ads1146模数转换芯片_7711TH芯片应用电路图资源-CSDN文库

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### ADS1146模数转换芯片概述 ADS1146是德州仪器（TI）推出的一款高集成度、高精度的16位模数转换器（ADC）。该芯片主要应用于温度传感器领域，如热电偶、热敏电阻以及电阻温度检测器（RTDs）等。ADS1146与同系列的ADS1147和ADS1148相比，功能上有所不同，但都基于相同的核心技术。 ### 核心特性解析 #### 1. 16位无缺失码精度 ADS1146提供了16位的模数转换精度，并且在全数据范围内无缺失码，确保了转换结果的准确性和一致性。 #### 2. 数据输出速率高达2 kSPS 该芯片支持的数据输出速率最高可达2 kSPS（每秒千次采样），满足了快速采样需求的同时保持了高精度。 #### 3. 单周期稳定时间适用于所有数据率无论数据输出速率如何调整，ADS1146都能在单个周期内完成数据稳定，这对于实时性要求较高的应用非常有利。 #### 4. 20 SPS时同时具备50/60 Hz抑制能力当数据输出速率为20 SPS时，该芯片能够同时抑制50 Hz和60 Hz的噪声干扰，这对于消除交流电源产生的干扰特别有效。 ### 内部结构与功能 #### 输入多路复用器(Input Mux) - **输入多路复用器**允许用户选择不同的输入通道进行转换。 - ADS1148支持4组差分输入或7组单端输入，而ADS1147则支持2组差分输入或3组单端输入。 #### 第三阶Delta-Sigma调制器(3rd Order DS Modulator) - **第三阶Delta-Sigma调制器**是该芯片的核心部分，它将模拟信号转换为数字信号，采用先进的调制技术来提高信噪比和精度。 #### 参考电压输入(REFP/REFN) - **参考电压输入**提供了一个稳定的参考电压，用于确保模数转换的准确性。 #### 可编程增益放大器(PGA) - **可编程增益放大器**可以根据需要调整输入信号的幅度，提高了系统的灵活性和适应性。 #### 烧毁检测(Burnout Detect) - **烧毁检测**功能可以在传感器出现故障或断开连接时发出警告，这对于维护系统安全至关重要。 #### 供电和VREF监测 - **供电和VREF监测**确保了系统在异常情况下的稳定性，比如电源电压波动或参考电压不稳时。 ### 接口与控制 #### 串行接口 - **串行接口**包括SCLK（串行时钟）、DIN（数据输入）、DOUT/DRDY（数据输出/就绪）、CS（片选）等信号线，支持SPI兼容通信协议。 #### 数字滤波器 - **数字滤波器**可以配置为适应不同应用场景的需求，例如提高信噪比或加快数据处理速度。 #### 内置振荡器 - **内置振荡器**提供了一个稳定的时钟源，用于控制ADC的操作频率。 #### 可调节数字滤波器(Adjustable Digital Filter) - **可调节数字滤波器**可以根据具体的应用场景进行优化，例如增加抗混叠性能或者降低功耗。 ### 其他功能特点 #### 通用I/O(GPIO) - **通用I/O(GPIO)**提供了额外的功能扩展可能性，可用于外部信号采集或其他控制目的。 #### 双电流DACs - **双电流DACs**（数字到模拟转换器）为系统提供了灵活的电流输出能力，这在需要精确电流控制的应用场景中非常有用。 #### 内置电压参考 - **内置电压参考**为系统提供了一个稳定的参考电压源，这对于保持模数转换的一致性和精度非常重要。 #### 内置温度传感器 - **内置温度传感器**使得ADS1146能够自检其内部温度，对于温度敏感型应用而言是一个非常有用的特性。 ### 结论 ADS1146是一款高度集成、功能强大的16位模数转换器，专为温度传感器应用设计。它不仅提供了出色的转换精度，还具备一系列高级功能，如快速数据输出、高精度数字滤波、可编程增益放大以及丰富的控制接口等。这些特性使得ADS1146成为在工业自动化、环境监控以及其他对精度有严格要求领域的理想选择。

