iSSD P4 Solid State Device ISSD P4 Design Manual
Rev 0.61
10/11/2010© 2010 SanDisk® Corporation 4 Document No. 80-11-xxxxx
Table of Contents
1. INTRODUCTION .............................................................................................................................. 7
2. EXTERNAL COMPONENT SPECIFICATIONS ....................................................................................... 8
2.1. CRYSTAL ...................................................................................................................................... 9
2.2. POWER SUPPLIES ........................................................................................................................... 9
2.2.1. 3.3V POWER SUPPLY ................................................................................................................... 9
2.2.2. 2.0V POWER SUPPLY ................................................................................................................... 9
2.2.3. 1.0V POWER SUPPLY ................................................................................................................... 9
2.3. POWER DISTRIBUTION ................................................................................................................... 10
2.4. SATA AC COUPLING CAPACITORS .................................................................................................... 10
3. MECHANICAL SPECIFICATION ........................................................................................................ 11
4. BALL ASSIGNMENTS ...................................................................................................................... 11
5. BALL AND SIGNAL DESCRIPTION ................................................................................................... 12
6. COMPONENT PLACEMENT AND ROUTING REQUIREMENTS .......................................................... 19
6.1. SATA DIFFERENTIAL SIGNALS ......................................................................................................... 19
6.2. POWER DISTRIBUTION ................................................................................................................... 19
6.3. SIMULATIONS MODELS .................................................................................................................. 21
7. THERMAL CONSIDERATIONS ......................................................................................................... 22
8. DEBUG .......................................................................................................................................... 23
8.1. JTAG ........................................................................................................................................ 23
8.2. DIAGNOSTIC TEST PIN ................................................................................................................... 23
9. REFERENCE DESIGN ....................................................................................................................... 24
9.1. SCHEMATIC ................................................................................................................................ 24
9.2. BILL OF MATERIALS (BOM)............................................................................................................ 24
9.3. LAYOUT ..................................................................................................................................... 24
9.4. PCB STACK-UP (INFORMATIVE) ....................................................................................................... 25