Bluetooth SIG Proprietary
Mesh Profile
Bluetooth
®
Specification
▪ Revision: v1.0.1
▪ Revision Date: 2019-01-21
▪ Group Prepared By: Mesh Working Group
▪ Feedback Email: mesh-main@bluetooth.org
Abstract:
This Bluetooth specification defines fundamental requirements to enable an interoperable mesh networking
solution for Bluetooth low energy wireless technology.
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Revision History
Revision Number Date Comments
v1.0 2017-07-13 Adopted by the Bluetooth SIG Board of Directors
v1.0.1 2019-01-21 Adopted by the Bluetooth SIG Board of Directors
Version History
Versions
Changes
v1.0.0 to v1.0.1
Incorporated errata E9618, E9634, E9639, E9693, E9743, E9748, E9752, E9761,
E9788, E9796, E9805, E9807, E9808, E9811, E9812, E9819, E9882, E9883,
E9894, E9939, E9957, E9959,E9964, E9969, E9981, E9982, E9983, E10015,
E10024, E10025, E10026, E10027, E10028, E10054, E10066, E10081, E10082,
E10084, E10086, E10087, E10100, E10101, E10148, E10157, E10168, E10247,
E10296, E10310, E10317, E10321, E10322, E10332, E10344, E10395, E10426,
E10514, E10515, E10520, E10569, E10575, E10578, E10636, E10664, E10670,
E10746, E10748, E10777, E10863, E10864, E11306
Contributors
Name
Company
Robin Heydon
Qualcomm Technologies International, Ltd.
Jonathan Tanner Qualcomm Technologies International, Ltd.
Victor Zhodzishsky Broadcom Corporation
Wei Shen Ericsson AB
Christoffer Jerkeby Ericsson AB
Bogdan Alexandru
NXP Semiconductors
Martin Turon Google Inc.
Robert D. Hughes Intel Corporation
Marcel Holtmann Intel Corporation
Brian Gix Intel Corporation
Simon Slupik
Silvair, Inc.
Piotr Winiarczyk Silvair, Inc.
Danilo Blasi STMicroelectronics
Yao Wang IVT Wireless Limited
Rustam Kovyazin Motorola Solutions
Uday Agarwal Cypress Semiconductor Corporation
Vasilii Aleksandrov Motorola Solutions
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Name
Company
LC Ko MediaTek, Inc.
Omkar Kulkarni
Cypress Semiconductor Corporation
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Use of this specification is your acknowledgement that you agree to and will comply with the following notices and
disclaimers. You are advised to seek appropriate legal, engineering, and other professional advice regarding the use,
interpretation, and effect of this specification.
Use of Bluetooth specifications by members of Bluetooth SIG is governed by the membership and other related
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membership and other related agreements is prohibited and, among other things, may result in (i) termination of the
applicable agreements and (ii) liability for infringement of the intellectual property rights of Bluetooth SIG and its
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If this specification is a prototyping specification, it is solely for the purpose of developing and using prototypes to verify
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Products equipped with Bluetooth wireless technology ("Bluetooth Products") and their combination, operation, use,
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Bluetooth SIG is not required to adopt any specification or portion thereof. If this specification is not the final version
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their respective owners.
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Contents
1 Introduction ........................................................................................................................................ 12
1.1 Conformance ................................................................................................................................ 12
1.2 Bluetooth specification release compatibility ................................................................................ 12
1.3 Language ...................................................................................................................................... 12
1.3.1 Language conventions ............................................................................................................ 12
1.3.2 Reserved for Future Use ......................................................................................................... 13
1.3.3 Prohibited ................................................................................................................................. 13
1.3.4 Acronyms and abbreviations ................................................................................................... 13
1.3.5 Terminology ............................................................................................................................. 15
2 Mesh system architecture ................................................................................................................. 17
2.1 Layered architecture ..................................................................................................................... 17
2.1.1 Model layer .............................................................................................................................. 17
2.1.2 Foundation Model layer ........................................................................................................... 17
2.1.3 Access layer ............................................................................................................................ 18
2.1.4 Upper transport layer ............................................................................................................... 18
2.1.5 Lower transport layer ............................................................................................................... 18
2.1.6 Network layer ........................................................................................................................... 18
2.1.7 Bearer layer ............................................................................................................................. 18
2.2 Overview of mesh operation ......................................................................................................... 18
2.2.1 Network and subnets ............................................................................................................... 19
2.2.2 Devices and nodes .................................................................................................................. 20
2.2.3 Adding devices to a mesh network .......................................................................................... 20
2.2.4 Communications support ......................................................................................................... 21
2.2.5 Low power support .................................................................................................................. 21
2.3 Architectural concepts .................................................................................................................. 21
2.3.1 States ....................................................................................................................................... 21
2.3.2 Bound states ............................................................................................................................ 21
2.3.3 Messages ................................................................................................................................ 21
2.3.4 Elements .................................................................................................................................. 22
2.3.5 Addresses ................................................................................................................................ 23
2.3.6 Models ..................................................................................................................................... 23
2.3.7 Example device ....................................................................................................................... 29
2.3.8 Publish-subscribe and message exchange ............................................................................. 30
2.3.9 Security .................................................................................................................................... 31
2.3.10 Friendship ................................................................................................................................ 33
2.3.11 Features ................................................................................................................................... 34
2.3.12 Topology .................................................................................................................................. 35