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ADS1146

ADS1147

ADS1148

Input

Mux

3rdOrder

Modulator

REFP REFN

PGA

Burnout

Detect

Burnout

Detect

DVDD

DGND

ADS1146

AVSS

AIN0

AIN1

SCLK

DIN

DRDY

DOUT/DRDY

START

RESET

AVDD

InternalOscillator

Adjustable

Digital

Filter

Serial

Interface

and

Control

CLK

Input

Mux

3rdOrder

Modulator

REFP1 REFN1 VREFOUT VREFCOM

REFP0/

GPIO0

REFN0/

GPIO1

Burnout

Detect

Burnout

Detect

DVDD

DGND

IEXC1AVSS

AIN0/IEXC

AIN1/IEXC

AIN2/IEXC/GPIO2

AIN3/IEXC/GPIO3

AIN4/IEXC/GPIO4

AIN5/IEXC/GPIO5

AIN6/IEXC/GPIO6

AIN7/IEXC/GPIO7

ADS1148 Only

SCLK

DIN

DRDY

DOUT/DRDY

START

RESET

AVDD

IEXC2

InternalOscillator

Voltage

Reference

Serial

Interface

and

Control

BIAS

GPIO

CLK

ADS1148 Only

ADS1147

ADS1148

PGA

System

Monitor

Adjustable

Digital

Filter

Dual

Current

DACs

VREFMux

ADS1148 Only

BIAS

ADS1146

ADS1147

ADS1148

www.ti.com

SBAS453C –JULY 2009–REVISED APRIL 2010

16-Bit Analog-to-Digital Converters for Temperature Sensors

Check for Samples: ADS1146, ADS1147, ADS1148

FEATURES

DESCRIPTION

• 16 Bits, No Missing Codes

The ADS1146, ADS1147, and ADS1148 are

highly-integrated, precision, 16-bit analog-to-digital

• Data Output Rates Up to 2kSPS

converters (ADCs). The ADS1146/7/8 feature an

• Single-Cycle Settling for All Data Rates

onboard, low-noise, programmable gain amplifier

• Simultaneous 50/60Hz Rejection at 20SPS

(PGA), a precision delta-sigma ADC with a

• 4 Differential/7 Single-Ended Inputs (ADS1148) single-cycle settling digital filter, and an internal

oscillator. The ADS1147 and ADS1148 also provide a

• 2 Differential/3 Single-Ended Inputs (ADS1147)

built-in voltage reference with 10mA output capacity,

• Matched Current Source DACs

and two matched programmable current

• Internal Voltage Reference

digital-to-analog converters (DACs). The

ADS1146/7/8 provide a complete front-end solution

• Sensor Burnout Detection

for temperature sensor applications including thermal

• 4/8 General-Purpose I/Os (ADS1147/8)

couples, thermistors, and resistance temperature

• Internal Temperature Sensor

detectors (RTDs).

• Power Supply and V

REF

Monitoring

An input multiplexer supports four differential inputs

(ADS1147/8)

for the ADS1148, two for the ADS1147, and one for

the ADS1146. In addition, the multiplexer has a

• Self and System Calibration

sensor burnout detect, voltage bias for

• SPI™-Compatible Serial Interface

thermocouples, system monitoring, and

• Analog Supply Operation:

general-purpose digital I/Os (ADS1147 and

+2.7V to +5.25V Unipolar, ±2.5V Bipolar

ADS1148). The onboard, low-noise PGA provides

selectable gains of 1 to 128. The delta-sigma

• Digital Supply: +2.7V to +5.25V

modulator and adjustable digital filter settle in only

• Operating Temperature –40°C to +125°C

one cycle, for fast channel cycling when using the

input multiplexer, and support data rates up to

APPLICATIONS

2kSPS. For data rates of 20SPS or less, both 50Hz

• Temperature Measurement

and 60Hz interference are rejected by the filter.

– RTDs, Thermocouples, and Thermistors

The ADS1146 is offered in a small TSSOP-16

• Pressure Measurement

package, the ADS1147 is available in a TSSOP-20

• Industrial Process Control

package, and the ADS1148 in a TSSOP-28 package.

All three devices operate over the extended specified

temperature range of –40°C to +105°C.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2SPI is a trademark of Motorola, Inc.

