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NV6117 FINAL 11-22-2019.pdf
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650 V GaNFast™ Power IC The NV6117 is a 650 V GaNFast™ power IC, optimized for high frequency, soft-switching topologies
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Final Datasheet 1 Rev Nov 22, 2019
NV6117
QFN 5 x 6 mm
Simplified schematic
1. Features
GaNFast™ Power IC
• Monolithically-integrated gate drive
• Wide logic input range with hysteresis
• 5 V / 15 V input-compatible
• Wide V
CC
range (10 to 30 V)
• Programmable turn-on dV/dt
• 200 V/ns dV/dt immunity
• 650 V eMode GaN FET
• Low 120 mΩ resistance
• Zero reverse recovery charge
• 2 MHz operation
Small, low-profile SMT QFN
• 5 x 6 mm footprint, 0.85 mm profile
• Minimized package inductance
2. Description
The NV6117 is a 650 V GaNFast™ power IC,
optimized for high frequency, soft-switching topologies.
Monolithic integration of FET, drive and logic creates
an easy-to-use ‘digital-in, power-out’ high-performance
powertrain building block, enabling designers to create
the fastest, smallest, most efficient integrated
powertrain in the world.
The highest dV/dt immunity, high-speed integrated
drive and industry-standard low-profile, low-inductance,
5 x 6 mm SMT QFN package allow designers to exploit
Navitas GaN technology with simple, quick, dependable
solutions for breakthrough power density and efficiency.
Navitas’ GaNFast™ power ICs extend the
capabilities of traditional topologies such as flyback,
half-bridge, resonant, etc. to MHz+ and enable the
commercial introduction of breakthrough designs.
3. Topologies / Applications
• AC-DC, DC-DC, DC-AC
• Buck, boost, half bridge, full bridge
• Active Clamp Flyback, LLC resonant, Class D
• Quasi-Resonant Flyback
• Mobile fast-chargers, adapters
• Notebook adaptors
• LED lighting, solar micro-inverters
• TV / monitor, wireless power
• Server, telecom & networking SMPS
Environmental
• RoHS, Pb-free, REACH-compliant
4. Typical Application Circuits
DC
OUT
(+)
Boost
DC
IN
(+)
DC
IN
(-) DC
OUT
(-)
10V to 24V
V
CC
D
Z
V
DD
PWM
S
NV6117
D
REG
dV/dt
10V to 24V
DC
IN
(+)
DC
IN
(-)
PGND
V
CC
D
Z
V
DD
PWM
Half
Bridge
Driver
IC
NV6117
NV6117
S
D
REG
dV/dt
S
D
REG
dV/dt
V
CC
D
Z
V
DD
PWM
Half-bridge
650 V GaNFast™ Power IC
Final Datasheet 2 Rev Nov 22, 2019
NV6117
5. Table of Contents
1. Features ................................................................. 1
2. Description ............................................................. 1
3. Topologies / Applications ..................................... 1
4. Typical Application Circuits ................................. 1
5. Table of Contents .................................................. 2
6. Specifications ........................................................ 3
6.1. Absolute Maximum Ratings
(1)
............................ 3
6.2. Recommended Operating Conditions
(3)
............. 3
6.3. ESD Ratings ...................................................... 4
6.4. Thermal Resistance ........................................... 4
6.5. Electrical Characteristics .................................... 5
6.6. Switching Waveforms ........................................ 6
6.7. Characteristic Graphs ........................................ 7
7. Internal Schematic, Pin Configurations and
Functions ................................................................. 10
8. Functional Description ........................................ 11
8.1. Start Up ............................................................ 11
8.2. Normal Operating Mode ................................... 12
8.3. Standby Mode .................................................. 12
8.4. Programmable Turn-on dV/dt Control .............. 12
8.5. Current Sensing ............................................... 13
8.6. Paralleling Devices ........................................... 13
8.7. 3.3V PWM Input Circuit .................................... 14
8.8. PCB Layout Guidelines .................................... 14
8.9. Recommended Component Values.................. 15
8.9.1. Zener Selection ........................................ 15
8.10. Drain-to-Source Voltage Considerations ........ 16
9. Recommended PCB Land Pattern ...................... 17
10. PCB Layout Guidelines ..................................... 18
11. QFN Package Outline ........................................ 20
12. Tape and Reel Dimensions ............................... 21
13. Ordering Information ......................................... 22
14. Revision History................................................. 22
Final Datasheet 3 Rev Nov 22, 2019
NV6117
6. Specifications
6.1. Absolute Maximum Ratings
(1)
(with respect to Source (pad) unless noted)
SYMBOL
PARAMETER
MAX
UNITS
V
DS
Drain-to-Source Voltage
-7 to +650
V
V
TDS
Transient Drain-to-Source Voltage
(2)
750
V
V
CC
Supply Voltage
30
V
V
PWM
PWM Input Pin Voltage
-3 to +30
V
V
DZ
V
DD
Setting Pin Voltage
6.6
V
V
DD
Drive Supply Voltage
7.2
V
I
D
Continuous Drain Current (@ T
C
= 100ºC)
12
A
I
D
PULSE
Pulsed Drain Current (10 µs @ T
J
= 25ºC)
24
A
I
D
PULSE
Pulsed Drain Current (10 µs @ T
J
= 125ºC)
16
A
dV/dt
Slew Rate on Drain-to-Source
200
V/ns
T
J
Operating Junction Temperature
-55 to 150
ºC
T
STOR
Storage Temperature
-55 to 150
ºC
(1) Absolute maximum ratings are stress ratings; devices subjected to stresses beyond these ratings may cause permanent damage.
(2) < 100 µs. V
TDS
is intended for surge rating during non-repetitive events (for example start-up, line interruption).
6.2. Recommended Operating Conditions
(3)
SYMBOL
PARAMETER
MIN
TYP
MAX
UNITS
V
DZ
Drive Supply Set Zener Voltage
(4)
5.8
6.2
6.6
V
V
DD
Drive Supply Voltage
5.5
7.0
V
I
DD_EXT
Regulator External Load Current
3.0
mA
R
DD
Gate Drive Turn-On Current Set Resistance
(5)
10
25
200
Ω
V
PWM
PWM Input Pin Voltage
0
5
Min. of
(V
CC
or 20)
V
V
CC
Supply Voltage
10
24
V
T
C
Operating Case Temperature
-40
125
ºC
(3) Exposure to conditions beyond maximum recommended operating conditions for extended periods of time may affect device reliability.
(4) Use of Zener diode other than 6.2 V is not recommended. See Table I for recommended part numbers of 6.2 V Zener diodes.
(5) R
DD
resistor must be used. Minimum 10 Ohm to ensure application and device robustness.
Final Datasheet 4 Rev Nov 22, 2019
NV6117
6.3. ESD Ratings
SYMBOL
PARAMETER
MAX
UNITS
HBM
Human Body Model (per JS-001-2014)
1,000
V
CDM
Charged Device Model (per JS-002-2014)
1,000
V
6.4. Thermal Resistance
SYMBOL
PARAMETER
TYP
UNITS
R
ɵJC
(6)
Junction-to-Case
1.8
ºC/W
R
ɵJA
(6)
Junction-to-Ambient
50
ºC/W
(6) R
ɵ
measured on DUT mounted on 1 square inch 2 oz Cu (FR4 PCB)
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