ADXL362传感器说明手册资源-CSDN文库

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ADXL362传感器是一款超低功耗的三轴MEMS振动加速度计，它具有数字输出接口，适用于各种需要节省电量的应用场合。小米手环就是利用这款传感器来检测用户的运动状态和心率等信息，其值守功率可以低至几个微安（uA）。ADXL362传感器的数字输出可直接通过SPI（串行外设接口）进行通信，便于集成和数据交换。以下详细说明ADXL362传感器的重要知识点： 1. 超低功耗特性：ADXL362传感器的功耗极低，可以在100Hz的输出数据率下消耗少于2微安的电流，而在运动触发唤醒模式下更是可以低至270纳安（nA）。这使得它非常适用于那些需要电池寿命尽可能长的应用，例如助听器、家庭医疗设备和无线传感器。 2. 电源电压范围：ADXL362的电源电压范围广泛，介于1.6V至3.5V，其操作电压范围为1.8V至3.3V，这意味着它可以使用小容量的纽扣电池供电。 3. 数字输出：ADXL362提供数字输出，确保了高分辨率和易于处理的数据。其输出分辨率为1mg/LSB，并且支持12位输出分辨率。 4. 运动检测唤醒模式：该传感器具有运动检测唤醒模式（motion activated wake-up mode），这一模式下功耗更低，只需270纳安。 5. 内置的省电功能：ADXL362具备多种内置系统级省电特性，比如可调整的阈值睡眠/唤醒模式以实现运动激活，以及自主中断处理，这些都不需要微控制器的干预，能够让系统的其余部分完全关闭。 6. FIFO（先进先出）存储器：ADXL362内置的FIFO存储器可以减少主机处理器的负载，支持系统级的功率节省。 7. 多种活动检测模式：传感器具有多种活动检测模式，包括可调整阈值的睡眠和唤醒操作，这对于省电非常有帮助。 8. 高精度测量范围：ADXL362提供了±2g、±4g和±8g的测量范围，其中±2g范围下的分辨率为1mg/LSB。 9. 芯片温度传感器：ADXL362内建了一个微功率温度传感器，能够实时监测设备的温度变化。 10. SPI数字接口：这款传感器通过SPI数字接口进行通信，以提高数据传输的效率。 11. 小巧的封装尺寸：ADXL362的封装尺寸非常小，仅为3mm×3.25mm×1.06mm，这对于空间受限的应用场合是非常有利的。 12. 应用领域：ADXL362传感器适用于多种应用，如运动激活的省电开关、运动检测的计量设备等。 13. 采样同步：ADXL362可以通过外部触发进行加速度样本同步。总结来说，ADXL362传感器以其超低的功耗、三轴检测能力、高分辨率、小巧的封装尺寸和丰富的省电功能，在移动设备、健康监测、智能家居和多种便携式设备中得到广泛应用。其设计初衷和特点也体现了当前物联网和可穿戴设备对低功耗需求的重要性。

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Micropower, 3-Axis, ±2 g/±4 g/±8 g

Digital Output MEMS Accelerometer

Data Sheet

ADXL362

Rev. D Document Feedback

Information furnished by Analog Devices is believed to be accurate and reliable. However, no

responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other

rights of third parties that may result from its use. Specifications subject to change without notice. No

license is granted by implication or otherwise under any patent or patent rights of Analog Devices.

Trademarks and registered trademarks are the property of their respective owners.

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Technical Support www.analog.com

FEATURES

Ultralow power

Power can be derived from coin cell battery

1.8 μA at 100 Hz ODR, 2.0 V supply

3.0 μA at 400 Hz ODR, 2.0 V supply

270 nA motion activated wake-up mode

10 nA standby current

High resolution: 1 mg/LSB

Built-in features for system-level power savings:

