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基于ARM的嵌入式温度监测系统.doc
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基于ARM的嵌入式温度监测系统.doc
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基于 ARM 的嵌入式温度监测系统
摘 要
随着科技的发展,嵌入式系统的发展也异常迅速,同时,嵌入式系统已经应用于各
个方面,给人们的生产和生活带来了极大的便利。目前嵌入式系统的应用已经发展到了
嵌入式处理器与操作系统相结合的阶段,本设计就是将 ARM 处理器与 Linux 操作系统
相结合实现的。
嵌入式温度监测系统由温度监测硬件系统和温度监测软件两部分组成。其中硬件系
统包括 SBC2410 开发套件,温度检测电路、信号放大电路及信号显示终端,论文中按模
块对各部分硬件的设计进行了详细的介绍。
温度监测软件系统的设计过程如下,本设计首先为温度监测系统构建 Linux 环境,
其次在 Linux 下编写并加载系统驱动程序,然后编写应用程序,编译并下载到 ARM 开
发板中。经过反复调试,实现了温度监测的功能。
关键词: ARM;linux;内核;驱动;温度监测
Embedded System of Temperature Testing Based on ARM
Abstract
With the development of science, embedded system develops at a fast speed. Embedded
system has been applied to all aspects, which has brought great convenience to people's
production and daily life. At present, the application of embedded system have been developed
to the stage of combining embedded processor with operating system, and the design comes
true based on combining the ARM processor with linux operating system.
Embedded temperature measurement system includes temperature monitoring hardware
and software systems. Hardware system includes SBC2410 system development kit,
temperature detection circuit, signal amplifier circuit and signal display terminal. This paper,
in detail, introduces the hardware design according to modules.
The process of the design of temperature measurement software system is as follows: First,
the design construct Linux environment for temperature measurement the system .Secondly,
the design compiles and loads driver program in Linux; At last, the design writes, compiles
and downloads the application program to ARM development board. After repeated
debugging, the design achieves the purpose of the temperature measurement.
Key words: Linux ; ARM ; Kernel ; Drivert ; Emperature measurement
目 录
摘 要...........................................................................................................................................I
Abstract........................................................................................................................................II
第一章 嵌入式系统简介............................................................................................................1
1.1 嵌入式系统的概念.......................................................................................................1
1.2 嵌入式系统的结构.......................................................................................................1
1.3 嵌入式系统与普通单片机开发的不同之处...............................................................2
1.3.1 交叉编译............................................................................................................2
1.3.2 交叉调试............................................................................................................3
第二章 设计用嵌入式模块........................................................................................................5
2.1 ARM 处理器..................................................................................................................5
2.2 Flash 模块 ......................................................................................................................5
2.3 SDRAM 模块.................................................................................................................6
2.4 JTAG 调试器 .................................................................................................................8
第三章 温度监测电路设计......................................................................................................10
3.1 AD590 的室温补偿电路..........................................................................................10
3.1.1 性能..................................................................................................................10
3.1.2 误差校正..........................................................................................................10
3.1.3 AD590 的补偿电路设计..................................................................................11
3.2 热电偶的测温电路.....................................................................................................12
3.2.1 热电偶的测温原理..........................................................................................12
3.2.2 热电偶的测温电路设计..................................................................................14
第四章 温度监测系统的 Linux 构建 ......................................................................................17
4.1 构建交叉编译器.........................................................................................................17
4.1.1 交叉编译器......................................................................................................17
4.1.2 设置共享文件夹,并解压 linux 开发包 .......................................................17
4.1.3 安装交叉编译器..............................................................................................18
4.2 Linux 操作系统 ...........................................................................................................19
4.2.1 引导加载程序..................................................................................................20
4.2.2 内核..................................................................................................................21
4.2.3 文件系统..........................................................................................................23
4.3 烧写.............................................................................................................................24
4.3.1 Windows 下烧写 vivi .......................................................................................24
4.3.2 分区格式化 Flash 及重新下载 vivi...........................................................25
4.3.3 烧写 linux 内核............................................................................................27
4.3.4 下载文件系统................................................................................................27
第五章 温度监测系统的软件编程..........................................................................................28
5.1 编写 Linux 下的 ADC 驱动程序...............................................................................28
5.1.1 Linux 设备 ........................................................................................................29
5.1.2 驱动程序的编写说明......................................................................................32
5.1.3 驱动程序编写的具体内容..............................................................................34
5.1.4 ADC 驱动程序具体函数的分析 .....................................................................36
5.1.5 ADC 驱动程序的加载和删除 .........................................................................39
5.2 编写应用程序.............................................................................................................41
5.2.1 线性化部分......................................................................................................41
5.2.2 A/D 转换速率的计算.......................................................................................44
5.2.3 主程序的编写..................................................................................................45
第六章 温度监测的调试..........................................................................................................47
6.1 编译 ad 驱动程序 .......................................................................................................47
6.2 运行应用程序.............................................................................................................48
6.2.1 为 ARM 开发板更新内核和文件系统...........................................................48
6.2.2 编译 main.c 应用程序.....................................................................................48
6.2.3 运行 main 主程序...........................................................................................49
总结 ............................................................................................................................................51
参考文献....................................................................................................................................52
附录 ............................................................................................................................................54
附录 A:程序源代码........................................................................................................54
附录 B:测温原理图 ........................................................................................................68
附录 C:ARM 板电路图 ..................................................................................................69
致谢 ............................................................................................................................................70
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