OM8443-20 datasheet，最新芯片

The PAM consists of a 3G/4G PA blocks for low, high, and mid-bands, and a Multi-Function Control (MFC) block, RF

input/output ports internally matched to 50 ohm to reduce the number of external components. A CMOS integrated

circuit uses standard MIPI controls to provide the internal MFC interface and operation. Extremely low leakage current

maximizes handset standby time. The devices packaged in a small LGA package. (4.0 mm x 6.8 mm x 0.83 mm)