LPC43XX_datasheet资源-CSDN文库

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### LPC43XX系列微控制器的关键特性与应用 #### 一、概述 LPC43XX系列是一款基于ARM Cortex-M4内核的高性能微控制器，适用于各种嵌入式应用领域。该系列微控制器集成了浮点运算单元（FPU），并配备了辅助的ARM Cortex-M0协处理器，旨在提供高效能、低功耗的解决方案。本文将详细介绍LPC43XX系列微控制器的核心特性、内存配置、外设接口以及其在不同应用场景中的优势。 #### 二、核心架构与性能 ##### ARM Cortex-M4内核 - **主频**: 最高可达204MHz。 - **内存保护单元(MPU)**: 内置8个区域的MPU，增强了系统的安全性与稳定性。 - **中断控制器(NVIC)**: 提供嵌套向量中断控制功能，优化了中断处理流程。 - **硬件浮点运算单元(FPU)**: 支持单周期数字信号处理和SIMD指令，提高了数据处理能力。 - **非屏蔽中断(NMI)**: 用于处理紧急情况下的中断请求。 - **调试功能**: 集成JTAG、串行线调试(SWD)、串行追踪等功能，支持8个断点和4个监视点，便于开发调试。 - **跟踪模块**: 支持增强型跟踪模块(ETM)和增强型跟踪缓冲器(ETB)，有助于提高调试效率。 ##### ARM Cortex-M0协处理器 - **主频**: 同样最高可达204MHz。 - **指令集**: 简化的指令集，降低了代码大小，提升了执行效率。 - **兼容性**: 与Cortex-M4内核向上兼容，便于软件移植。 - **乘法单元**: 实现了一个32周期迭代乘法器，加速特定计算任务。 #### 三、内存与存储资源 - **闪存**: 最高达1MB，用于程序代码及常驻数据存储。 - **静态随机访问存储器(SRAM)**: 总计136KB，分为多个区块，提供了灵活的数据缓存方案。 - **电可擦除可编程只读存储器(EEPROM)**: 内置16KB，用于存储非易失性数据，如设置参数或用户数据。 - **外部存储器接口**: 支持多种类型的外部存储介质接入，扩展了数据存储容量。 #### 四、外设与接口 - **高速USB控制器**: 配备两个高速USB控制器，支持高速数据传输。 - **以太网接口**: 内置以太网控制器，便于网络通信。 - **液晶显示器(LCD)驱动**: 支持LCD显示，可用于图形界面设计。 - **外部存储器控制器**: 通过该控制器可以扩展更多的存储空间。 - **四线SPI闪存接口(SPIFI)**: 支持执行在位操作，提高了闪存访问效率。 - **高级可配置外设**: - **状态可配置定时器(SCTimer/PWM)**: 可根据需要配置为定时器或脉宽调制(PWM)输出。 - **串行通用输入输出(SGPIO)**: 提供灵活的串行通信接口。 #### 五、多样的数字与模拟外设 LPC43XX系列微控制器还配备了丰富的数字与模拟外设，包括但不限于ADC、DAC、比较器、定时器等，这些外设极大地扩展了微控制器的应用范围，使其能够满足更多复杂应用的需求。 #### 六、总结 LPC43XX系列微控制器凭借其强大的ARM Cortex-M4内核与Cortex-M0协处理器的组合、丰富的内存资源、多样化的外设接口以及高性能的存储解决方案，在嵌入式系统领域展现出显著的竞争优势。无论是工业自动化、汽车电子还是消费电子产品等领域，LPC43XX都能提供高效可靠的解决方案。对于开发者而言，LPC43XX不仅易于使用，还具有高度的灵活性和可扩展性，是实现创新设计的理想选择。

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1. General description

The LPC435X_3X_2X_1X are ARM Cortex-M4 based microcontrollers with Floating Point

Unit (FPU) for embedded applications which include an ARM Cortex-M0 coprocessor, up

to 1 MB of flash and 136 kB of on-chip SRAM, 16 kB of EEPROM memory, two

high-speed USB controllers, Ethernet, LCD, an external memory controller, a quad SPI

Flash Interface (SPIFI) that supports execute-in-place, advanced configurable peripherals

such as the State Configurable Timer (SCTimer/PWM) and the Serial General Purpose

I/O (SGPIO) interface, and multiple digital and analog peripherals. The

LPC435X_3X_2X_1X operate at CPU frequencies of up to 204 MHz.

