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GD32F303XX datasheet
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GD32F303XX datasheet
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GigaDevice Semiconductor Inc.
GD32F303xx
Arm
®
Cortex
®
-M4 32-bit MCU
Datasheet
GD32F303xx Datasheet
1
Table of Contents
Table of Contents................................................................................................................. 1
List of Figures ...................................................................................................................... 4
List of Tables ........................................................................................................................ 5
1. General description ...................................................................................................... 7
2. Device overview ............................................................................................................ 8
2.1. Device information....................................................................................................... 8
2.2. Block diagram ............................................................................................................10
2.3. Pinouts and pin assignment ........................................................................................ 11
2.4. Memory map...............................................................................................................14
2.5. Clock tree ...................................................................................................................18
2.6. Pin definitions ............................................................................................................19
2.6.1. GD32F303Zx LQFP144 pin definitions ................................................................ 19
2.6.2. GD32F303Vx LQFP100 pin definitions ................................................................ 28
2.6.3. GD32F303Rx LQFP64 pin definitions.................................................................. 34
2.6.4. GD32F303Cx LQFP48 pin definitions.................................................................. 38
3. Functional description ............................................................................................... 41
3.1. Arm
®
Cortex
®
-M4 core .................................................................................................41
3.2. On-chip memory .........................................................................................................41
3.3. Clock, reset and supply management...........................................................................42
3.4. Boot modes ................................................................................................................42
3.5. Power saving modes ...................................................................................................43
3.6. Analog to digital converter (ADC).................................................................................43
3.7. Digital to analog converter (DAC).................................................................................44
3.8. DMA ...........................................................................................................................44
3.9. General-purpose inputs/outputs (GPIOs) ......................................................................44
3.10. Timers and PWM generation.....................................................................................45
3.11. Real time clock (RTC) ..............................................................................................46
3.12. Inter-integrated circuit (I2C)......................................................................................46
3.13. Serial peripheral interface (SPI) ................................................................................46
3.14. Universal synchronous asynchronous receiver transmitter (USART) ..........................47
GD32F303xx Datasheet
2
3.15. Inter-IC sound (I2S) ..................................................................................................47
3.16. Universal serial bus full-speed device interface (USBD) .............................................47
3.17. Controller area network (CAN) ..................................................................................48
3.18. Secure digital input and output card interface (SDIO).................................................48
3.19. External memory controller (EXMC) ..........................................................................48
3.20. Debug mode............................................................................................................49
3.21. Package and operation temperature .........................................................................49
4. Electrical characteristics ........................................................................................... 50
4.1. Absolute maximum ratings ..........................................................................................50
4.2. Operating conditions characteristics............................................................................50
4.3. Power consumption ....................................................................................................52
4.4. EMC characteristics ....................................................................................................60
4.5. Power supply supervisor characteristics ......................................................................60
4.6. Electrical sensitivity ....................................................................................................61
4.7. External clock characteristics ......................................................................................62
4.8. Internal clock characteristics .......................................................................................64
4.9. PLL characteristics .....................................................................................................65
4.10. Memory characteristics............................................................................................66
4.11. NRST pin characteristics..........................................................................................66
4.12. GPIO characteristics ................................................................................................67
4.13. ADC characteristics .................................................................................................68
4.14. Temperature sensor characteristics..........................................................................70
4.15. DAC characteristics .................................................................................................70
4.16. I2C characteristics ...................................................................................................72
4.17. SPI characteristics...................................................................................................72
4.18. I2S characteristics ...................................................................................................73
4.19. USART characteristics .............................................................................................73
4.20. SDIO characteristics ................................................................................................74
4.21. CAN characteristics .................................................................................................74
4.22. USBD characteristics ...............................................................................................74
4.23. EXMC characteristics...............................................................................................75
4.24. TIMER characteristics ..............................................................................................79
GD32F303xx Datasheet
3
4.25. WDGT characteristics ..............................................................................................79
4.26. Parameter conditions...............................................................................................80
5. Package information................................................................................................... 81
5.1. LQFP144 package outline dimensions..........................................................................81
5.2. LQFP100 package outline dimensions..........................................................................82
5.3. LQFP64 package outline dimensions ...........................................................................83
5.4. LQFP48 package outline dimensions ...........................................................................84
5.5. Thermal characteristics ...............................................................................................85
6. Ordering information .................................................................................................. 87
7. Revision history .......................................................................................................... 90
GD32F303xx Datasheet
4
List of Figures
Figure 2-1. GD32F303xx block diagram .................................................................................................................. 10
Figure 2-2. GD32F303Zx LQFP144 pinouts............................................................................................................ 11
Figure 2-3. GD32F303Vx LQFP100 pinouts............................................................................................................ 12
Figure 2-4. GD32F303Rx LQFP64 pinouts.............................................................................................................. 13
Figure 2-5. GD32F303Cx LQFP48 pinouts.............................................................................................................. 13
Figure 2-6. GD32F303xx clock tree........................................................................................................................... 18
Figure 4-1. Recommended power supply decoupling capacitors
(1) (2)
.......................................................... 51
Figure 4-2. Typical supply current consumption in Run mode (All peripherals enabled)..................... 57
Figure 4-3. Typical supply current consumption in Run mode (All peripherals disabled) ................... 57
Figure 4-4. Typical supply current consumption in Sleep mode (All peripherals enabled) ................. 58
Figure 4-5. Typical supply current consumption in Sleep mode (All peripherals disabled) ................ 58
Figure 4-6. Recommended external NRST pin circuit ........................................................................................ 67
Figure 4-7. I/O port AC characteristics definition ................................................................................................ 68
Figure 4-8. USBD timings: definition of data signal rise and fall time ......................................................... 75
Figure 5-1. LQFP144 package outline...................................................................................................................... 81
Figure 5-2. LQFP100 package outline...................................................................................................................... 82
Figure 5-3. LQFP64 package outline ........................................................................................................................ 83
Figure 5-4. LQFP48 package outline ........................................................................................................................ 84
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