
First Release.
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Table of Contents
1. GENERAL DESCRIPTION .................................................................................................................................................... 1
2. FEATURES ................................................................................................................................................................................. 3
3. SYSTEM APPLICATIONS ...................................................................................................................................................... 5
4. APPLICATION EXAMPLES .................................................................................................................................................. 5
4.1. UNMANAGED MEDIA CONVERTER ......................................................................................................................................................... 5
5. BLOCK DIAGRAM .................................................................................................................................................................. 6
6. PIN ASSIGNMENTS ................................................................................................................................................................ 7
6.1. PACKAGE IDENTIFICATION .................................................................................................................................................................. 7
6.2. PIN ASSIGNMENTS TABLE ................................................................................................................................................................... 8
7. PIN DESCRIPTIONS ............................................................................................................................................................... 9
7.1. MEDIA DEPENDENT INTERFACE PINS ................................................................................................................................................ 9
7.2. HIGH SPEED SERIAL INTERFACE PINS ............................................................................................................................................... 9
7.3. GENERAL PURPOSE INTERFACES ........................................................................................................................................................ 9
7.4. LED PINS ................................................................................................................................................................................................ 9
7.5. CONFIGURATION STRAPPING PINS .................................................................................................................................................. 10
7.6. MANAGEMENT INTERFACE PINS ..................................................................................................................................................... 11
7.7. MISCELLANEOUS PINS ...................................................................................................................................................................... 11
7.8. EMBEDDED SWITCH REGULATOR PINS .......................................................................................................................................... 12
7.9. POWER AND GND PINS ..................................................................................................................................................................... 12
8. PHYSICAL LAYER FUNCTIONAL OVERVIEW ........................................................................................................... 13
8.1. MDI INTERFACE ................................................................................................................................................................................. 13
8.2. 1000BASE-T TRANSMIT FUNCTION ............................................................................................................................................... 13
8.3. 1000BASE-T RECEIVE FUNCTION................................................................................................................................................... 13
8.4. 100BASE-TX TRANSMIT FUNCTION .............................................................................................................................................. 13
8.5. 100BASE-TX RECEIVE FUNCTION.................................................................................................................................................. 14
8.6. 10BASE-T TRANSMIT FUNCTION .................................................................................................................................................... 14
8.7. 10BASE-T RECEIVE FUNCTION ....................................................................................................................................................... 14
8.8. AUTO-NEGOTIATION FOR UTP ........................................................................................................................................................ 14
8.9. CROSSOVER DETECTION AND AUTO CORRECTION ..................................................................................................................... 15
8.10. POLARITY CORRECTION .................................................................................................................................................................... 15
9. GENERAL FUNCTION DESCRIPTIONS ......................................................................................................................... 16
9.1. RESET .................................................................................................................................................................................................... 16
9.1.1. Hardware Reset
............................................................................................................................................................................ 16
9.1.2. Software Reset
............................................................................................................................................................................... 16
9.2. IEEE 802.3X FULL DUPLEX FLOW CONTROL .............................................................................................................................. 17
9.3. HALF DUPLEX FLOW CONTROL ...................................................................................................................................................... 17
9.3.1. Back-Pressure Mode
................................................................................................................................................................... 17
9.4. SEARCH AND LEARNING ................................................................................................................................................................... 18
9.5. SVL AND IVL/SVL ........................................................................................................................................................................... 18
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9.6. ILLEGAL FRAME FILTERING ............................................................................................................................................................. 18
9.7. IEEE 802.3 RESERVED GROUP ADDRESSES FILTERING CONTROL .......................................................................................... 19
9.8. BROADCAST/MULTICAST/UNKNOWN DA STORM CONTROL ................................................................................................... 20
9.9. PORT SECURITY FUNCTION .............................................................................................................................................................. 20
9.10. MIB COUNTERS .................................................................................................................................................................................. 20
9.11. PORT MIRRORING ............................................................................................................................................................................... 20