Adjustable threshold sleep/wake modes for motion

activation

Autonomous interrupt processing, without need for

microcontroller intervention, to allow the rest of the

system to be turned off completely

Deep embedded FIFO minimizes host processor load

Awake state output enables implementation of

standalone, motion activated switch

Low noise down to 175 μg/√Hz

Wide supply and I/O voltage ranges: 1.6 V to 3.5 V

Operates off 1.8 V to 3.3 V rails

Acceleration sample synchronization via external trigger

On-chip temperature sensor

SPI digital interface

Measurement ranges selectable via SPI command

Small and thin 3 mm × 3.25 mm × 1.06 mm package

APPLICATIONS

Hearing aids

Home healthcare devices

Motion enabled power save switches

Wireless sensors

Motion enabled metering devices

GENERAL DESCRIPTION

The ADXL362 is an ultralow power, 3-axis MEMS accelerometer

that consumes less than 2 μA at a 100 Hz output data rate and

270 nA when in motion triggered wake-up mode. Unlike

accelerometers that use power duty cycling to achieve low power

consumption, the ADXL362 does not alias input signals by

undersampling; it samples the full bandwidth of the sensor at all

data rates.

The ADXL362 always provides 12-bit output resolution; 8-bit

formatted data is also provided for more efficient single-byte

transfers when a lower resolution is sufficient. Measurement

ranges of ±2 g, ±4 g, and ±8 g are available, with a resolution of

1 mg/LSB on the ±2 g range. For applications where a noise level

lower than the normal 550 μg/√Hz of the ADXL362 is desired,

either of two lower noise modes (down to 175 μg/√Hz typical)

can be selected at minimal increase in supply current.

In addition to its ultralow power consumption, the ADXL362

has many features to enable true system level power reduction.

It includes a deep multimode output FIFO, a built-in micropower

temperature sensor, and several activity detection modes including

adjustable threshold sleep and wake-up operation that can run

as low as 270 nA at a 6 Hz (approximate) measurement rate. A

pin output is provided to directly control an external switch when

activity is detected, if desired. In addition, the ADXL362 has

provisions for external control of sampling time and/or an

external clock.

The ADXL362 operates on a wide 1.6 V to 3.5 V supply range,

and can interface, if necessary, to a host operating on a separate,

lower supply voltage. The ADXL362 is available in a 3 mm ×

3.25 mm × 1.06 mm package.

FUNCTIONAL BLOCK DIAGRAM

DDI/O

GND

3-AXIS

MEMS

SENSOR

TEMPERATURE

SENSOR

AXIS

DEMODULATORS

ANTIALIASING

FILTERS

ADXL362

12-BIT

ADC

DIGITAL

LOGIC,

FIFO,

AND

SPI

INT1

INT2

MOSI

MISO

SCLK

10776-001

Figure 1.

ADXL362 Data Sheet

Rev. D | Page 2 of 43

TABLE OF CONTENTS

Features .............................................................................................. 1

Applications ....................................................................................... 1

General Description ......................................................................... 1

Functional Block Diagram .............................................................. 1

Revision History ............................................................................... 3

Specifications ..................................................................................... 4 

Absolute Maximum Ratings ............................................................ 6

Thermal Resistance ...................................................................... 6

Package Information .................................................................... 6

Recommended Soldering Profile ............................................... 6

ESD Caution .................................................................................. 6

Pin Configuration and Function Descriptions ............................. 7

Typical Performance Characteristics ............................................. 8

Theory of Operation ...................................................................... 13

Mechanical Device Operation .................................................. 13

Operating Modes ........................................................................ 13

Selectable Measurement Ranges ............................................... 13

Selectable Output Data Rates .................................................... 13

Power/Noise Tradeoff ................................................................ 14

Power Savings Features .................................................................. 15

Ultralow Power Consumption in All Modes .......................... 15

Motion Detection ....................................................................... 15

FIFO ............................................................................................. 17

Communications ........................................................................ 17

Additional Features ........................................................................ 18

Free Fall Detection ..................................................................... 18

External Clock ............................................................................ 18

Synchronized Data Sampling .................................................... 18

Self Test ........................................................................................ 18

User Register Protection ............................................................ 18

Temperature Sensor ................................................................... 18

Serial Communications ................................................................. 19

SPI Commands ........................................................................... 19

Multibyte Transfers .................................................................... 19

Invalid Addresses and Address Folding .................................. 19

Latency Restrictions ................................................................... 19

Invalid Commands ..................................................................... 19

Device ID Register ..................................................................... 24

Device ID: 0x1D Register .......................................................... 24

Part ID: 0xF2 Register ................................................................ 24

Silicon Revision ID Register ..................................................... 24

X-Axis Data (8 MSB) Register .................................................. 24

Y-Axis Data (8 MSB) Register .................................................. 24

