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Template For ENG STDS

WORLDWIDE

ENGINEERING

STANDARDS

General Specification GMW3172

General Specification for Electrical/Electronic Components –

Environmental/Durability

GM Confidential

April 2018

Page 1 of 120

Table of Contents .................................................................................................................................................. 1

1 Introduction......................................................................................................................................................... 6

1.1 Purpose. ...................................................................................................................................................... 6

1.2 Applicability. ................................................................................................................................................. 6

1.3 Remarks. Not applicable. ............................................................................................................................ 6

2 References ......................................................................................................................................................... 6

2.1 External Standards/Specifications. .............................................................................................................. 6

2.2 GM Standards/Specifications. ..................................................................................................................... 6

2.3 Additional References. ................................................................................................................................ 6

3 Parametric Definitions ........................................................................................................................................ 7

3.1 Temperature and Voltage Definitions. ......................................................................................................... 7

3.2 Parameter Tolerances. ................................................................................................................................ 7

3.3 Operating Types. ......................................................................................................................................... 8

3.4 Functional Status Classification (FSC). ....................................................................................................... 8

4 Process .............................................................................................................................................................. 9

4.1 A/D/V Process for Electrical/Electronic Components. ................................................................................. 9

4.2 A/D/V Process Flow.. ................................................................................................................................... 9

4.2.1 Test Flows. .......................................................................................................................................... 11

4.2.2 Environmental Hardware Design Review. .......................................................................................... 16

4.2.3 Analytical Activities. ............................................................................................................................ 18

4.2.4 Development Activities. ...................................................................................................................... 18

4.2.5 Design Validation Activities. ................................................................................................................ 18

4.2.6 Product Validation Activities. .............................................................................................................. 18

4.3 Summary of A/D/V Activities...................................................................................................................... 18

5 Requirements ................................................................................................................................................... 22

5.1 Reliability. .................................................................................................................................................. 22

5.2 Quoting Requirements. .............................................................................................................................. 22

5.2.1 Code Letter for Electrical Loads. ........................................................................................................ 23

5.2.2 Code Letter for Mechanical Loads. ..................................................................................................... 24

5.2.3 Code Letter for Temperature Loads. .................................................................................................. 25

5.2.4 Code Letter for Climatic Loads. .......................................................................................................... 26

5.2.5 Code Letter for Chemical Loads. ........................................................................................................ 27

GM WORLDWIDE ENGINEERING STANDARDS

Template For ENG STDS

GMW3172

GM Confidential

April 2018

Page 2 of 120

5.2.6 Code Letter for International Protection by Enclosures. ..................................................................... 28

5.2.7 Code Designation by Location in the Vehicle. .................................................................................... 30

6 Test Setup and Component Verification .......................................................................................................... 32

6.1 5-Point Functional/Parametric Check. ....................................................................................................... 32

6.2 1-Point Functional/Parametric Check. ....................................................................................................... 33

6.3 Continuous Monitoring. .............................................................................................................................. 33

6.4 Functional Cycling. .................................................................................................................................... 34

6.5 Visual Inspection and Dissection – DRBTR. ............................................................................................. 34

6.6 Cross Section and Inspection. ................................................................................................................... 37

6.7 Dimensional Check. ................................................................................................................................... 40

6.8 Vibration Transmissibility Demonstration. ................................................................................................. 40

6.9 Thermal Cycle Profile Development. ......................................................................................................... 44

6.10 Test Harness Requirements. ................................................................................................................... 45

6.10.1 Assembly or Procurement. ............................................................................................................... 45

7 Analysis ............................................................................................................................................................ 47

7.1 Analysis Mission. ....................................................................................................................................... 47

7.2 Electrical. ................................................................................................................................................... 47

7.2.1 Nominal and Worst Case Performance Analysis. ............................................................................... 47

7.2.2 Short/Open Circuit Analysis. ............................................................................................................... 47

7.3 Mechanical. ............................................................................................................................................... 48

7.3.1 Resonant Frequency Analysis. ........................................................................................................... 48

7.3.2 High Altitude Shipping Pressure Effect Analysis. ............................................................................... 48

