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lpc177x_8x.pdf LPC177x和LPC178X系列数据手册
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lpc177x_8x.pdf LPC177x和LPC178X系列数据手册 英文版的 32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and 96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC
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1. General description
The LPC178x/7x is an ARM Cortex-M3 based microcontroller for embedded applications
requiring a high level of integration and low power dissipation.
The Cortex-M3 is a next generation core that offers better performance than the ARM7 at
the same clock rate and other system enhancements such as modernized debug features
and a higher level of support block integration. The Cortex-M3 CPU incorporates a
3-stage pipeline and has a Harvard architecture with separate local instruction and data
buses, as well as a third bus with slightly lower performance for peripherals. The
Cortex-M3 CPU also includes an internal prefetch unit that supports speculative
branches.
The LPC178x/7x adds a specialized flash memory accelerator to accomplish optimal
performance when executing code from flash. The LPC178x/7x is targeted to operate at
up to 100 MHz CPU frequency.
The peripheral complement of the LPC178x/7x includes up to 512 kB of flash program
memory, up to 96 kB of SRAM data memory, up to 4 kB of EEPROM data memory,
External Memory controller (EMC), LCD (LPC178x only), Ethernet, USB
Device/Host/OTG, a General Purpose DMA controller, five UARTs, three SSP controllers,
three I
2
C-bus interfaces, one eight-channel, 12-bit ADC, a 10-bit DAC, a Quadrature
Encoder Interface, four general purpose timers, two general purpose PWMs with six
outputs each, an ultra-low power RTC with separate battery supply, a windowed watchdog
timer, a CRC calculation engine, up to 165 general purpose I/O pins, and more. The
pinout of LPC178x/7x is intended to allow pin function compatibility with the LPC24xx and
LPC23xx.
2. Features and benefits
Functional replacement for LPC23xx and 24xx family devices.
System:
ARM Cortex-M3 processor, running at frequencies of up to 100 MHz. A Memory
Protection Unit (MPU) supporting eight regions is included.
ARM Cortex-M3 built-in Nested Vectored Interrupt Controller (NVIC).
Multilayer AHB matrix interconnect provides a separate bus for each AHB master.
AHB masters include the CPU, and General Purpose DMA controller. This
interconnect provides communication with no arbitration delays unless two masters
attempt to access the same slave at the same time.
Split APB bus allows for higher throughput with fewer stalls between the CPU and
DMA. A single level of write buffering allows the CPU to continue without waiting for
completion of APB writes if the APB was not already busy.
LPC178x/7x
32-bit ARM Cortex-M3 microcontroller; up to 512 kB flash and
96 kB SRAM; USB Device/Host/OTG; Ethernet; LCD; EMC
Rev. 00.08 — 1 March 2011 Objective data sheet
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LPC178x_7x All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Objective data sheet Rev. 00.08 — 1 March 2011 2 of 112
NXP Semiconductors
LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
Cortex-M3 system tick timer, including an external clock input option.
Standard JTAG test/debug interface as well as Serial Wire Debug and Serial
WireTrace Port options.
Emulation trace module supports real-time trace.
Boundary scan for simplified board testing.
Non-maskable Interrupt (NMI) input.
Memory:
512 kB on-chip flash program memory with In-System Programming (ISP) and
In-Application Programming (IAP) capabilities. The combination of an enhanced
flash memory accelerator and location of the flash memory on the CPU local
code/data bus provides high code performance from flash.
96 kB on-chip SRAM includes:
64 kB of SRAM on the CPU with local code/data bus for high-performance CPU
access.
Two 16 kB SRAM blocks with separate access paths for higher throughput. These
SRAM blocks may be used for DMA memory as well as for general purpose
instruction and data storage.
4 kB on-chip EEPROM.
LCD controller, supporting both Super-Twisted Nematic (STN) and Thin-Film
Transistors (TFT) displays.
Dedicated DMA controller.
Selectable display resolution (up to 1024 × 768 pixels).
Supports up to 24-bit true-color mode.
External Memory Controller (EMC) provides support for asynchronous static memory
devices such as RAM, ROM and flash, as well as dynamic memories such as single
data rate SDRAM.
Eight channel General Purpose DMA controller (GPDMA) on the AHB multilayer
matrix that can be used with the SSP, I2S, UART, CRC engine, Analog-to-Digital and
Digital-to-Analog converter peripherals, timer match signals, GPIO, and for
memory-to-memory transfers.
Serial interfaces:
Ethernet MAC with MII/RMII interface and associated DMA controller. These
functions reside on an independent AHB.
USB 2.0 full-speed dual port device/host/OTG controller with on-chip PHY and
associated DMA controller.
Five UARTs with fractional baud rate generation, internal FIFO, DMA support, and
RS-485/EIA-485 support. One UART (UART1) has full modem control I/O, and one
UART (UART4) supports IrDA, synchronous mode, and a smart card mode
conforming to ISO7816-3.
Three SSP controllers with FIFO and multi-protocol capabilities. The SSP
interfaces can be used with the GPDMA controller.
Three enhanced I2C-bus interfaces, one with a true open-drain output supporting
the full I2C-bus specification and Fast-mode Plus with data rates of 1 Mbit/s, two
with standard port pins. Enhancements include multiple address recognition and
monitor mode.
