MAX1978-1979_MAX1978温控电路资源-CSDN文库

TEC驱动芯片

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General Description

The MAX1978/MAX1979 are the smallest, safest, most

accurate complete single-chip temperature controllers for

Peltier thermoelectric cooler (TEC) modules. On-chip power

FETs and thermal control-loop circuitry minimize external

components while maintaining high efficiency. Selectable

500kHz/1MHz switching frequency and a unique ripple-can-

cellation scheme optimize component size and efficiency

while reducing noise. Switching speeds of internal

MOSFETs are optimized to reduce noise and EMI. An ultra-

low-drift chopper amplifier maintains ±0.001°C temperature

stability. Output current, rather than voltage, is directly con-

trolled to eliminate current surges. Individual heating and

cooling current and voltage limits provide the highest level of

TEC protection.

The MAX1978 operates from a single supply and provides

bipolar ±3A output by biasing the TEC between the outputs

of two synchronous buck regulators. True bipolar operation

controls temperature without “dead zones” or other nonlin-

earities at low load currents. The control system does not

hunt when the set point is very close to the natural operating

point, where only a small amount of heating or cooling is

needed. An analog control signal precisely sets the TEC

current. The MAX1979 provides unipolar output up to 6A.

A chopper-stabilized instrumentation amplifier and a high-

precision integrator amplifier are supplied to create a pro-

portional-integral (PI) or proportional-integral-derivative (PID)

controller. The instrumentation amplifier can interface to an

external NTC or PTC thermistor, thermocouple, or semicon-

ductor temperature sensor. Analog outputs are provided to

monitor TEC temperature and current. In addition, separate

overtemperature and undertemperature outputs indicate

when the TEC temperature is out of range. An on-chip volt-

age reference provides bias for a thermistor bridge.

The MAX1978/MAX1979 are available in a low-profile

48-lead thin QFN-EP package and is specified over the

-40°C to +85°C temperature range. The thermally

enhanced QFN-EP package with exposed metal pad

minimizes operating junction temperature. An evaluation

kit is available to speed designs.

Applications

Fiber Optic Laser Modules

WDM, DWDM Laser-Diode Temperature Control

Fiber Optic Network Equipment

EDFA Optical Amplifiers

Telecom Fiber Interfaces

ATE

Features

♦ Smallest, Safest, Most Accurate Complete

Single-Chip Controller

♦ On-Chip Power MOSFETS—No External FETs

♦ Circuit Footprint < 0.93in

♦ Circuit Height < 3mm

♦ Temperature Stability to 0.001°C

♦ Integrated Precision Integrator and Chopper

Stabilized Op Amps

♦ Accurate, Independent Heating and Cooling

Current Limits

♦ Eliminates Surges By Directly Controlling

TEC Current

♦ Adjustable Differential TEC Voltage Limit

♦ Low-Ripple and Low-Noise Design

♦ TEC Current Monitor

♦ Temperature Monitor

♦ Over- and Undertemperature Alarm

♦ Bipolar ±3A Output Current (MAX1978)

♦ Unipolar +6A Output Current (MAX1979)

MAX1978/MAX1979

Integrated Temperature

Controllers for Peltier Modules

________________________________________________________________ Maxim Integrated Products 1

Ordering Information

FREQ

N.C.

LX1

PGND1

N.C.

LX1

GND

LX1

PGND1

PGND2

LX2

PGND2

LX2

N.C.

LX2

N.C.

OS2

DIFOUT

FB-

FB+

BFB+

AOUT

AIN-

AIN+

GND

INT-

INTOUT

REF

CTLI

GND

MAXV

MAXIN

MAXIP

ITEC

COMP

OS1

QFN-EP

MAX1978

MAX1979

BFB-

TOP VIEW

*ELECTRICALLY CONNECTED TO THE UNDERSIDE METAL SLUG.

NOTE: GND IS CONNECTED TO THE UNDERSIDE METAL SLUG.

SHDN

Pin Configuration

19-2490; Rev 0; 7/02

For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at

1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

Typical Operating Circuit appears at end of data sheet.

