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This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to

change without notice.

September 2014 DocID026289 Rev 2 1/143

STM32F411xC STM32F411xE

ARM

Cortex

-M4 32b MCU+FPU, 125 DMIPS, 512KB Flash,

128KB RAM, USB OTG FS, 11 TIMs, 1 ADC, 13 comm. interfaces

Datasheet - preliminary data

Features

 Dynamic Efficiency Line with BAM (Batch

Acquisition Mode)

– Core: ARM

32-bit Cortex

-M4 CPU with

FPU, Adaptive real-time accelerator (ART

Accelerator™) allowing 0-wait state

execution from Flash memory, frequency

up to 100 MHz, memory protection unit,

125 DMIPS/1.25 DMIPS/MHz (Dhrystone

2.1), and DSP instructions

 Memories

– up to 512 Kbytes of Flash memory

– 128 Kbytes of SRAM

 Clock, reset and supply management

– 1.7 V to 3.6 V application supply and I/Os

– POR, PDR, PVD and BOR

– 4-to-26 MHz crystal oscillator

– Internal 16 MHz factory-trimmed RC

– 32 kHz oscillator for RTC with calibration

– Internal 32 kHz RC with calibration

 Power consumption

– Run: 100 μA/MHz (peripheral off)

– Stop (Flash in Stop mode, fast wakeup

time): 42 μA Typ @ 25C; 65 μA max

@25 °C

– Stop (Flash in Deep power down mode,

fast wakeup time): down to 10 μA @ 25 °C;

30 μA max @25 °C

– Standby: 2.4 μA @25 °C / 1.7 V without

RTC; 12 μA @85 °C @1.7 V

–V

BAT

supply for RTC: 1 μA @25 °C

 1×12-bit, 2.4 MSPS A/D converter: up to 16

channels

 General-purpose DMA: 16-stream DMA

controllers with FIFOs and burst support

 Up to 11 timers: up to six 16-bit, two 32-bit

timers up to 100 MHz, each with up to four

IC/OC/PWM or pulse counter and quadrature

(incremental) encoder input, two watchdog

timers (independent and window) and a

SysTick timer

 Debug mode

– Serial wire debug (SWD) & JTAG

interfaces

– Cortex



-M4 Embedded Trace Macrocell™

 Up to 81 I/O ports with interrupt capability

– Up to 78 fast I/Os up to 100 MHz

– Up to 77 5 V-tolerant I/Os

 Up to 13 communication interfaces

– Up to 3 x I

C interfaces (SMBus/PMBus)

– Up to 3 USARTs (2 x 12.5 Mbit/s,

1 x 6.25 Mbit/s), ISO 7816 interface, LIN,

IrDA, modem control)

– Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or

I2S audio protocol, SPI2 and SPI3 with

muxed full-duplex I

S to achieve audio

class accuracy via internal audio PLL or

external clock

– SDIO interface (SD/MMC/eMMC)

– Advanced connectivity: USB 2.0 full-speed

device/host/OTG controller with on-chip

PHY

 CRC calculation unit

 96-bit unique ID

 RTC: subsecond accuracy, hardware calendar

 All packages (WLCSP49, LQFP64/100,

UFQFPN48, UFBGA100) are ECOPACK

Table 1. Device summary

Reference Part number

STM32F411xC

STM32F411CC,

STM32F411RC, STM32F411VC

STM32F411xE

STM32F411CE,

STM32F411RE, STM32F411VE

WLCSP49

(3.034 x 3.220 mm)

LQFP100 (14 × 14 mm)

LQFP64 (10 × 10 mm)

UFQFPN48

(7 × 7 mm)

UFBGA100

(7 × 7 mm)

FBGA

www.st.com

Contents STM32F411xC STM32F411xE

2/143 DocID026289 Rev 2

Contents

1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

2.1 Compatibility with STM32F4 series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.1 ARM

Cortex

-M4 with FPU core with embedded Flash and SRAM . . . 16

3.2 Adaptive real-time memory accelerator (ART Accelerator™) . . . . . . . . . . 16

3.3 Batch Acquisition mode (BAM)™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.4 Memory protection unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.5 Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.6 CRC (cyclic redundancy check) calculation unit . . . . . . . . . . . . . . . . . . . 17

3.7 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.8 Multi-AHB bus matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