I
2
S (Inter-IC Sound) interface for digital audio input or output. It can be used with
the GPDMA.
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LPC178x_7x All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Objective data sheet Rev. 00.08 — 1 March 2011 3 of 112
NXP Semiconductors
LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
CAN controller with two channels.
Digital peripherals:
SD/MMC memory card interface.
Up to 165 General Purpose I/O (GPIO) pins depending on the packaging, with
configurable pull-up/down resistors, open-drain mode, and repeater mode. All
GPIOs are located on an AHB bus for fast access and support Cortex-M3
bit-banding. GPIOs can be accessed by the General Purpose DMA Controller. Any
pin of ports 0 and 2 can be used to generate an interrupt.
Two external interrupt inputs configurable as edge/level sensitive. All pins on
PORT0 and PORT2 can be used as edge sensitive interrupt sources.
Four general purpose timers/counters, with a total of eight capture inputs and ten
compare outputs. Each timer block has an external count input. Specific timer
events can be selected to generate DMA requests.
Quadrature encoder interface that can monitor one external quadrature encoder.
Two standard PWM/timer blocks with external count input option.
Real-Time Clock (RTC) with a separate power domain. The RTC is clocked by a
dedicated RTC oscillator. The RTC block includes 20 bytes of battery-powered
backup registers, allowing system status to be stored when the rest of the chip is
powered off. Battery power can be supplied from a standard 3 V Lithium button cell.
The RTC will continue working when the battery voltage drops to as low as 2.1 V.
An RTC interrupt can wake up the CPU from any reduced power mode.
Windowed Watchdog Timer (WWDT). Windowed operation, dedicated internal
oscillator, watchdog warning interrupt, and safety features.
CRC Engine block can calculate a CRC on supplied data using one of three
standard polynomials. The CRC engine can be used in conjunction with the DMA
controller to generate a CRC without CPU involvement in the data transfer.
Analog peripherals:
12-bit Analog-to-Digital Converter (ADC) with input multiplexing among eight pins,
conversion rates up to 400 kHz, and multiple result registers. The 12-bit ADC can
be used with the GPDMA controller.
10-bit Digital-to-Analog Converter (DAC) with dedicated conversion timer and DMA
support.
Power control:
Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep
power-down.
The Wake-up Interrupt Controller (WIC) allows the CPU to automatically wake up
from any priority interrupt that can occur while the clocks are stopped in
Deep-sleep, Power-down, and Deep power-down modes.
Processor wake-up from Power-down mode via any interrupt able to operate
during Power-down mode (includes external interrupts, RTC interrupt, PORT0/2
pin interrupt, and NMI).
Brownout detect with separate threshold for interrupt and forced reset.
On-chip Power-On Reset (POR).
Clock generation:
Clock output function that can reflect the main oscillator clock, IRC clock, RTC
clock, CPU clock, USB clock, or the watchdog timer clock.
On-chip crystal oscillator with an operating range of 1 MHz to 25 MHz.
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LPC178x_7x All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Objective data sheet Rev. 00.08 — 1 March 2011 4 of 112
NXP Semiconductors
LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
12 MHz Internal RC oscillator (IRC) trimmed to 1% accuracy that can optionally be
used as a system clock.
An on-chip PLL allows CPU operation up to the maximum CPU rate without the
need for a high-frequency crystal. May be run from the main oscillator or the
internal RC oscillator.
A second, dedicated PLL may be used for USB interface in order to allow added
flexibility for the Main PLL settings.
Versatile pin function selection feature allows many possibilities for using on-chip
peripheral functions.
Unique device serial number for identification purposes.
Single 3.3 V power supply (2.4 V to 3.6 V). Temperature range of −40 °C to 85 °C.
Available as LQFP208, TFBGA208, TFBGA180, and LQFP144 package.
3. Applications
<tbd>
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LPC178x_7x All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Objective data sheet Rev. 00.08 — 1 March 2011 5 of 112
NXP Semiconductors
LPC178x/7x
32-bit ARM Cortex-M3 microcontroller
4. Ordering information
Table 1. Ordering information
Type number Package
Name Description Version
LPC1788
LPC1788FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT459-1
LPC1788FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body
15 × 15 × 0.7 mm
SOT950-1
LPC1788FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 × 12 × 0.8 mm SOT570-2
LPC1788FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 × 20 × 1.4 mm SOT486-1
LPC1787
LPC1787FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT459-1
LPC1786
LPC1786FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT459-1
LPC1785
LPC1785FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT459-1
LPC1778
LPC1778FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT459-1
LPC1778FET208 TFBGA208 plastic thin fine-pitch ball grid array package; 208 balls; body
15 × 15 × 0.7 mm
SOT950-1
LPC1778FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 × 12 × 0.8 mm SOT570-2
LPC1778FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20 × 20 × 1.4 mm SOT486-1
LPC1777
LPC1777FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT459-1
LPC1776
LPC1776FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT459-1
LPC1776FET180 TFBGA180 thin fine-pitch ball grid array package; 180 balls; body 12 × 12 × 0.8 mm SOT570-2
LPC1774
LPC1774FBD208 LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm SOT459-1
LPC1774FBD144 LQFP144 plastic low profile quad flat package; 144 leads; body 20
× 20 × 1.4 mm
SOT486-1
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