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Four-Secrets-to-Mastering-Millimeter-Wave-Communications-Circuit...
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Four-Secrets-to-Mastering-Millimeter-Wave-Communications-Circuit-Design.pdf
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Mastering Millimeter-Wave
Communications Circuit Design
FOUR SECRETS TO
Keysight has seen dramatic changes in mobile network devices and
infrastructure design, development, and deployment in the transition from
4G to 5G. One substantial challenge affecting circuit design is frequencies
extending into the 70 GHz millimeter-wave (mmWave) band. High millimeter-
wave frequencies and the drive towards miniaturization directly impact the
design of the circuits and systems.
These design trends increase the density and complexity of system
integration because they include mixed fabrication technologies and phased
array antennas in RF modules. Engineers must assemble multi-technology
structures and perform the circuit, electromagnetic (EM), and electrothermal
analysis across technology boundaries.
Sophisticated digital modulation schemes are enabling millimeter-
wave broadband data transmission. This process impacts the design of
components and systems because it now requires new figures of merit like
error vector magnitude (EVM) for RF, microwave, and mmWave applications.
Your existing RF and microwave electronic design automation tool may not
fulfill these new critical requirements to assemble, simulate, and verify multi-
technology RF modules.
In this eBook, you will learn four EDA secrets to mastering mmWave
communications circuit design and how to streamline your design workflow
to achieve first-pass success. We will cover assembly and EM /circuit co-
simulation of RF modules, designing for digitally modulated RF signals, and
guaranteeing nonlinear amplifier stability modulated in a multi-technology
3D structure.
Millimeter-Wave Frequencies
Meet Broadband Data
INTRODUCTION
Contents
Summary
Go to summary >
SUMMARY
Packaging for
Multi-Technology
mmWave Designs
Learn about intelligent
mounting techniques that
adapt when assembling
different technologies.
Go to secret 1 >
SECRET 1
Electromagnetic /
Circuit Co-
Simulation
Reduce simulation time by
using electromagnetic /
circuit co-simulation as an
iterative design tool.
Go to secret 2 >
SECRET 2
Nonlinear Amplifier
Stability Analysis
Discover how to compute
multiple stability metrics
without altering the
fundamental circuit analysis.
Go to secret 3 >
SECRET 3
Designing with
Digitally Modulated
Signals
Bring distortion EVM, the
new figure of merit for 5G
systems, into the design
phase for end-to-end testing.
Go to secret 4 >
SECRET 4
Four Secrets to Mastering Millimeter-Wave Communications Circuit Design | 4
Packaging for Multi-Technology
mmWave Designs
SECRET 1
Four Secrets to Mastering Millimeter-Wave Communications Circuit Design | 4
SUMMARY
MMWAVE DESIGNS
STABILITY ANALYSIS
MODULATED SIGNALS
CO-SIMULATION
Four Secrets to Mastering Millimeter-Wave Communications Circuit Design | 5
SECRET 1
Packaging for Multi-Technology
mmWave Designs
Figure 1. 5G FR2 range is increasing design integration density for future designs
Frequencies up to 90 GHz are
currently being investigated for
future releases.
Frequency range 1: 400 MHz to 6 GHz
Adds 1.5 GHz of new spectrum
in frequency bands
Frequency range 2: 24.25 to 52.6 GHz
Adds 8.25 GHz of new spectrum
in frequency bands
n77: 3.3 to 4.2 GHz
n78: 3.3 to 3.8 GHz
n79: 4.4 to 5 GHz
n257: 26.5 to 19.5 GHz
n258: 24.25 to 27.5 GHz
n260: 37 to 40 GHz
0.6 GHz 2.5 GHz 3.3 to 4.2 GHz
I
S
M
ISM
5.7 to 5.8
24 GHz
ISM
24 GHz
28 GHz 39 GHz
64 to 71 GHz
71 to 76 GHz
...
...
4.4 to 5 GHz
Challenge: packaging for multi-technology
mmwave designs
The move to mmWave frequencies is the single most significant technology
driver impacting multi-technology multilayer assembly. The higher the
frequency, the more data you can transmit. 5G applications are creating
a massive demand for high throughput instant data, as shown in Figure 1.
Higher frequencies have a perilous impact on the circuit design, as the
circuit interconnects operate on the same frequency wavelengths as the
circuit. Once the physical interconnect is about the size of the operating
frequency wavelength, the circuit starts radiating, causing coupling and
other interference within an integrated package. It is important for the
packaging and assembly to be as small as possible to minimize undesired
electromagnetic effects. Choosing the right assembly and packaging
is critical.
SUMMARY
MMWAVE DESIGNS
STABILITY ANALYSIS
MODULATED SIGNALS
CO-SIMULATION
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