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MIL-STD-188_124B_NOTICE-3.024882.pdf
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MIL-STD-188_124B_NOTICE-3.024882.pdf
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AMSC N/A AREA TCSS
DISTRIBUTION STATEMENT A - Approved for public release;
distribution is unlimited
.
MIL-STD-188-124B
NOTICE 3
18 December 2000
DEPARTMENT OF DEFENSE
INTERFACE STANDARD
GROUNDING, BONDING AND SHIELDING
TO ALL HOLDERS OF MIL-STD-188-124B
1. THE FOLLOWING PAGES OF MIL-STD-188-124B HAVE BEEN REVISED AND SUPERSEDE
THE PAGES LISTED:
NEW PAGE DATE SUPERSEDED PAGE DATE
i 1 February 1992 i Reprinted without change
ii 18 December 2000 ii 1 February 1992
v 18 December 2000 v 1 February 1992
vi 1 February 1992 vi Reprinted without change
1 18 December 2000 1 1 February 1992
2 1 February 1992 2 Reprinted without change
3 1 February 1992 3 Reprinted without change
4 18 December 2000 4 1 February 1992
15 18 December 2000 15 1 February 1992
16 18 December 2000 16 1 February 1992
17 18 December 2000 17 1 February 1992
18 18 December 2000 18 1 February 1992
31 18 December 2000 31 1 February 1992
32 1 February 1992 32 Reprinted without change
DD Form 1426 18 December 2000 DD Form 1426 1 February 1992
2. RETAIN THIS NOTICE AND INSERT BEFORE TABLE OF CONTENTS.
3. Holders of MIL-STD-188-124B will verify that page changes and additions indicated above have been
entered. This notice and page will be retained as a check sheet. This issuance, together with appended
pages, is a separate publication. Each notice is to be retained by stocking points until the military standards
is completely revised or canceled.
CUSTODIANS: Preparing Activity:
ARMY: AC DISA: DC1
AIR FORCE:02 (Project TCSS-0059)
NAVY: EC
DIA: DI
NSA: NS
USMC: MC
METRIC
NOTICE OF
CHANGE
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MIL-STD-188-124B
1 Feb 92
SUPERSEDING
MIL-STD-188-124A
2 FEBRUARY 1984
DEPARTMENT OF DEFENSE
INTERFACE STANDARD
GROUNDING, BONDING AND SHIELDING
for
Common Long Haul/Tactical Communication Systems
Including Ground Based Communications-
Electronics Facilities and Equipments
AMSC N/A AREA TCSS
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
METRIC
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MIL-STD-188-124B
SUPERSEDES PAGE ii OF MIL-STD-188-124B
ii
FOREWORD
1. This Military Standard is approved and mandatory for use by all Departments and Agencies of the
Department of Defense in accordance with Department of Defense Instruction 5000.2, dated 23 February 1991.
2. Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in
improving this document should be addressed to:DISA/JIEO Center For Standards, ATTN: JEBB, Fort Monmouth,
NJ, 07703-5613, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426)
appearing at the end of this document or by letter.
3. Standards for all military communications are published as part of a MIL-STD-188 series of documents: Military
Communications System Technical Standards are subdivided into Common Long Haul/Tactical Standards (MIL-
STD-188-100 series), Tactical Standards (MIL-STD-188-200 series) and Long Haul Standards (MIL-STD-188-300
series).
4. This document contains technical standards and design objectives to ensure the optimum performance of ground-
based telecommunications C-E equipment installations. This is accomplished by reducing noise and by providing
adequate protection against power system faults and lightning strikes. Thorough consideration must be given to the
grounding of equipment and facility installations, the bonding required, and the methods of shielding and
implementation needed for personnel safety and equipment control.
5. This standard is also recommended for applicable use on any ground facility or equipment where grounding,
bonding, shielding, personnel safety, lightning and EMC are required. Examples of such facilities are aircraft
simulators, computer centers, laboratory buildings, weapons checkout and assembly, etc.
6. Paragraph 5.1, Grounding, for this standard is divided as follows:
I. Detailed requirements for facilities, including buildings and associated structures used principally for
C-E equipment.
II. Detailed requirements for C-E equipment which address grounding, bonding, and shielding for
tactical/long haul fixed ground transportables and military communications electronics equipment
installations and associated subsystems.
7. Detailed requirements for Bonding and Shielding are contained in 5.2 and 5.3.
8. This standard is further implemented by MIL-HDBK-419; Grounding, Bonding, and Shielding for Electronic
Facilities and Equipments.
9. Notations are not used in this revision to identify changes with respect to the previous issue due to the
extensiveness of the changes.
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MIL-STD-188-124B
SUPERSEDES PAGE v OF MIL-STD-188-124B
v
CONTENTS (Con't)
Paragraph Page
5.1.2.1.1.2 Equipment Signal Ground Terminations ...................................................................21
5.1.2.1.1.3 Shield Terminations of Coaxial and Other Higher Frequency Cable.........................21
5.1.2.1.1.4 Overall Shields ..........................................................................................................21
5.1.2.2 Fault Protection Subsystem........................................................................................23
5.1.2.2.1 General ......................................................................................................................23
5.1.2.2.2 Personnel Protection..................................................................................................23
5.1.2.2.3 AC Power Neutral......................................................................................................23
5.1.2.2.4 Individual Power Line Filters ....................................................................................23
5.1.2.2.5 Convenience Outlets..................................................................................................23
5.1.2.2.6 Portable Equipment ...................................................................................................23
5.2 Bonding .....................................................................................................................24
5.2.1 General ......................................................................................................................24
5.2.2 Surface Platings or Treatments..................................................................................24
5.2.3 Bond Protection.........................................................................................................24
5.2.3.1 Corrosion Protection..................................................................................................24
5.2.3.2 Compression Bonds in Protected Areas.....................................................................24
5.2.3.3 Vibration....................................................................................................................24
5.2.3.3.1 Bonding Straps ..........................................................................................................25
5.2.4 Bond Resistance ........................................................................................................25
5.2.5 Materials....................................................................................................................25
5.2.5.1 Sweat Solder..............................................................................................................25
5.2.5.2 Brazing Solder...........................................................................................................25
5.2.5.3 Clamps.......................................................................................................................25
5.2.5.4 Nuts, Bolts and Washers............................................................................................25
5.2.6 Direct Bonds..............................................................................................................25
5.2.6.1 Welding .....................................................................................................................26
5.2.6.2 Brazing and Silver Soldering.....................................................................................26
5.2.6.3 Bonding of Copper to Steel .......................................................................................26
5.2.6.4 Soft Soldering............................................................................................................26
5.2.6.4.1 Sweat Soldering.........................................................................................................26
5.2.6.4.2 Sheet Metal or Duct Work.........................................................................................26
5.2.6.5 Bolting.......................................................................................................................26
5.2.6.6 C-Clamps and Spring Clamps....................................................................................27
5.2.7 Indirect Bonds ...........................................................................................................27
5.2.8 Surface Preparation....................................................................................................27
5.2.8.1 Area to be Cleaned ....................................................................................................27
5.2.8.2 Paint Removal............................................................................................................27
5.2.8.3 Inorganic Film Removal ............................................................................................27
5.2.8.4 Final Cleaning............................................................................................................27
5.2.8.4.1 Clad Metals................................................................................................................27
5.2.8.4.2 Aluminum Alloy........................................................................................................27
5.2.8.5 Completion of the Bond.............................................................................................27
5.2.9 Dissimilar Metals.......................................................................................................27
5.2.9.1 Corrosion Prevention.................................................................................................27
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