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GD32F450xx数据手册英文
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GD32F450xx数据手册英文
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GigaDevice Semiconductor Inc.
GD32F450xx
Arm
®
Cortex
®
-M4 32-bit MCU
Datasheet
GD32F450xx Datasheet
1
Table of Contents
Table of Contents................................................................................................................. 1
List of Figures ...................................................................................................................... 4
List of Tables ........................................................................................................................ 5
1. General description ...................................................................................................... 7
2. Device overview ............................................................................................................ 8
2.1. Device information................................................................................................. 8
2.2. Block diagram ...................................................................................................... 10
2.3. Pinouts and pin assignment ................................................................................ 11
2.4. Memory map ........................................................................................................ 13
2.5. Clock tree ............................................................................................................. 17
2.6. Pin definitions ...................................................................................................... 18
2.6.1. GD32F450Ix BGA176 pin definitions .........................................................................18
2.6.2. GD32F450Zx LQFP144 pin definitions ......................................................................28
2.6.3. GD32F450Vx LQFP100 pin definitions ......................................................................37
2.6.4. GD32F450xx pin alternate functions..........................................................................45
3. Functional description ............................................................................................... 55
3.1. Arm
®
Cortex
®
-M4 core.......................................................................................... 55
3.2. On-chip memory .................................................................................................. 55
3.3. Clock, reset and supply management ................................................................. 56
3.4. Boot modes .......................................................................................................... 56
3.5. Power saving modes ........................................................................................... 57
3.6. Analog to digital converter (ADC) ....................................................................... 57
3.7. Digital to analog converter (DAC)........................................................................ 58
3.8. DMA ...................................................................................................................... 58
3.9. General-purpose inputs/outputs (GPIOs)............................................................ 59
3.10. Timers and PWM generation ............................................................................... 59
3.11. Real time clock (RTC) and backup registers ....................................................... 60
3.12. Inter-integrated circuit (I2C)................................................................................. 61
3.13. Serial peripheral interface (SPI)........................................................................... 61
3.14. Universal synchronous/asynchronous receiver transmitter (USART/UART)..... 61
GD32F450xx Datasheet
2
3.15. Inter-IC sound (I2S) .............................................................................................. 62
3.16. Universal serial bus full-speed interface (USBFS) .............................................. 62
3.17. Universal serial bus high-speed interface (USBHS) ........................................... 62
3.18. Controller area network (CAN) ............................................................................ 63
3.19. Ethernet (ENET) ................................................................................................... 63
3.20. External memory controller (EXMC).................................................................... 63
3.21. Secure digital input and output card interface (SDIO) ........................................ 64
3.22. TFT LCD interface (TLI)........................................................................................ 64
3.23. Image processing accelerator (IPA) .................................................................... 64
3.24. Digital camera interface (DCI).............................................................................. 65
3.25. Debug mode ......................................................................................................... 65
3.26. Package and operation temperature ................................................................... 65
4. Electrical characteristics ........................................................................................... 66
4.1. Absolute maximum ratings.................................................................................. 66
4.2. Recommended DC characteristics ...................................................................... 66
4.3. Power consumption ............................................................................................. 68
4.4. EMC characteristics ............................................................................................. 76
4.5. Power supply supervisor characteristics............................................................ 77
4.6. Electrical sensitivity............................................................................................. 78
4.7. External clock characteristics ............................................................................. 78
4.8. Internal clock characteristics .............................................................................. 81
4.9. PLL characteristics .............................................................................................. 82
4.10. Memory characteristics ....................................................................................... 84
4.11. NRST pin characteristics ..................................................................................... 84
4.12. GPIO characteristics ............................................................................................ 85
4.13. ADC characteristics ............................................................................................. 87
4.14. Temperature sensor characteristics ................................................................... 89
4.15. DAC characteristics ............................................................................................. 89
4.16. I2C characteristics ............................................................................................... 90
4.17. SPI characteristics ............................................................................................... 91
4.18. I2S characteristics ............................................................................................... 93
4.19. USART characteristics......................................................................................... 95
GD32F450xx Datasheet
3
4.20. SDIO characteristics ............................................................................................ 95
4.21. CAN characteristics ............................................................................................. 95
4.22. USBFS characteristics ......................................................................................... 96
4.23. USBHS characteristics ........................................................................................ 97
4.24. EXMC characteristics .......................................................................................... 97
4.25. TIMER characteristics........................................................................................ 101
4.26. DCI characteristics ............................................................................................ 101
4.27. WDGT characteristics ........................................................................................ 102
4.28. Parameter conditions ........................................................................................ 102
5. Package information................................................................................................. 103
5.1. BGA176 package outline dimensions ............................................................... 103
5.2. LQFP144 package outline dimensions.............................................................. 104
5.3. LQFP100 package outline dimensions.............................................................. 106
5.4. Thermal characteristics ..................................................................................... 107
6. Ordering information ................................................................................................ 109
7. Revision history ........................................................................................................ 110
GD32F450xx Datasheet
4
List of Figures
Figure 2-1. GD32F450xx block diagram......................................................................................10
Figure 2-2. GD32F450Ix BGA176 pinouts ................................................................................... 11
Figure 2-3. GD32F450Zx LQFP144 pinouts .................................................................................12
Figure 2-4. GD32F450Vx LQFP100 pinouts .................................................................................13
Figure 2-5. GD32F450xx clock tree ............................................................................................17
Figure 4-1. Recommended power supply decoupling capacitors
(1) (2)
...........................................67
Figure 4-2. Typical supply current consumption in Run mode .....................................................74
Figure 4-3. Typical supply current consumption in Sleep mode...................................................74
Figure 4-4. Recommended external NRST pin circuit ..................................................................85
Figure 4-5. I/O port AC characteristics definition ........................................................................86
Figure 4-6. I2C bus timing diagram ............................................................................................91
Figure 4-7. SPI timing diagram - master mode ............................................................................92
Figure 4-8. SPI timing diagram - slave mode ..............................................................................92
Figure 4-9. I2S timing diagram - master mode ............................................................................94
Figure 4-10. I2S timing diagram - slave mode .............................................................................94
Figure 4-11. USBFS timings: definition of data signal rise and fall time........................................96
Figure 5-1. BGA176 package outline ........................................................................................ 103
Figure 5-2. LQFP144 package outline ...................................................................................... 104
Figure 5-3. LQFP100 package outline ...................................................................................... 106
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