目录
1 简介 ............................................................................ 2
2 天线原理 ...................................................................... 3
3 天线类型 ...................................................................... 4
4 天线的选择................................................................... 5
5 天线参数 ...................................................................... 6
6 赛普拉斯 PRoC/PSoC BLE 的天线 .............................. 9
7 赛普拉斯专有的 PCB 天线 ........................................... 9
7.1 蛇形倒 F 天线 (MIFA) ........................................ 10
7.2 天线馈电的考量 ................................................. 11
7.3 天线长度的考量 ................................................. 14
7.4 倒 F 天线 (IFA) .................................................. 15
8 芯片天线 .................................................................... 17
9 导线天线 .................................................................... 19
10 各种天线的比较 ......................................................... 20
11 外壳和接地层对天线性能的影响 ................................ 21
11.1 接地层的影响 .................................................... 21
11.2 外壳的影响 ........................................................ 22
12 天线放置、外壳、和接地层指南 ................................ 23
13 射频概念与术语 ......................................................... 24
13.1 史密斯圆图 ........................................................ 27
14 阻抗匹配 .................................................................... 28
14.1 匹配网络拓扑 .................................................... 30
14.2 匹配网络提示 .................................................... 34
15 天线调试 .................................................................... 34
15.1 调试过程............................................................ 35
16 RF 传输线 .................................................................. 42
16.1 微带线 ............................................................... 42
16.2 CPWG (带底部接地) ......................................... 43
16.3 RF 迹线布局注意事项 ........................................ 43
17 PCB 堆叠 ................................................................... 45
17.1 四层 PCB .......................................................... 45
17.2 两层 PCB .......................................................... 45
18 接地平面 .................................................................... 46
18.1 接地平面注意事项 ............................................. 46
19 电源解耦 .................................................................... 46
19.1 电源解耦布局注意事项 ...................................... 46
20 过孔 .......................................................................... 47
21 电容器和电感器 ......................................................... 48
21.1 电容器 ............................................................... 48
21.2 电感器 ............................................................... 50
22 可检验性设计 ............................................................. 51
23 支持外部功率放大器/低噪声放大器/ RF 前端 ............. 51
24 支持与 WiFi 共存 ........................................................ 52
24.1 空间隔离 ........................................................... 52
24.2 频率隔离 ........................................................... 52
24.3 时间隔离 ........................................................... 53
25 总结 .......................................................................... 53
26 相关应用笔记 ............................................................. 54
Appendix A. 检查清单 ................................................. 55
Appendix B. 参考资料 ................................................. 56
文档修订记录................................................................... 57
销售、解决方案以及法律信息.......................................... 58