3.3.2 系统 LCD1602 显示阐明....................................................................10
3.4 通信模块设计.................................................................................................11
3.4.1 GSM 模块简介 .....................................................................................12
3.5 按键键盘设计................................................................................................12
3.5.1 按键键盘阐明.......................................................................................12
3.5.2 按键电路设计......................................................................................12
3.6 报警电路设计................................................................................................12
3.6.1 蜂鸣器阐明...........................................................................................12
3.6.2 发光二极管阐明...................................................................................13
3.6.3 声光报警电路.......................................................................................13
4 系统软件设计..........................................................................................................14
4.1 软件设计概述................................................................................................14
4.1.1 Keil 软件简介.......................................................................................14
4.2 系统软件设计................................................................................................14
4.2.1 主程序流程图......................................................................................14
4.2.2 酒精浓度检测子程序..........................................................................15
4.2.3 LCD 显示子程序..................................................................................15
4.2.4 无线通信子程序..................................................................................16
4.2.5 报警子程序..........................................................................................20
4.2.5 串行口子程序......................................................................................21
5 硬件焊接及调试......................................................................................................23
5.1 概要阐明........................................................................................................23
5.1.1 硬件焊接...............................................................................................23
5.1.2 软件调试..............................................................................................23
5.1.3 软硬联调..............................................................................................23