The ARM Cortex-M4 is a 32-bit core that offers system enhancements such as low power

consumption, enhanced debug features, and a high level of support block integration. The

ARM Cortex-M4 CPU incorporates a 3-stage pipeline, uses a Harvard architecture with

separate local instruction and data buses as well as a third bus for peripherals, and

includes an internal prefetch unit that supports speculative branching. The ARM

Cortex-M4 supports single-cycle digital signal processing and SIMD instructions. A

hardware floating-point processor is integrated into the core.

The ARM Cortex-M0 coprocessor is an energy-efficient and easy-to-use 32-bit core,

which is upward code- and tool-compatible with the Cortex-M4 core. It is ideal for handling

control or peripheral handling to free up the Cortex-M4 for real-time processing. The

Cortex-M0 coprocessor offers up to 204 MHz performance with a simple instruction set

and reduced code size. In LPC43xx, the Cortex-M0 coprocessor hardware multiply is

implemented as a 32-cycle iterative multiplier.

For additional documentation related to the LPC43xx parts, see Section 17

2. Features and benefits

 Cortex-M4 Processor core

 ARM Cortex-M4 processor (version r0p1), running at frequencies of up to

204 MHz.

 Built-in Memory Protection Unit (MPU) supporting eight regions.

 Built-in Nested Vectored Interrupt Controller (NVIC).

 Hardware floating-point unit.

 Non-maskable Interrupt (NMI) input.

 JTAG and Serial Wire Debug (SWD), serial trace, eight breakpoints, and four watch

points.

 Enhanced Trace Module (ETM) and Enhanced Trace Buffer (ETB) support.

 System tick timer.

LPC435x/3x/2x/1x

32-bit ARM Cortex-M4/M0 MCU; up to 1 MB flash and 136 kB

SRAM; Ethernet, two High-speed USB, LCD, EMC

Rev. 5 — 28 April 2015 Product data sheet

Product data sheet Rev. 5. — 28 April 2015 2 of 161

NXP Semiconductors

LPC435x/3x/2x/1x

32-bit ARM Cortex-M4/M0 microcontroller

 Cortex-M0 Processor core

 ARM Cortex-M0 co-processor (version r0p0) capable of off-loading the main ARM

Cortex-M4 application processor.

 Running at frequencies of up to 204 MHz.

 JTAG

 Built-in NVIC.

 On-chip memory

 Up to 1 MB on-chip dual bank flash memory with flash accelerator.

 16 kB on-chip EEPROM data memory.

 136 kB SRAM for code and data use.

 Multiple SRAM blocks with separate bus access. Two SRAM blocks can be

powered down individually.

 64 kB ROM containing boot code and on-chip software drivers.

 64 bit+ 256 bit of One-Time Programmable (OTP) memory for general-purpose

use.

 Configurable digital peripherals

 Serial GPIO (SGPIO) interface.

 State Configurable Timer (SCTimer/PWM) subsystem on AHB.

 Global Input Multiplexer Array (GIMA) allows to cross-connect multiple inputs and

outputs to event driven peripherals like the timers, SCTimer/PWM, and ADC0/1.

 Serial interfaces

 Quad SPI Flash Interface (SPIFI) with four lanes and up to 52 MB per second.

 10/100T Ethernet MAC with RMII and MII interfaces and DMA support for high

throughput at low CPU load. Support for IEEE 1588 time stamping/advanced time

stamping (IEEE 1588-2008 v2).

 One High-speed USB 2.0 Host/Device/OTG interface with DMA support and

on-chip high-speed PHY.

 One High-speed USB 2.0 Host/Device interface with DMA support, on-chip

full-speed PHY and ULPI interface to external high-speed PHY.

 USB interface electrical test software included in ROM USB stack.

 One 550 UART with DMA support and full modem interface.

 Three 550 USARTs with DMA and synchronous mode support and a smart card

interface conforming to ISO7816 specification. One USART with IrDA interface.

 Up to two C_CAN 2.0B controllers with one channel each.

 Two SSP controllers with FIFO and multi-protocol support. Both SSPs with DMA

support.