Z-Axis Data (8 MSB) Register .................................................. 24

Status Register ............................................................................. 25

FIFO Entries Registers ............................................................... 26

X-Axis Data Registers ................................................................ 26

Y-Axis Data Registers ................................................................ 26

Z-Axis Data Registers ................................................................ 26

Temperature Data Registers ...................................................... 26

Soft Reset Register ...................................................................... 26

Activity Threshold Registers ..................................................... 27

Activity Time Register ............................................................... 27

Inactivity Threshold Registers .................................................. 27

Inactivity Time Registers ........................................................... 27

Activity/Inactivity Control Register ........................................ 29

FIFO Control Register ............................................................... 30

FIFO Samples Register .............................................................. 31

INT1/INT2 Function Map Registers ....................................... 31

Filter Control Register ............................................................... 33

Power Control Register ............................................................. 34

Self Test Register ......................................................................... 35

Applications Information .............................................................. 36

Application Examples ................................................................ 36

Power ............................................................................................ 37

FIFO Modes ................................................................................ 38

Inter rupts ..................................................................................... 39

Using Synchronized Data Sampling ........................................ 40

Using an External Clock ............................................................ 41

Using Self Test ............................................................................. 41

Operation at Voltages Other Than 2.0 V ................................ 41

Mechanical Considerations for Mounting .............................. 41

Axes of Acceleration Sensitivity ............................................... 42

Layout and Design Recommendations ................................... 42

Outline Dimensions ....................................................................... 43

Ordering Guide .......................................................................... 43

Data Sheet ADXL362

Rev. D | Page 3 of 43

REVISION HISTORY

11/15—Rev. C to Rev. D

Change to Sensor Resonant Frequency Parameter, Table 1......... 4

Added Endnote 4, Table 1 ................................................................ 4

Changes to Figure 10 ........................................................................ 8

Changes to Selectable Measurement Ranges Section ................ 13

Changes to Bus Keepers Section ................................................... 17

Changes to Figure 36 to Figure 40 ................................................ 20

Changes to Figure 41 and Figure 42 ............................................. 21

Changes to Table 10 ........................................................................ 22

Change to Start-Up Routine Section ............................................ 37

Change to Table 22 .......................................................................... 41

Updated Outline Dimensions ........................................................ 43

12/14—Rev. B to Rev. C

Changes to Table 1 ............................................................................ 4

Changes to Figure 14 and Figure 15 ............................................... 9

Change to Serial Communications Section ................................. 19

Change to Table 10 .......................................................................... 22

Changes to Soft Reset Register Section ........................................ 26

Changes to Example: Implementing Free Fall Detection

Section .............................................................................................. 37

Changes to Using Self Test Section and Table 22 ........................ 41

Changes to Figure 51 ...................................................................... 42

Updated Outline Dimensions ........................................................ 43

2/13—Rev. A to Rev. B

Change to Figure 7 ............................................................................ 8

Changes to Figure 11, Figure 12, and Figure 13 ............................ 9

Changes to Table 7 and Table 8 ..................................................... 14

Changes to Figure 31 ...................................................................... 16

Change to Table 10 .......................................................................... 22

Change to Bit 6, Table 12 ................................................................ 25

Changes to Inactivity Time Registers Section ............................. 28

Change to LINK/LOOP Bit, Table 13 ........................................... 29

Change to ODR Bit, Table 17 ......................................................... 33

Changes to Figure 43, Figure 44, and Figure 45 .......................... 36

Changes to Start-up Routine Section, Figure 46, and

Figure 47 ........................................................................................... 37

Change to Figure 52 ........................................................................ 42

9/12—Rev. 0 to Rev. A

Moved Revision History Section ..................................................... 3

Changes to Linking Activity and Inactivity Detection Section;

Added Figure 31, Figure 32, and Figure 33, Renumbered

Sequentially ...................................................................................... 16

Change to Table 13 .......................................................................... 29

Changes to Figure 44 ...................................................................... 36

Moved Power Supply Decoupling Section ................................... 37

Added Power Section, Power Supply Requirements Section, and

Figure 47 ........................................................................................... 37

Updated Outline Dimensions ........................................................ 43

Changes to Ordering Guide ........................................................... 43

8/12—Revision 0: Initial Version

剩余42页未读，继续阅读

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