R528_Datasheet_V1.0资源-CSDN文库

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R528

The Most Cost-Effective Intelligent Speakers with Screen

Features

 Dual-core ARM Cortex

-A7

 HiFi4 DSP

 Memories

- Embedded with 128 MB DDR3, clock frequency up to 800 MHz (only for R528-S3)

- Embedded with 256 MB DDR3, clock frequency up to 800 MHz (only for R528-S4)

- Three SD/MMC host controller (SMHC) interfaces: SD3.0/SDIO3.0/eMMC5.0

 Video Engine

- H.265/H.264/MPEG-1/2/4/JPEG/VC1/Xvid/Sorenson Spark decoding, up to 4K (Only for R528-S4) or 1080P

- JPEG/MJPEG encoding, up to 1080p@60fps

 Video and Graphics

- Allwinner SmartColor2.0 post processing for an excellent display experience

- Supports de-interlacer (DI) up to 1080p@60fps

- Supports Graphic 2D (G2D) hardware accelerator including rotate, mixer, LBC decompression functions

 Video Output

- RGB interface up to 1920 x 1080@60fps

- Dual link LVDS interface up to 1920 x 1080@60fps

- 4-lane MIPI DSI up to 1920 x 1200@60fps

 Video Input

- 8-bit parallel CSI interface

 Analog Audio Codec

- 2 DACs and 3 ADCs

- Analog audio interfaces: LINEOUTLP/N, LINEOUTRP/N, HPOUTL/R, MICIN1P/1N, MICIN2P/2N, MICIN3P/3N,

LINEINL/R, FMINL/R

 Three I2S/PCM external interfaces (I2S0, I2S1, I2S2)

 Maximum 8 digital PDM microphones (DMIC)

 OWA TX and OWA RX, compliance with S/PDIF interface

 Security System

- AES, DES, 3DES, RSA, MD5, SHA, HMAC

- Integrated 2 Kbits OTP storage space

 External Peripherals

- USB 2.0 DRD (USB0) and USB 2.0 HOST (USB1)

- 10/100/1000 Mbps Ethernet port with RGMII and RMII interfaces

- Up to 6 UART controllers (UART0, UART1, UART2, UART3, UART4, UART5)

- Up to 2 SPI controllers (SPI0, SPI1)

- Up to 4 TWI controllers (TWI0, TWI1, TWI2, TWI3)

- CIR RX and CIR TX

- 8 independent PWM channels (PWM0 to PWM7)

- 2-ch GPADC

- 4-ch TPADC

- 1-ch LRADC

- LEDC

 Package

- LFBGA 226 balls, 12 mm x 12 mm body size, 0.65 mm ball pitch, 0.35 mm ball size (Only for R528-S3)

- LFBGA 226 balls, 14.5 mm x 12 mm body size, 0.65 mm ball pitch, 0.35 mm ball size (Only for R528-S4)

Confidential

Contents

The Most Cost-Effective Intelligent Speakers with Screen .................................................................................................. i

Revision History..................................................................................................................................................................... i

Contents ............................................................................................................................................................................... ii

Figures ................................................................................................................................................................................. vi

Tables ................................................................................................................................................................................ viii

About This Documentation .................................................................................................................................................1

1 Overview ......................................................................................................................................................................3

1.1 Device Difference .................................................................................................................................................3

2 Features ........................................................................................................................................................................4

2.1 CPU Architecture ..................................................................................................................................................4

2.2 DSP Architecture ..................................................................................................................................................4

2.3 Memory Subsystem..............................................................................................................................................4

2.3.1 Boot ROM (BROM) ...............................................................................................................................4

2.3.2 SDRAM .................................................................................................................................................4

2.3.3 SMHC ....................................................................................................................................................4

2.4 Video Engine ........................................................................................................................................................5

2.5 Video and Graphics ..............................................................................................................................................6

2.5.1 Display Engine (DE)...............................................................................................................................6

2.5.2 De-interlacer (DI) ..................................................................................................................................6

2.5.3 Graphic 2D (G2D) .................................................................................................................................6

2.6 Video Output .......................................................................................................................................................7

2.6.1 RGB and LVDS LCD ................................................................................................................................7

2.6.2 MIPI DSI ................................................................................................................................................7

2.7 Video Input ..........................................................................................................................................................7

2.7.1 Parallel CSI ............................................................................................................................................7

2.8 System Peripherals ...............................................................................................................................................8

2.8.1 Timer ....................................................................................................................................................8

2.8.2 High Speed Timer (HSTimer) ................................................................................................................8

2.8.3 GIC ........................................................................................................................................................8

2.8.4 DMAC ...................................................................................................................................................9

2.8.5 Clock Controller Unit (CCU) ..................................................................................................................9

2.8.6 Thermal Sensor Controller (THS) ..........................................................................................................9

Confidential

2.8.7 LDO Power ............................................................................................................................................9

2.8.8 RTC .................................................................................................................................................... 10