9.12. VLAN FUNCTION ............................................................................................................................................................................... 21
9.12.1. Port-Based VLAN
................................................................................................................................................................... 21
9.12.2. IEEE 802.1Q Tag-Based VLAN
.......................................................................................................................................... 21
9.12.3. Protocol-Based VLAN
........................................................................................................................................................... 21
9.13. QOS FUNCTION ................................................................................................................................................................................... 22
9.13.1. Input Bandwidth Control
...................................................................................................................................................... 22
9.13.2. Priority Assignment
............................................................................................................................................................... 22
9.13.3. Priority Queue Scheduling
................................................................................................................................................... 23
9.13.4. IEEE 802.1p/Q and DSCP Remarking
.............................................................................................................................. 23
9.13.5. ACL-Based Priority
............................................................................................................................................................... 23
9.14. IEEE 802.1X FUNCTION ................................................................................................................................................................... 24
9.14.1. Port-Based Access Control
.................................................................................................................................................. 24
9.14.2. Authorized Port-Based Access Control
............................................................................................................................. 24
9.14.3. Port-Based Access Control Direction
................................................................................................................................ 24
9.14.4. MAC-Based Access Control
................................................................................................................................................. 24
9.14.5. MAC-Based Access Control Direction
.............................................................................................................................. 24
9.14.6. Optional Unauthorized Behavior
....................................................................................................................................... 24
9.15. IEEE 802.1D FUNCTION ................................................................................................................................................................... 25
9.16. REALTEK CABLE TEST (RTCT) ....................................................................................................................................................... 25
9.17. LED INDICATORS ............................................................................................................................................................................... 26
9.18. GREEN ETHERNET .............................................................................................................................................................................. 28
9.18.1. Link-On and Cable Length Power Saving
........................................................................................................................ 28
9.18.2. Link-Down Power Saving
..................................................................................................................................................... 28
9.19. REGULATOR ......................................................................................................................................................................................... 28
10. INTERFACE DESCRIPTIONS ............................................................................................................................................ 29
10.1. MASTER I2C FOR EEPROM AUTO-LOAD .................................................................................................................................... 29
10.2. REALTEK SLAVE I2C-LIKE INTERFACE FOR EXTERNAL CPU TO ACCESS THE RTL8213B ................................................ 30
10.3. SLAVE MII MANAGEMENT SMI INTERFACE FOR EXTERNAL CPU TO ACCESS RTL8213B .............................................. 31
11. ELECTRICAL CHARACTERISTICS ................................................................................................................................ 32
11.1. ABSOLUTE MAXIMUM RATINGS...................................................................................................................................................... 32
11.2. RECOMMENDED OPERATING RANGE ............................................................................................................................................. 32
11.3. THERMAL CHARACTERISTICS .......................................................................................................................................................... 33
11.3.1. Assembly Description
............................................................................................................................................................ 33
11.3.2. Material Properties
................................................................................................................................................................ 33
11.3.3. Simulation Conditions
........................................................................................................................................................... 33
11.3.4. Thermal Performance of QFN-56 on PCB Under Still Air Convection
.................................................................... 34
11.4. DC CHARACTERISTICS ...................................................................................................................................................................... 34
11.5. SWITCH REGULATOR ......................................................................................................................................................................... 34
11.6. AC CHARACTERISTICS ...................................................................................................................................................................... 35
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11.6.1. Master I2C for EEPROM Auto-load Interface Timing Characteristics
.................................................................... 35
11.6.2. Slave I2C-like Mode Timing Characteristics
................................................................................................................... 36
11.6.3. Slave MII Management SMI for External CPU Access Interface Timing Characteristics
................................... 37
11.6.4. SGMII/1000Base-X Characteristics
.................................................................................................................................. 38
11.6.5. Power and Reset Characteristics
....................................................................................................................................... 40
12. MECHANICAL DIMENSIONS ............................................................................................................................................ 41
13. ORDERING INFORMATION .............................................................................................................................................. 42
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