 One SPI controller.

 One Fast-mode Plus I

C-bus interface with monitor mode and with open-drain I/O

pins conforming to the full I

C-bus specification. Supports data rates of up to

1Mbit/s.

 One standard I

C-bus interface with monitor mode and with standard I/O pins.

 Two I

S interfaces, each with DMA support and with one input and one output.

 Digital peripherals

 External Memory Controller (EMC) supporting external SRAM, ROM, NOR flash,

and SDRAM devices.

Product data sheet Rev. 5. — 28 April 2015 3 of 161

NXP Semiconductors

LPC435x/3x/2x/1x

32-bit ARM Cortex-M4/M0 microcontroller

 LCD controller with DMA support and a programmable display resolution of up to

1024 H  768 V. Supports monochrome and color STN panels and TFT color

panels; supports 1/2/4/8 bpp Color Look-Up Table (CLUT) and 16/24-bit direct pixel

mapping. Available on parts LPC4357/53 only.

 Secure Digital Input Output (SD/MMC) card interface.

 Eight-channel General-Purpose DMA controller can access all memories on the

AHB and all DMA-capable AHB slaves.

 Up to 164 General-Purpose Input/Output (GPIO) pins with configurable

pull-up/pull-down resistors.

 GPIO registers are located on the AHB for fast access. GPIO ports have DMA

support.

 Up to eight GPIO pins can be selected from all GPIO pins as edge and level

sensitive interrupt sources.

 Two GPIO group interrupt modules enable an interrupt based on a programmable

pattern of input states of a group of GPIO pins.

 Four general-purpose timer/counters with capture and match capabilities.

 One motor control Pulse Width Modulator (PWM) for three-phase motor control.

 One Quadrature Encoder Interface (QEI).

 Repetitive Interrupt timer (RI timer).

 Windowed watchdog timer (WWDT).

 Ultra-low power Real-Time Clock (RTC) on separate power domain with 256 bytes

of battery powered backup registers.

 Alarm timer; can be battery powered.

 Analog peripherals

 One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s.

 Two 10-bit ADCs with DMA support and a data conversion rate of 400 kSamples/s.

Up to eight input channels per ADC.

 Unique ID for each device.

 Clock generation unit

 Crystal oscillator with an operating range of 1 MHz to 25 MHz.

 12 MHz internal RC oscillator trimmed to 3 % accuracy over temperature and

voltage (1.5 % accuracy for T

amb

= 0 °C to 85 °C).

 Ultra-low power Real-Time Clock (RTC) crystal oscillator.

 Three PLLs allow CPU operation up to the maximum CPU rate without the need for

a high-frequency crystal. The second PLL can be used with the High-speed USB,

the third PLL can be used as audio PLL.

 Clock output.

 Power

 Single 3.3 V (2.4 V to 3.6 V) power supply with on-chip DC-to-DC converter for the

core supply and the RTC power domain.

 RTC power domain can be powered separately by a 3 V battery supply.

 Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep

power-down.

 Processor wake-up from Sleep mode via wake-up interrupts from various

peripherals.

Product data sheet Rev. 5. — 28 April 2015 5 of 161

NXP Semiconductors

LPC435x/3x/2x/1x

32-bit ARM Cortex-M4/M0 microcontroller

4. Ordering information

Table 1. Ordering information

Type number Package

Name Description Version

LPC4357FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4357JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4357JBD208 LQFP208 Plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1

LPC4353FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4353JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4353JBD208 LQFP208 Plastic low profile quad flat package; 208 leads; body 28  28  1.4 mm SOT459-1

LPC4337FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4337JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4337JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4337JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4333FET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4333JET256 LBGA256 Plastic low profile ball grid array package; 256 balls; body 17  17  1 mm SOT740-2

LPC4333JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4333JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4327JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4327JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4325JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4325JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9

 9  0.7 mm

SOT926-1

LPC4323JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4323JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4322JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4322JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4317JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4317JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4315JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4315JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4313JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4313JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

LPC4312JBD144 LQFP144 Plastic low profile quad flat package; 144 leads; body 20  20  1.4 mm SOT486-1

LPC4312JET100 TFBGA100 Plastic thin fine-pitch ball grid array package; 100 balls; body 9  9  0.7 mm SOT926-1

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