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FPGA可编程逻辑器件芯片XC7VX690T-2FFG1927中文规格书 fpga开发.pdf
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FPGA可编程逻辑器件芯片XC7VX690T-2FFG1927中文规格书 fpga开发.pdf
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FPGA可编程逻辑器件芯⽚可编程逻辑器件芯⽚ XC7VX690T-2FFG1927中⽂规格书中⽂规格书
with exemption 15 where there is lead in the C4 bumps that are used to complete a viable electrical connection between the
semiconductor die and the package substrate. The FFV, FBV, and SBV flip-chip packages marked with the Pb-free character are RoHS
6 of 6
compliant (without the use of exemption 15). The CPG, CSG, FTG, and FGG non-flip chip packages are RoHS 6 of 6 compliant.
All of the 7series devices supported in a particular package are pinout compatible. See Pin Compatibility between Packages, page33.
Pins that are available in a device but are not available in a smaller device with a compatible package are listed as No Connects.
Each device is split into I/O banks to allow for flexibility in the choice of I/O standards (see the 7Series FPGAs SelectIO Resources User
Guide (UG471). Table1-12 provides definitions for all pin types.
7series device’s flip-chip assembly materials are manufactured using ultra-low alpha (ULA) materials defined as <0.002cph/cm2 or
materials that emit less than 0.002 alpha-particles per square centimeter per hour.
Device/Package Combinations and Maximum I/Os
Table1-1 shows the maximum number of user I/Os possible in the 7series FPGAs BGA
packages.
Table 1-1:7Series FPGAs Package Specifications
Packages(1)Description
Package Specifications
Package Type Pitch(mm)Size(mm)Maximum I/Os(2)
CPGA196
Wire-bond
chip-scale BGA0.58x8100
FTB196/FTGB196BGA 1.015 x 15100 CP236/CPG236BGA0.510x10106 CPG238BGA0.510x10110
CSA225/CSGA225BGA0.813x13100 CS324/CSG324BGA0.815 x 15210 CSGA324BGA0.815 x 15210 CS325/CSG325BGA0.815 x
15150
FT256/FTG256
Wire-bond fine-pitch BGA 1.017 x 17170
FG484/FGG484BGA 1.023 x 23285 FGGA484BGA 1.023 x 23338 FG676/FGG676BGA 1.027 x 27300 FGGA676BGA 1.027 x 27400
Kintex-7 device/package combination.
Table 1-9:Available I/O Pin/Device/Package Combinations for Kintex-7 FPGAs
Kintex-7 Devices User I/O
Pins
Kintex-7 FPGA Packages: HR and HP I/O Banks
FBG484
FBV484
FBG676
FBV676
FBG900
FBV900
FFG676
FFV676
FFG900
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