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片式多层陶瓷电容器(MLCC)是适合于表面贴装技术(DOC 31页).pdf
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简介 Brief Introduction
▉ MLCC 简介:
片式多层瓷电容器(MLCC)是适合于表面贴装技术(SMT)的小尺寸、高比
容、高精度瓷介质电容器,可贴装于印刷线路板(PCB)、混合集成电路(HIC)
基片,有效地缩小电子信息终端产品(尤其是便携式产品)的体积和重量,提
高产品可靠性。顺应了 IT 产业小型化、轻量化、高性能、多功能的发展方向。
General Introduction
Multi-layer ceramic chip capacitor is a kind of ceramic dielectric
capacitor with small size, high capacitance per volume, high accuracy,
suited surface mounted technology (SMT). It is widely used in electronic
circuitry, mounted printed circuit board, and hybrid IC. These
different functions require specific capacitor properties.
▉ MLCC 的分类:
根据所采用瓷介质材料的类型,MLCC 可划分为两大类:
1 类瓷介质 MLCC
具有极高的稳定性,其电容量几乎不随时间、交流信号、外加直流偏压的变化
而改变,同时具有极低介质损耗,即高 Q 值。适用于对容量精度和应用频率要
求较高的谐振电路。根据电容量的温度系数又可分为温度稳定型与温度补偿型
两种。、
2 类瓷介质 MLCC
具有很高的比体积电容量,适合用于旁路、耦合、滤波以及对容量稳定性要求
不高的鉴频电路。在 DC-DC(AC)变换器和开关电源滤波电路正逐步取代钽电解
电容器、铝电解电容器。
MLCC can be divided into two classes:
Class 1
Dielectrics are used with very high Q and linear temperature coefficient
in these capacitors. They can be distinguished into temperature
compensating type and temperature stable type.
They can be used in such applications as oscillators and filters where
low losses, low capacitance drift or temperature compensation and high
stability are required.
Class 2
These capacitors have a very high capacitance per volume and non-linear
temperature characteristics. They are used for by-passing, coupling,
filter and de-coupling. For instance, they can be substituted for the
Ta, Al electrolytic capacitors in DC-DC(AC) converters and switching
power suppliers.
█ MLCC 的制造工艺
将化学组成和微观晶相结构符合设计要求的瓷原粉和有机粘合剂进行充分混
合成为瓷料浆,通过流延或喷涂等方式制得所需厚度的生坯膜片。在膜片上印
刷电极后进行叠压、切割成为单个电容器生坯后于 1000℃—1400℃之间进行
多层共烧,在所得瓷坯两端进行端电极金属化处理后即制成 MLCC 成品。最后
经电性能测试和检验合格,即可包装入库,并交付使用。
Manufacture process of MLCC
Ceramic powders, which formulation and crystal phase fitted the
demand of designing, are carefully mixed with solvent and binder, and
then finely milled as slurry.
The very thin green sheets can be obtained by casting or spraying the
slurry. After this, electrode is printed on the sheets which then be
stacked, pressed and cut into chips. The green chip is co-fired at
temperatures between 1000 and 1400℃ to become a monolithic block.
The final product can be formed by metalizing the termination of the
compact ceramic chip.
█ MLCC 的结构
MLCC 的电容量与电极交叠面积 A、介质层数 n 和瓷介质材料的相对介电常数
ε
r
呈正比,与单层介质厚度 T 呈反比关系。
C = ε
r
×ε
0
×A×n / T
额定工作电压主要依赖于介质材料抗电强度、介质厚度以及电容器的结构设
计。
如图 1 所示。
Structure of MLCC
The capacitance of a MLCC depends on the area of the electrodes (A),
the thickness of the ceramic dielectric (T) and the dielectric constant
of the ceramic material (ε
r
) , and the number of dielectric layers (n)
with multi-layer ceramic capacitors:
C = ε
r
×ε
0
×A×n / T
The rated voltage depends on the structure of the device, the thickness
and strength of the dielectric
Figure 1 shows the structure of a multi-layer capacitor.
结构与外形尺寸 Structure & Dimension
W
H
L
1
L
2
锡 Sn
镍 Ni
银/铜 Ag/Cu
陶瓷介质
Ceramic Dielectric
Electrode
内电极
图 1 片式多层陶瓷电容器外形与内部结构
Figure 1 Dimension and Cross-section of MLCC
L
尺 寸 代 码
GB/IEC/EI
长度
A
L/mm
( JIS/EIA
J)
0201
(0603)
0402
(1005)
0603
(1608)
0.6±0.0 0.3±0.0
0.27/0.33
3 3
0.45/0.55
5 5
0.70/0.90
0 0
1.25±0. 0.75/1.35
0805
(2012)
2.0±0.2
20
0.25/0.75
0
+0.30
1.25
-0.10
1206
(3216)
产品型号规格及代码定义 Part Number System
C 0402 C0G 101 J 500 N
T B
3.2±0.2 1.6±0.2
0.50/1.80
0 0
0.25/0.75
1.15/1.55
0.20/0.60
1.6±0.1 0.8±0.1
0.15/0.35
1.0±0.0 0.5±0.0
0.10/0.20
W/mm
H(Min/Max)/mm L
1
(Min/Max)/mm
宽度
大值) 最大值)
厚度(最小值/最 端头宽度(最小值 /
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