3.9 DMA controller (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

3.10 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . . 19

3.11 External interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . . . . 19

3.12 Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

3.13 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3.14 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3.15 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.15.1 Internal reset ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.15.2 Internal reset OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3.16 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.16.1 Regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.16.2 Regulator OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

3.16.3 Regulator ON/OFF and internal power supply supervisor availability . . 25

3.17 Real-time clock (RTC) and backup registers . . . . . . . . . . . . . . . . . . . . . . 25

3.18 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

3.19 V

BAT

operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

3.20 Timers and watchdogs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

3.20.1 Advanced-control timers (TIM1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

DocID026289 Rev 2 3/143

STM32F411xC STM32F411xE Contents

3.20.2 General-purpose timers (TIMx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3.20.3 Independent watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3.20.4 Window watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

3.20.5 SysTick timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

3.21 Inter-integrated circuit interface (I2C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

3.22 Universal synchronous/asynchronous receiver transmitters (USART) . . 29

3.23 Serial peripheral interface (SPI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

3.24 Inter-integrated sound (I

S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

3.25 Audio PLL (PLLI2S) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

3.26 Secure digital input/output interface (SDIO) . . . . . . . . . . . . . . . . . . . . . . . 31

3.27 Universal serial bus on-the-go full-speed (OTG_FS) . . . . . . . . . . . . . . . . 31

3.28 General-purpose input/outputs (GPIOs) . . . . . . . . . . . . . . . . . . . . . . . . . . 31

3.29 Analog-to-digital converter (ADC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

3.30 Temperature sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

3.31 Serial wire JTAG debug port (SWJ-DP) . . . . . . . . . . . . . . . . . . . . . . . . . . 32

3.32 Embedded Trace Macrocell™ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

4 Pinouts and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

5 Memory mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

6 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

6.1 Parameter conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

6.1.1 Minimum and maximum values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

6.1.2 Typical values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

6.1.3 Typical curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

6.1.4 Loading capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57

6.1.5 Pin input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

6.1.6 Power supply scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

6.1.7 Current consumption measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

6.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60

6.3 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

6.3.1 General operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62

6.3.2 VCAP1/VCAP2 external capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64

6.3.3 Operating conditions at power-up/power-down (regulator ON) . . . . . . . 64

6.3.4 Operating conditions at power-up / power-down (regulator OFF) . . . . . 65

Contents STM32F411xC STM32F411xE

4/143 DocID026289 Rev 2

6.3.5 Embedded reset and power control block characteristics . . . . . . . . . . . 65

6.3.6 Supply current characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

6.3.7 Wakeup time from low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . 79

6.3.8 External clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

6.3.9 Internal clock source characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 85

6.3.10 PLL characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87

6.3.11 PLL spread spectrum clock generation (SSCG) characteristics . . . . . . 89

6.3.12 Memory characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

6.3.13 EMC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

6.3.14 Absolute maximum ratings (electrical sensitivity) . . . . . . . . . . . . . . . . . 94

6.3.15 I/O current injection characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

6.3.16 I/O port characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96

6.3.17 NRST pin characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100

6.3.18 TIM timer characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101

6.3.19 Communications interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

6.3.20 12-bit ADC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110

6.3.21 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

6.3.22 V

BAT

monitoring characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

6.3.23 Embedded reference voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

6.3.24 SD/SDIO MMC/eMMC card host interface (SDIO) characteristics . . . 117

6.3.25 RTC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

7 Package characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

7.1 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

7.1.1 WLCSP49, 3.034 x 3.22 mm, 0.4 mm pitch wafer level chip

size package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120

7.1.2 UFQFPN48, 7 x 7 mm, 0.5 mm pitch package . . . . . . . . . . . . . . . . . . 123

7.1.3 LQFP64, 10 x 10 mm, 64-pin low-profile quad flat package . . . . . . . . 126

7.1.4 LQFP100, 14 x 14 mm, 100-pin low-profile quad flat package . . . . . . 129

7.1.5 UFBGA100, 7 x 7 mm, 0.5 mm pitch package . . . . . . . . . . . . . . . . . . 132

7.2 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

7.2.1 Reference document . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 134

8 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

Appendix A Recommendations when using the internal reset OFF . . . . . . . . 137

A.1 Operating conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

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