没有合适的资源?快使用搜索试试~ 我知道了~
温馨提示
试读
432页
ASR7205 datasheet V1.0 VIITRIX 云锦微 人脸识别 活体检测 SIP语音通话应用 专业智能网络摄像机 SoC 22nm工艺:22nm制程, 基于双核Arm Cortex-A7, 可实现低功耗低成本的最大化芯片设计 自研高性能NPU:集成自研2Tops算力NPU, 支持ResNet/MobileNet/RetinaFace/SqueezeNet/YOLO/Facenet等网络模型. 增加VDSP进一步提升AI能力 专业级ISP:支持HDR, 3D降噪, 除雾, 鱼眼等图像算法, 为客户提供专业级图像质量. 强大的智能宽动态, 无畏强光,逆光和暗光, 在复杂光线环境下同样可以提供清晰的画质. 支持2路Camera输入 出色的编码能力:支持H.264 BP/MP/HP, H.265/HEVC Baseline. 多码流实时处理, 4M(2560x1440)+D1(704x576)+720P (1080x720)@ 30fps 高速外围接口:PCIe, USB2.0 and SDIO 3.0接口, 方便客户扩展外部功能模块
资源推荐
资源详情
资源评论
Cover
ASR7205
Applications Processor
Datasheet
Doc. No. ASR7205
CONFIDENTIAL
Document Classification: Proprietary Information
ASR7205
Datasheet
Document Conventions
Note: Provides related information or information of special importance.
Caution: Indicates potential damage to hardware or software, or loss of data.
Warning: Indicates a risk of personal injury.
Document Status
Doc Status: Preliminary
Technical Publication: x.xx
Disclaimer
No part of this document may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, for any purpose, without the express written
permission of ASR. ASR retains the right to make changes to this document at any time, without notice. ASR makes no warranty of any kind, expressed or implied, with regard to any information
contained in this document, including, but not limited to, the implied warranties of merchantability or fitness for any particular purpose. Further, ASR does not warrant the accuracy or completeness of
the information, text, graphics, or other items contained within this document.
ASR products are not designed for use in life-support equipment or applications that would cause a life-threatening situation if any such products failed. Do not use ASR products in these types of
equipment or applications.
At all times hereunder, the recipient of any such information agrees that they shall be deemed to have manually signed this document in connection with their receipt of any such information.
Copyright © 2015–2021. ASR Microelectronics (Shanghai) Co., Ltd. All rights reserved .
Patent(s) Pending—Products identified in this document may be covered by one or more ASR patents and/or patent applications.
PRODUCT OVERVIEW
General
•
T22 ULP, BGA package 14x14mm.
0.65mm ball pitch, 365 pins
•
Operation temperature:
commercial grade(-20~70C),
industrial grade(-40~85C)
CPU Processor
•
MP2 Cortex-A7@1GHz,upto1.25G
•
32KB I-cache, 32K D-cache, 256KB L2
cache
•
Neon and FPU
Memory& Storage
•
16-bit DDR3(L) @1866Mbps
•
32-bit DDR3(L) @1866Mbps
•
QSPI NOR flash interface
•
QSPI Nand flash interface
•
eMMC 5.1
•
SD Card 3.0
Security
•
Secure Boot
•
TEE with trust zone and memory isolation
•
HW Crypto Engine
•
4K bits eFUSE
Peripheral Controllers
•
RTC
•
ADCx5,I2C x9,UART x5,QSPI
x2CS ,PWM x4,EMMC x 1, SDIO 3.0
x2(Wi-Fi, SD Card), I2S/SPI x 3, keypadx1
•
USB 2.0 host & slave
•
Ethernet 10/100/1000Mb/s
Video-In Interfaces
•
MIPI CSI 4-lane (support dual-cameras)
Camera Processor
•
4M/5M pixel image processor
•
3A functions (AF, AE, AWB)
•
Local tone mapping/ dehaze
•
HDR (2-Frame High Dynamic Range
120dB)
•
2D denoise and 3DNR
•
Lens distortion correction, fish eye support
•
EIS (Electronics Image Stabilization)
•
Multiple output with scaling
•
ISP tuning tools for the PC
•
RGBIR/RGBW with Smartsens Sensor
Video Subsystem
•
H.264 Baseline/Main/High Profile
•
H.265/HEVC Main Profile
•
Video encoder
4M(2560x1440)+D1(704x576)+720P
(1080x720)@ 30fps
4M(2560x1440)+D1(704x576)
+1080P(1920x1080)@25fps
5M(2592x1944)+D1(704x576)+720P
(1080x720)@25fps
•
Advanced bit-rate control modes
•
Multiple ROI encoding
•
MJPEG/JPEG baseline
•
JPEG encoder 4M@30fps,
5M@25fps,scalable for multi-streams
•
Video graphics overlay and OSD
•
Image mosaic & cover
•
Image rotation (90/180/270), crop and
scaling
Vision Processor
•
NPU: 2 Tops NN performance @1GHz
•
Supported
ResNet,MobileNet ,RetinaFace ,SqueezeNet
,YOLO,SENet,DenseNet,facenet,etc.