7.3.3 Plastic Snap Fit Fastener Analysis. .................................................................................................... 49

7.3.4 Crush Analysis. ................................................................................................................................... 49

7.4 Climatic. ..................................................................................................................................................... 49

7.4.1 High Altitude Operation Overheating Analysis. .................................................................................. 49

7.4.2 Thermal Fatigue Analysis. .................................................................................................................. 50

7.5 Enclosure. None. ....................................................................................................................................... 51

7.6 Material. ..................................................................................................................................................... 51

7.6.1 Lead-Free Solder Analysis. ................................................................................................................ 51

8 Development .................................................................................................................................................... 51

8.1 Development Mission.. .............................................................................................................................. 51

8.2 Electrical. ................................................................................................................................................... 51

8.2.1 Jump Start. .......................................................................................................................................... 51

8.2.2 Reverse Polarity. ................................................................................................................................. 51

8.2.3 Over Voltage. ...................................................................................................................................... 52

8.2.4 State Change Waveform Characterization. ........................................................................................ 52

8.2.5 Ground Path Inductance Sensitivity.................................................................................................... 53

8.3 Mechanical. ............................................................................................................................................... 53

GM WORLDWIDE ENGINEERING STANDARDS

Template For ENG STDS

GMW3172

GM Confidential

April 2018

Page 3 of 120

8.3.1 Highly Accelerated Life Test (HALT). ................................................................................................. 53

8.4 Climatic. ..................................................................................................................................................... 54

8.4.1 Temperature Measurement. ............................................................................................................... 54

8.4.2 Low Temperature Wakeup. ................................................................................................................ 54

8.4.3 Frost. ................................................................................................................................................... 55

8.4.4 Highly Accelerated Stress Test (HAST).............................................................................................. 56

8.5 Enclosure. Not applicable. ......................................................................................................................... 57

8.6 Material. Not applicable. ............................................................................................................................ 57

9 Design Validation (DV) ..................................................................................................................................... 57

9.1 DV Mission. ............................................................................................................................................... 57

9.2 Electrical. ................................................................................................................................................... 57

9.2.1 Parasitic Current. ................................................................................................................................ 57

9.2.2 Power Supply Interruptions. ................................................................................................................ 57

9.2.3 Battery Voltage Dropout. .................................................................................................................... 58

9.2.4 Sinusoidal Superimposed Voltage. ..................................................................................................... 59

9.2.5 Pulse Superimposed Voltage. ............................................................................................................ 60

9.2.6 Intermittent Short Circuit to Battery and to Ground for Input/Output. ................................................. 62

9.2.7 Continuous Short Circuit to Battery and to Ground for Input/Output. ................................................. 62

9.2.8 Multiple Power and Multiple Ground Short Circuits Including Pass Through. .................................... 63

9.2.9 Open Circuit – Single Line Interruption. .............................................................................................. 65

9.2.10 Open Circuit – Multiple Line Interruption. ......................................................................................... 65

9.2.11 Ground Offset.. ................................................................................................................................. 65

9.2.12 Power Offset. .................................................................................................................................... 6 6

9.2.13 Discrete Digital Input Threshold Voltage. ......................................................................................... 67

9.2.14 Over Load – All Circuits. ................................................................................................................... 70

9.2.15 Over Load – Fuse Protected Circuits................................................................................................ 70

9.2.16 Insulation Resistance. ....................................................................................................................... 71

9.2.17 Crank Pulse Capability and Durability. ............................................................................................. 71

9.2.18 Switched Battery Lines. .................................................................................................................... 73

9.2.19 Battery Line Transients. .................................................................................................................... 75

9.3 Mechanical. ............................................................................................................................................... 77

9.3.1 Vibration with Thermal Cycling. .......................................................................................................... 77

9.3.2 Mechanical Shock – Pothole. ............................................................................................................. 84

9.3.3 Mechanical Shock – Collision. ............................................................................................................ 85

9.3.4 Mechanical Shock – Closure Slam. .................................................................................................... 85

9.3.5 Crush For Housing – Elbow Load. ...................................................................................................... 87

9.3.6 Crush For Housing – Foot Load. ........................................................................................................ 88

