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高速电路设计__High-Speed_Board_Design

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高速电路设计__High-Speed_Board_Design

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eed Board Desi

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High Speed Board Design

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Layout and Routing

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Filtering

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Component Placement

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Board Stackups

Layer # 12345678910Comments

4 Layer S1 G P S2 Difficult to maintain high signal impedance

and low power impedance

6 Layer S1 G S2 S3 P S4 Lower Speed Design, poor power,

high signal impedance

6 Layer S1 S2 G P S3 S4 Default critical signals on S2 only

6 Layer S1 G S2 P G S3 Default lower-speed signals to S2 only

Preferred

8 Layer S1 S2 G S3 S4 P S5 S6 Default high-speed signals to S2-S3.

Has poor power impedance

8 Layer S1 G S2 G P S3 G S4 Best for EMC

Preferred

10 Layer S1 G S2 S3 G P S4 S5 G S6 Best for EMC. S4 susceptible to power

noise

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Layer Rules

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Split Power and Ground Planes

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20H Rule

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Use Orthogonal Routing on Adjacent

Layers to Minimize Coupling



Use Ground Stitching Vias to Create a

Solid Ground

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