•
Customized NN model Acceleration
•
VDSP: CEVA XM6 @614MHz,128MAC
•
Computer Vision Algorithms in VDSP
Display & 2D
•
Standalone graphics 2D engine for UI
•
DPC for 1920x1080@60fps Output
•
1 graphics layer + 1 video layer
Composition
Video-Out Interfaces
•
MIPI DSI 4 lane (1080p)
•
BT.656, BT.1120 VO interfaces (1080p)
Audio
•
Integrated audio codec, ADC x 2, DAC x 2
•
I2S x 3
•
Audio encoding & decoding (SW)
•
Audio AEC and ANR functions (SW)
Boot
•
Booting from the QSPI NAND flash, eMMC
or QSPI NOR flash
•
Secure boot
SDK
•
Linux-4.19-based SDK
Table of Contents
COVER ………………………………………………………………………………………………………………………………………………………………………..1
PRODUCT OVERVIEW .......................................................................................................................................................... 3
DOCUMENT PURPOSE ............................................................................................................................................................. 14
NUMBER REPRESENTATION ...................................................................................................................................................... 14
NAMING CONVENTIONS .......................................................................................................................................................... 14
1 INTRODUCTION ........................................................................................................................................... 16
1.1
SOC DEVICE FEATURES ...................................................................................................................................... 16
2 FUNCTIONAL DESCRIPTION OVERVIEW........................................................................................................ 19
2.1
ARCHITECTURE OVERVIEW ................................................................................................................................ 19
2.2
CHIP CONFIGURATION ........................................................................................................................................ 20
2.3
MEMORY MAP .................................................................................................................................................... 20
2.4
DMA CONNECTIVITY AND ASSIGNMENTS .......................................................................................................... 23
3 PIN MUXING AND MULTI-FUNCTION PINS ................................................................................................... 27
3.1
FUNCTION ASSIGNMENTS FOR MULTIPLEXED I/O PINS .................................................................................................... 27
3.2
PINOUT ................................................................................................................................................................. 30
3.3
MULTIPLEXED SIGNAL FUNCTIONS .............................................................................................................................. 42
3.4
PAD-RING I/O DOMAINS POWER CONTROL .................................................................................................................. 46
3.5
PIN CONTROL UNIT ................................................................................................................................................. 51
3.6
FUNCTION ASSIGNMENTS FOR MULTI-FUNCTION I/O PINS.............................................................................................. 63
3.7
REGISTER DESCRIPTIONS ........................................................................................................................................... 68
4 ARM CORTEX-A7 .......................................................................................................................................... 69
4.1
CA7 OVERVIEW ...................................................................................................................................................... 69
4.2
CA7 FUNCTIONAL DESCRIPTION ................................................................................................................................ 70
4.3
CA7 INTERRUPT ................................................................................................................................................. 74
5 XM6 ............................................................................................................................................................. 80
5.1
OVERVIEW .......................................................................................................................................................... 80
5.2
PROGRAM GUIDE ................................................................................................................................................ 84
6 DDR MEMORY CONTROLLER ........................................................................................................................ 88
6.1 INTRODUCTION ................................................................................................................................................... 88
6.2 FEATURE LIST ..................................................................................................................................................... 88
6.3 OVERVIEW .......................................................................................................................................................... 90
6.4 FUNCTIONAL DESCRIPTION ................................................................................................................................. 91
7 SD HOST CONTROLLER ............................................................................................................................... 101
7.1
FEATURES ............................................................................................................................................................ 101
7.2
SIGNAL DESCRIPTIONS ............................................................................................................................................ 103
7.3
SD/MMC BUS PROTOCOL DESCRIPTION .................................................................................................................. 103
7.4
SPECIAL BUS TRANSACTIONS ................................................................................................................................... 105
7.5
SEQUENCES OF HOST AND CARD INTERACTION ............................................................................................................ 107
7.6
CARD DETECTION .................................................................................................................................................. 112
7.7
SPI MODE ........................................................................................................................................................... 112
7.8
MMC MODE ....................................................................................................................................................... 112
7.9
CE-ATA MODE .................................................................................................................................................... 112
7.10
REGISTER DESCRIPTIONS ......................................................................................................................................... 112
8 POWER MANAGEMENT AND CLOCKS ........................................................................................................ 113
8.1 POWER MANAGEMENT UNITS ................................................................................................................................. 113
剩余431页未读,继续阅读
资源评论
tangliang0417
- 粉丝: 0
- 资源: 12
上传资源 快速赚钱
- 我的内容管理 展开
- 我的资源 快来上传第一个资源
- 我的收益 登录查看自己的收益
- 我的积分 登录查看自己的积分
- 我的C币 登录后查看C币余额
- 我的收藏
- 我的下载
- 下载帮助
安全验证
文档复制为VIP权益,开通VIP直接复制
信息提交成功