GD32F205xx_Datasheet_Rev2.3.pdf资源-CSDN文库

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GD32F205xx是GigaDevice公司生产的一款基于ARM®Cortex®-M33 32位微控制器，该微控制器系列的数据手册为开发者提供了详细的技术资料，方便了解和使用这款微控制器。一、产品概述 GD32F205xx系列微控制器的通用描述包括设备信息、块图、引脚图和引脚分配、内存映射、时钟树和引脚定义。设备信息部分会介绍微控制器的基本型号及其特性。块图提供了微控制器内部结构的视觉表示。引脚图和引脚分配有助于用户理解如何将微控制器引脚连接到外部电路。内存映射则展示了不同存储区域在地址空间中的布局。时钟树部分描述了时钟系统结构，包括时钟源和它们之间的关系。二、功能描述 GD32F205xx的功能描述是数据手册的核心部分，它详细介绍了微控制器的各个功能模块。 1. ARM® Cortex®-M3核心：这一部分介绍了微控制器的处理器核心，包括执行指令集、性能特点和工作模式。 2. 片上存储器：说明了内置RAM和ROM的大小，以及如何在程序中使用它们。 3. 时钟、复位和电源管理：这一部分描述了如何配置和使用微控制器的时钟系统，以及相关的复位机制。此外，还包括了省电模式的介绍，如睡眠模式、待机模式等，以实现低功耗设计。 4. 引导模式：提供了微控制器的引导启动选项，例如从内置Flash、外部存储器或者通过串行接口启动。 5. 数模转换器（ADC）、模数转换器（DAC）、直接存储器访问（DMA）：详细说明了模拟信号的数字采样、数字信号的模拟输出以及DMA控制器如何在没有CPU介入的情况下直接在内存和外设之间传输数据。 6. 通用输入/输出（GPIOs）、定时器和PWM生成：GPIO部分详细介绍了如何配置和使用通用I/O引脚，包括数字输入、输出以及替代功能（如串口通信、外部中断等）。定时器部分则讲述了微控制器内置定时器的使用，包括计数器功能、事件捕获和脉冲宽度调制（PWM）输出。 7. 实时时钟（RTC）与备份寄存器：这一节讲解了如何使用内置的实时时钟模块进行日期和时间的跟踪。 8. 串行通信接口，包括I2C、SPI、USART/UART和I2S：详细介绍了用于不同串行通信的接口和它们的配置方法。 9. USB全速接口（USBFS）：描述了如何使用内置USB控制器实现与计算机或其他USB设备的通信。 10. 控制器局域网络（CAN）：提供了使用内置CAN控制器进行汽车或其他工业通信的信息。 11. 外部内存控制器（EXMC）：用于扩展外部存储器时，如何配置和使用该接口。 12. 安全数字输入输出卡接口（SDIO）：用于和SD卡通信的接口。 13. TFT LCD接口（TLI）：可用于驱动图形显示屏幕。 14. 调试模式：说明了如何利用内置的调试接口进行程序的调试。 15. 封装和操作温度：介绍了不同的物理封装以及微控制器的温度等级。三、电气特性电气特性部分提供了关于微控制器在电气性能方面的重要信息，如绝对最大额定值、推荐的直流特性、功耗、电磁兼容性（EMC）特性、电源监控特性、电气敏感性、外部和内部时钟特性、PLL特性、存储器、GPIO、ADC和DAC的电气特性。四、封装信息封装信息部分提供了LQFP封装的外部尺寸，并通过图表形式直观地展示。五、订货信息提供了关于如何订购这款微控制器的信息，包括不同封装选项和温度等级的产品。六、版本历史版本历史部分列出了该数据手册的修订记录，方便用户了解文档的最新更新情况。七、图纸索引提供了用于参考的图纸索引，包括了块图、不同封装引脚分布图等重要图形信息。以上知识点涵盖了GD32F205xx系列微控制器的数据手册的主要内容，为读者提供了一幅关于该微控制器功能和特性的全面图景。对于微控制器的开发者来说，这些都是必不可少的参考资料。

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GigaDevice Semiconductor Inc.

GD32F205xx

ARM

Cortex

-M3 32-bit MCU

Datasheet

GD32F205xx Datasheet

Table of Contents

Table of Contents ............................................................................................................... 1

List of Figures ..................................................................................................................... 3

List of Tables ....................................................................................................................... 4

1. General description ..................................................................................................... 5

2. Device overview ........................................................................................................... 6

2.1. Device information ........................................................................................................... 6

2.2. Block diagram .................................................................................................................. 8

2.3. Pinouts and pin assignment ........................................................................................... 9

2.4. Memory map ................................................................................................................... 12

2.5. Clock tree ........................................................................................................................ 15

2.6. Pin definitions ................................................................................................................ 16

2.6.1. GD32F205Zx LQFP144 pin definitions .................................................................................. 16