2.8.9 I/O Memory Management Unit (IOMMU) ........................................................................................ 10

2.8.10 Message Box (MSGBOX) .................................................................................................................... 10

2.8.11 Spinlock ............................................................................................................................................. 10

2.9 Audio Subsystem ............................................................................................................................................... 11

2.9.1 Audio Codec ...................................................................................................................................... 11

2.9.2 I2S/PCM ............................................................................................................................................. 11

2.9.3 DMIC .................................................................................................................................................. 12

2.9.4 One Wire Audio (OWA) ..................................................................................................................... 12

2.10 Security System ................................................................................................................................................. 13

2.10.1 Crypto Engine (CE) ............................................................................................................................. 13

2.10.2 Security ID (SID) ................................................................................................................................. 13

2.10.3 Secure Memory Control (SMC) ......................................................................................................... 13

2.10.4 Secure Peripherals Control (SPC)....................................................................................................... 14

2.11 External Peripherals .......................................................................................................................................... 14

2.11.1 USB DRD ............................................................................................................................................ 14

2.11.2 USB HOST .......................................................................................................................................... 14

2.11.3 EMAC ................................................................................................................................................. 15

2.11.4 UART .................................................................................................................................................. 15

2.11.5 SPI and SPI_DBI ................................................................................................................................. 16

2.11.6 Two Wire Interface (TWI) .................................................................................................................. 16

2.11.7 CIR Receiver (CIR_RX) .........................................................................................................................17

2.11.8 CIR Transmitter (CIR_TX) ....................................................................................................................17

2.11.9 PWM ...................................................................................................................................................17

2.11.10 General Purpose ADC (GPADC) ......................................................................................................... 18

2.11.11 Touch Panel ADC (TPADC) ................................................................................................................. 18

2.11.12 Low Rate ADC (LRADC) ...................................................................................................................... 19

2.11.13 LEDC .................................................................................................................................................. 19

2.12 Package ............................................................................................................................................................. 19

3 Block Diagram ............................................................................................................................................................20

4 Pin Description .......................................................................................................................................................... 22

4.1 Pin Quantity ...................................................................................................................................................... 22

4.2 Pin Characteristics ............................................................................................................................................. 22

4.3 GPIO Multiplex Function ................................................................................................................................... 31

Confidential

4.4 Detailed Signal Description ............................................................................................................................... 34

5 Electrical Characteristics ........................................................................................................................................... 44

5.1 Parameter Conditions ....................................................................................................................................... 44

5.1.1 Minimum and Maximum Values ....................................................................................................... 44

5.1.2 Typical Values .................................................................................................................................... 44

5.1.3 Temperature Definitions ................................................................................................................... 44

5.2 Absolute Maximum Ratings .............................................................................................................................. 44

5.3 Recommended Operating Conditions ............................................................................................................... 46

5.4 Power Consumption Parameters ...................................................................................................................... 48

5.5 DC Electrical Characteristics .............................................................................................................................. 49

5.6 SDIO Electrical Characteristics ........................................................................................................................... 50

5.7 GPADC Electrical Characteristics ........................................................................................................................51

5.8 LRADC Electrical Characteristics .........................................................................................................................51

5.9 Audio Codec Electrical Characteristics ...............................................................................................................52

5.10 External Clock Source Characteristics ............................................................................................................... 54

5.10.1 High-speed Crystal/Ceramic Resonator Characteristics .................................................................... 54

5.10.2 Low-speed Crystal/Ceramic Resonator Characteristics ......................................................................55

5.11 Internal Reset Electrical Characteristics ............................................................................................................ 56

5.12 External Memory Electrical Characteristics ....................................................................................................... 57

5.12.1 SMHC AC Electrical Characteristics .................................................................................................... 57

5.13 External Peripheral Electrical Characteristics .....................................................................................................62

5.13.1 LCD AC Electrical Characteristics ........................................................................................................62

5.13.2 CSI AC Electrical Characteristics ........................................................................................................ 64

5.13.3 EMAC AC Electrical Characteristics .................................................................................................... 65

5.13.4 SPI AC Electrical Characteristics .........................................................................................................67

5.13.5 SPI_DBI AC Electrical Characteristics ................................................................................................. 68

5.13.6 UART AC Electrical Characteristics ..................................................................................................... 70

5.13.7 TWI AC Electrical Characteristics ....................................................................................................... 71

5.13.8 I2S/PCM AC Electrical Characteristics ................................................................................................ 72

5.13.9 DMIC AC Electrical Characteristics .....................................................................................................73

5.13.10 OWA AC Electrical Characteristics ...................................................................................................... 74

5.13.11 CIR_RX AC Electrical Characteristics ................................................................................................... 74

5.14 Power-On and Power-Off Sequence .................................................................................................................. 75

5.14.1 Power-On Sequence .......................................................................................................................... 75

5.14.2 Power-Off Sequence ........................................................................................................................... 76

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