Marionette DAQ 项目的原理图和电路板设计文件_python_Jupyter_代码_下载_设计_文档_相关文件

<h1 id="fab-header"> "Marionette" ("DK") PCB Manufacturing ("fab") Information </h1> <h1 id="assembly-header"> APDM "Marionette" ("DK") PCB Assembly ("PCBA") Information </h1> # Overview ### CURRENT PCB NAME AND VERSION: "DK-2.2" ### CURRENT PCBA NAME AND VERSION: "DK-2.2" Ver | Date | Notes ------|------------|------------------------------------------------------------ 2.0 | 2015-12-01 | Marionette V2.0 2.1 | 2016.05.26 | Marionette V2.1 2.2 | 2019.02.01 | Marionette V2.2 ## Description The Marionette PCBA is 150 x 95 mm four layer PCB with a mix of through-hole and SMT components on the top side. <h1 class="pdf" id="fab-pdf:fab" task="pdf:fab"/> <h1 class="pdf" id="assembly-pdf:assembly" task="pdf:assembly"/> <h1 id="assembly-images"> </h1>   Images of the Marionette v2.2 <h1 id="fab-info"> Printed Circuit Board (PCB) Fabrication information </h1> - 4 layers, 1.59 mm (0.0625 inches) thick PCB - PCB bounding box size is 150 mm x 95 mm (5.9 x 3.74 inches) - Minimum Trace / Space design rules - Outer layers: 0.15 mm (6.0 mil) - Inner layers: 0.2000 mm (7.8 mil) - Outer dimension router tolerance: +/- 0.127 mm (0.005 in) - Hole placement tolerance: .075 mm (+/-0.003 inch) - Inner tab routed slot tolerance: +/- 0.127 mm (5 mil) - Plated/Un-plated holes - There are 7 un-plated holes - There are 1304 plated through holes - PTH minimum diameter: 0.254 mm (10 mil) - PTH minimum annulus: 0.127 mm (5 mil) radius - Plated slots - There 0 interior plated slots - There are 3 fiducials - 3 on the top layer - Panel tabs - Board does not yet have marked tabs. - (Ignore for now) Do NOT place tabs anywhere else. - Controlled impedance - While this board is no controlled impedance, the stackup is critical for performance of high speed signals (USB 2.0 high speed @ 480 Mbps) - If not otherwise specified, build to IPC 6012 Class 2 or better. ## Materials - Board thickness is 1.59 mm (0.063 inch) +/- 2 mil) - Isola 370HR or equivalent - Laminate material MUST be Isola 370HR or equivalent (including an equivalent Dk). - Must have a flammability rating of at least V-0 (according to UL 94). - Must have a Dielectric Constant of ~ 4.5 at 1 MHz. - Board Surface treatment should be ENIG, althogh immersion Silver is acceptable. - White silkscreen on top and bottom surface - Taiyo PSR-4000 or equivalent green soldermask on top and bottom ## Stack up - Top and bottom prepreg thickness **MUST** be 0.111mm (4.4 mil) because of microstrips. | Layer | Thickness | Notes | |---------------|---------------------|----------------------------------------------| | Top Copper | 0.043 mm / 1.7 mil | Layer 1 foil, 1 oz Cu after plating | | prepreg | 0.111 mm / 4.4 mil | Prepreg Isola 370HR - 2x "1080" | | Layer 2 | 0.036 mm / 1.4 mil | Layer 2 foil, 1 oz Cu | | Core | 1.207 mm / 47.5 mil | Core Isola 370HR | | Layer 3 | 0.036 mm / 1.4 mil | Layer 3 foil, 1 oz Cu | | prepreg | 0.111 mm / 4.4 mil | Prepreg Isola 370HR - 2x "1080" | | Bottom Copper | 0.043 mm / 1.7 mil | Layer 4 foil, 1 oz copper after plating | | **Total Stackup** | **1.588 mm / 62.5 mil** | | ## Array / Panel Information - Coordinate with Contract Manufacturer (CM) for optimal size of this panel - If no feedback from CM, then: - Panelize single board into apropriate sized array. Example: 5 x 3 array. - Use only "TAB" locations for attachment tabs - Use a ~ 6 mm (0.25 in) frame around the entire outside panel. <div style="page-break-before: always;"></div> ## Fabrication Files ### PCB Artwork | Filename | Notes | | --------------------- | --------------------------------------------- | | marionette.outline.gbx | RS274X file for the dimension (outline) layer | | marionette.milling.gbx | RS274X file for internal milling | | marionette.xln | Excellon drill file | | marionette.topsilk.gbx | RS274X file for the top silkscreen | | marionette.topmask.gbx | RS274X file for the top soldermask | | marionette.toplayer.gbx | RS274X file for the top copper layer | | marionette.layer2.gbx | RS274X file for the layer 2 copper | | marionette.layer3.gbx | RS274X file for the layer 3 copper | | marionette.bottomlayer.gbx | RS274X file for the bottom copper layer | | marionette.bottommask.gbx | RS274X file for the bottom soldermask | | marionette.bottomsilk.gbx | RS274X file for the bottom silkscreen | ### Documentation | Filename | Notes | | ------------------- | --------------------------------------- | | marionette.doc.gbx | RS274X file for documentation | | marionette.ipc | IPC-D-356 netlist and board layout file | ### Stencils | Filename | Notes | | ------------------------ | ------------------------------------ | | marionette.toppaste.gbx | RS274X file for solder paste stencil | <h1 id="assembly-info"> <div style="page-break-before: always;"></div> Printed Circuit Board Assembly (PCBA) Information </h1> ## Assembly info - Assemble to IPC Class 2 or better - Assemble with leaded solder - Aqueous flux and wash. - There are 9 placements of 4 different components that require through hole soldering: - 6x Hirose ZX80-B-5SA microUSB vertical connectors (J5101 - J5106) - 1x CUI PJ-047AH 5.5mm x 2.1mm barrel power connector (J5001) - 1x Hirose ZX62D-B-5P8 USB micro connector (CF5101) - 1x FCI 73725-0110BLF USB Type-A vertical RA connector (J5107 - The J22 ZX62D-B-5P8 made by Hirose. This is a hybrid through hole and SMT part. **Beware solder ingress from J22 shield pins into the USB chamber.** If there is solder ingress into the connector, please use a micro B USB female connector to press into the J22 and clear the excess solder. <div style="page-break-before: always;"></div> ## Assembly Files ### Mounting location files | Filename | Description | | -------------------- | ------------------------------------------- | | marionette.mnt | Pick and place locations for components | ### Standard netlist/layout files Not ready yet | Filename | Description | | -------------------- | --------------------------------------- | | marionette.ipc | IPC-D-356 netlist and board layout file | ### Stencils | Filename | Notes | | ------------------------------ | ------------------------------------ | | marionette.toppaste.gbx | RS274X file for solder paste stencil | ### Bill of materials There is the option of populating the 26 MHz clock with a TCXO or an XTAL with associated filter networks. The ATTRIBUTE: 'NO_MNT' indicates whether the component should be populated. | Filename | Description | | --------------------------- | ---------------------------------- | | bom/marionette_bom.xls | BOM with TCXO/XTAL population variants |