9.3.7 GMW3191 Connector Tests. .............................................................................................................. 89

9.3.8 Connector Installation Abuse – Side Force. ....................................................................................... 90

GM WORLDWIDE ENGINEERING STANDARDS

Template For ENG STDS

GMW3172

GM Confidential

April 2018

Page 4 of 120

9.3.9 Connector Installation Abuse – Foot Load. ........................................................................................ 91

9.3.10 Free Fall. ........................................................................................................................................... 92

9.3.11 Fretting Corrosion Degradation. ....................................................................................................... 93

9.4 Climatic. ..................................................................................................................................................... 93

9.4.1 High Temperature Degradation. ......................................................................................................... 93

9.4.2 Thermal Shock Air-To-Air (TS). .......................................................................................................... 94

9.4.3 Power Temperature Cycle (PTC). ...................................................................................................... 96

9.4.4 Thermal Shock/Water Splash. ............................................................................................................ 97

9.4.5 Humid Heat Cyclic (HHC). .................................................................................................................. 98

9.4.6 Humid Heat Constant (HHCO). ........................................................................................................ 100

9.4.7 Salt Mist. ........................................................................................................................................... 100

9.4.8 Salt Spray. ........................................................................................................................................ 101

9.4.9 Minimum Non-Operating Temperature. ............................................................................................ 103

9.5 Enclosure. ................................................................................................................................................ 103

9.5.1 Dust. .................................................................................................................................................. 103

9.5.2 Water. ............................................................................................................................................... 104

9.5.3 Seal. .................................................................................................................................................. 104

9.5.4 Leakage Check. ................................................................................................................................ 106

9.5.5 Water Freeze. ................................................................................................................................... 106

9.5.6 Sugar Water Function Impairment. ................................................................................................... 107

9.6 Material. None. ........................................................................................................................................ 107

10 Product Validation (PV) ................................................................................................................................ 107

10.1 PV Mission. T ........................................................................................................................................ 107

10.2 Electrical. ............................................................................................................................................... 107

10.3 Mechanical. ........................................................................................................................................... 107

10.3.1 Shipping Vibration. .......................................................................................................................... 107

10.4 Climatic. ................................................................................................................................................. 109

10.5 Enclosure. T .......................................................................................................................................... 109

10.6 Material. None. ...................................................................................................................................... 109

11 Provisions for Shipping ................................................................................................................................ 109

12 Notes ............................................................................................................................................................ 109

12.1 Glossary................................................................................................................................................. 109

12.2 Acronyms, Abbreviations, and Symbols. ............................................................................................... 109

13 Additional Paragraphs .................................................................................................................................. 111

13.1 All parts or systems supplied to this standard must comply with the requirements of GMW3059, Restricted

and Reportable Substances. ......................................................................................................................... 111

13.2 Environmental References. ................................................................................................................... 111

14 Coding System ............................................................................................................................................. 111

15 Release and Revisions ................................................................................................................................ 112

GM WORLDWIDE ENGINEERING STANDARDS

Template For ENG STDS

GMW3172

GM Confidential

April 2018

Page 5 of 120

Appendix A ........................................................................................................................................................ 113

A1 Lead-Free Solder Considerations ................................................................................................................ 113

Appendix B ........................................................................................................................................................ 114

B1 Requirements for GMW3172 Test Reporting .............................................................................................. 114

B1.1 Foreword. .............................................................................................................................................. 114

B1.2 Test Report Contents. ........................................................................................................................... 114

B1.3 Elements of the Test Report. ................................................................................................................ 115

B1.3.1 Title Page. ...................................................................................................................................... 115

B1.3.2 Test Set-Up Documentation. .......................................................................................................... 115

B1.3.3 Description of Test Procedure. ....................................................................................................... 116

B1.3.4 Reporting of Stress Inputs. ............................................................................................................. 117

B1.3.5 Test Results. ................................................................................................................................... 118

B1.3.6 Pass/Fail Summary Report. ........................................................................................................... 119

B1.3.7 Description of Non-Conformances. P ............................................................................................. 120

B1.4 Storage of Records. .............................................................................................................................. 120