EVALUATION KIT

AVAILABLE

PART TEMP RANGE PIN-PACKAGE

MAX1978ETM -40°C to +85°C 48 Thin QFN-EP*

MAX1979ETM -40°C to +85°C 48 Thin QFN-EP

*EP = Exposed pad.

MAX1978/MAX1979

Integrated Temperature

Controllers for Peltier Modules

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

= PV

1 = PV

2 = SHDN = 5V, FREQ = GND, CTLI = FB+ = FB- = MAXV = MAXIP = MAXIN = REF, T

= 0°C to +85°C,

unless otherwise noted. Typical values at T

= +25°C.)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

to GND..............................................................-0.3V to +6V

SHDN, MAXV, MAXIP, MAXIN,

CTLI, OT, UT to GND............................................-0.3V to +6V

FREQ, COMP, OS1, OS2, CS, REF, ITEC, AIN+, AIN-,

AOUT, INT-, INTOUT, BFB+, BFB-, FB+, FB-,

DIFOUT to GND......................................-0.3V to (V

+ 0.3V)

1, PV

2 to V

...........................................-0.3V to +0.3V

1, PV

2 to GND...............................-0.3V to (V

+ 0.3V)

PGND1, PGND2 to GND .......................................-0.3V to +0.3V

COMP, REF, ITEC, OT, UT, INTOUT, DIFOUT,

BFB-, BFB+, AOUT Short to GND .............................Indefinite

Peak LX Current (MAX1978) (Note 1).................................±4.5A

Peak LX Current (MAX1979) (Note 1)....................................+9A

Continuous Power Dissipation (T

= +70°C)

48-Lead Thin QFN-EP

(derate 26.3mW/°C above +70°C) (Note 2).................2.105W

Operating Temperature Ranges

MAX1978ETM ..................................................-40°C to +85°C

MAX1979ETM ..................................................-40°C to +85°C

Maximum Junction Temperature .....................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Input Supply Range V

3.0 5.5 V

= 5V, I

TEC

= 0 to ±3A,

OUT

= V

OS1

- V

OS2

(MAX1978)

-4.3 +4.3

= 5V, I

TEC

= 0 to 6A,

OUT

= V

OS1

(MAX1979)

4.3

= 3V, I

TEC

= 0 to ±3A,

OUT

= V

OS1

- V

OS2

(MAX1978)

-2.3 +2.3

Output Voltage Range V

OUT

= 3V, I

TEC

= 0 to 6A,

OUT

= V

OS1

(MAX1979)

2.3

MAX1978 ±3

Maximum TEC Current I

TEC

(

MAX

)

MAX1979 6

Reference Voltage V

REF

= 3V to 5.5V, I

REF

= 150µA 1.485 1.500 1.515 V

Reference Load Regulation ∆V

REF

= 3V to 5.5V, I

REF

= +10µA to -1mA 1.2 5 mV

MAXI_

= V

REF

135 150 160

OS1

< V

MAXI_

= V

REF

/3 40 50 60

MAXI_

= V

REF

135 150 160

Current-Sense Threshold

OS1

> V

MAXI_

= V

REF

/3 40 50 60

= 5V, I = 0.5A 0.04 0.07

NFET On-Resistance R

(

ON-N

)

= 3V, I = 0.5A 0.06 0.08

Ω

= 5V, I = 0.5A 0.06 0.10

PFET On-Resistance R

(

ON-P

)

= 3V, I = 0.5A 0.09 0.12

Ω

= V

= 5V, T

= +25°C 0.02 10

NFET Leakage I

LEAK

(

)

= V

= 5V, T

= +85°C1

µA

Note 1: LX has internal clamp diodes to PGND and PVDD. Applications that forward bias these diodes should not exceed the IC’s

package power dissipation limits.

Note 2: Solder underside metal slug to PC board ground plane.

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doudou_zhu_

2020-08-08

就是数据手册，还以为是啥自己分析的东西呢，垃圾

taojun7816

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