2.6.2. GD32F205Vx LQFP100 pin definitions ................................................................................. 25

2.6.3. GD32F205Rx LQFP64 pin definitions ................................................................................... 31

3. Functional description .............................................................................................. 35

3.1. ARM

Cortex

-M3 core .................................................................................................. 35

3.2. On-chip memory ............................................................................................................. 35

3.3. Clock, reset and supply management ......................................................................... 36

3.4. Boot modes..................................................................................................................... 36

3.5. Power saving modes ..................................................................................................... 37

3.6. Analog to digital converter (ADC) ................................................................................ 37

3.7. Digital to analog converter (DAC) ................................................................................ 38

3.8. DMA ................................................................................................................................. 38

3.9. General-purpose inputs/outputs (GPIOs) ................................................................... 38

3.10. Timers and PWM generation ..................................................................................... 39

3.11. Real time clock (RTC) and backup registers ........................................................... 40

3.12. Inter-integrated circuit (I2C) ...................................................................................... 40

3.13. Serial peripheral interface (SPI) ................................................................................ 41

3.14. Universal synchronous/asynchronous receiver transmitter (USART/UART) ..... 41

3.15. Inter-IC sound (I2S) .................................................................................................... 41

GD32F205xx Datasheet

3.16. Universal serial bus full-speed interface (USBFS) ................................................. 42

3.17. Controller area network (CAN) .................................................................................. 42

3.18. External memory controller (EXMC) ........................................................................ 42

3.19. Secure digital input and output card interface (SDIO) ........................................... 43

3.20. TFT LCD interface (TLI) .............................................................................................. 43

3.21. Debug mode ................................................................................................................ 43

3.22. Package and operation temperature ........................................................................ 43

4. Electrical characteristics .......................................................................................... 44

4.1. Absolute maximum ratings ........................................................................................... 44

4.2. Recommended DC characteristics .............................................................................. 44

4.3. Power consumption ....................................................................................................... 44

4.4. EMC characteristics ....................................................................................................... 45

4.5. Power supply supervisor characteristics ................................................................... 46

4.6. Electrical sensitivity ...................................................................................................... 47

4.7. External clock characteristics ...................................................................................... 48

4.8. Internal clock characteristics ....................................................................................... 49

4.9. PLL characteristics ........................................................................................................ 49

4.10. Memory characteristics ............................................................................................. 50

4.11. GPIO characteristics .................................................................................................. 50

4.12. ADC characteristics ................................................................................................... 51

4.13. DAC characteristics ................................................................................................... 51

4.14. I2C characteristics ...................................................................................................... 51

4.15. SPI characteristics ..................................................................................................... 52

5. Package information ................................................................................................. 53

5.1. LQFP package outline dimensions .............................................................................. 53

6. Ordering information ................................................................................................. 55

7. Revision history ......................................................................................................... 56

GD32F205xx Datasheet

List of Tables

Table 2-1. GD32F205xx devices features and peripheral list ..................................................................... 6

Table 2-2 GD32F205xx memory map ............................................................................................................ 12

Table 2-3. GD32F205Zx LQFP144 pin definitions ....................................................................................... 16

Table 2-4. GD32F205Vx LQFP100 pin definitions ....................................................................................... 25

Table 2-5. GD32F205Rx LQFP64 pin definitions ......................................................................................... 31

Table 4-1. Absolute maximum ratings .......................................................................................................... 44

Table 4-2. DC operating conditions ............................................................................................................... 44

Table 4-3. Power consumption characteristics ........................................................................................... 44

Table 4-4. EMS characteristics ...................................................................................................................... 45

Table 4-5. EMI characteristics ........................................................................................................................ 46

Table 4-6. Power supply supervisor characteristics.................................................................................. 46

Table 4-7. ESD characteristics ....................................................................................................................... 47

Table 4-8. Static latch-up characteristics .................................................................................................... 47

Table 4-9. High speed external clock (HXTAL) generated from a crystal/ceramic characteristics ... 48

Table 4-10. Low speed external clock (LXTAL) generated from a crystal/ceramic characteristics ... 48

Table 4-11. High speed internal clock (IRC8M) characteristics ................................................................ 49

Table 4-12. Low speed internal clock (IRC40K) characteristics ............................................................... 49

Table 4-13. PLL characteristics ...................................................................................................................... 49

Table 4-14. Flash memory characteristics ................................................................................................... 50

Table 4-15. I/O port characteristics ............................................................................................................... 50

Table 4-16. ADC characteristics..................................................................................................................... 51

Table 4-17. DAC characteristics..................................................................................................................... 51

Table 4-18. I2C characteristics ....................................................................................................................... 51

Table 4-19. Standard SPI characteristics ..................................................................................................... 52

Table 5-1. LQFP package dimensions .......................................................................................................... 54

Table 6-1. Part ordering code for GD32F205xx devices ............................................................................ 55

Table 7-1. Revision history ............................................................................................................................. 56