3All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

ADS1146

ADS1147

ADS1148

SBAS453C –JULY 2009–REVISED APRIL 2010

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE/ORDERING INFORMATION

(1)

DUAL SENSOR

EXCITATION

NUMBER OF VOLTAGE CURRENT PACKAGE-

PRODUCT RESOLUTION INPUTS REFERENCE SOURCES LEAD

1 Differential

ADS1246 24 bits or External NO TSSOP-16

1 Single-Ended

2 Differential

ADS1247 24 bits or Internal or External YES TSSOP-20

3 Single-Ended

4 Differential

ADS1248 24 bits or Internal or External YES TSSOP-28

7 Single-Ended

1 Differential

ADS1146 16 bits or External NO TSSOP-16

1 Single-Ended

2 Differential

ADS1147 16 bits or Internal or External YES TSSOP-20

3 Single-Ended

4 Differential

ADS1148 16 bits or Internal or External YES TSSOP-28

7 Single-Ended

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder on ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

ADS1146, ADS1147, ADS1148 UNIT

AVDD to AVSS –0.3 to +5.5 V

AVSS to DGND –2.8 to +0.3 V

DVDD to DGND –0.3 to +5.5 V

100, momentary mA

Input current

10, continuous mA

Analog input voltage to AVSS AVSS – 0.3 to AVDD + 0.3 V

Digital input voltage to DGND –0.3 to DVDD + 0.3 V

Maximum junction temperature +150 °C

Operating temperature range –40 to +125 °C

Storage temperature range –60 to +150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to

absolute-maximum-rated conditions for extended periods may affect device reliability.

Product Folder Link(s): ADS1146 ADS1147 ADS1148

ADS1146

ADS1147

ADS1148

www.ti.com

SBAS453C –JULY 2009–REVISED APRIL 2010

THERMAL INFORMATION

ADS1146,

ADS1147,

ADS1148

THERMAL METRIC

(1)

UNITS

Junction-to-ambient thermal resistance

(2)

79.5

JC(top)

Junction-to-case(top) thermal resistance

(3)

31.8

Junction-to-board thermal resistance

(4)

40.9

°C/W

Junction-to-top characterization parameter

(5)

3.0

Junction-to-board characterization parameter

(6)

41.1

JC(bottom)

Junction-to-case(bottom) thermal resistance

(7)

n/a

(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific

JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(5) The junction-to-top characterization parameter, y

, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining q

, using a procedure described in JESD51-2a (sections 6 and 7).

(6) The junction-to-board characterization parameter, y

, estimates the junction temperature of a device in a real system and is extracted

from the simulation data for obtaining q

, using a procedure described in JESD51-2a (sections 6 and 7).

(7) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific

JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

Product Folder Link(s): ADS1146 ADS1147 ADS1148

(V )(Gain)

AVSS 0.1V+ +

AVDD 0.1V- -

(V )(Gain)

ADS1146

ADS1147

ADS1148

SBAS453C –JULY 2009–REVISED APRIL 2010

www.ti.com

ELECTRICAL CHARACTERISTICS

Minimum/maximum specifications apply from –40°C to +105°C. Typical specifications are at +25°C. All specifications at

AVDD = +5V, DVDD = +3.3V, AVSS = DGND = 0V, V

REF

= +2.048V, and oscillator frequency = 4.096MHz, unless otherwise

noted.

ADS1146, ADS1147, ADS1148

PARAMETER CONDITIONS MIN TYP MAX UNIT

ANALOG INPUTS

Full-scale input voltage

±V

REF

/PGA 2.7/PGA V

= ADCINP – ADCINN)

Common-mode input range V

Differential input current 100 pA

1, 2, 4, 8, 16, 32,

PGA gain settings

64, 128

Burnout current source 0.5, 2, or 10 mA

Bias voltage (AVDD + AVSS)/2 V

Bias voltage output impedance 400 Ω

Mux leakage current

SYSTEM PERFORMANCE

Resolution No missing codes 16 Bits

5, 10, 20, 40, 80,

Data rate 160, 320, 640, SPS

1000, 2000

Integral nonlinearity (INL) Differential input, end point fit, PGA = 1 ±0.5 ±1 LSB

Offset error After calibration 1 LSB

PGA = 1 100 nV/°C

Offset drift

PGA = 128 15 nV/°C

Gain error Excluding V

REF

errors ±0.5 %

PGA = 1, excludes V

REF

drift 1 ppm/°C

Gain drift

PGA = 128, excludes V

REF

drift –3.5 ppm/°C

ADC conversion time Single-cycle settling See Table 15

Noise See Table 5 and Table 6

Normal-mode rejection See Table 8

At dc, PGA = 1 90 dB

Common-mode rejection

At dc, PGA = 32 100 dB

Power-supply rejection AVDD, DVDD at dc 100 dB

VOLTAGE REFERENCE INPUT

Voltage reference input (AVDD – AVSS)

0.5 V

REF

= V

REFP

– V

REFN

) – 1

Negative reference input (REFN) AVSS – 0.1 REFP – 0.5 V

Positive reference input (REFP) REFN + 0.5 AVDD + 0.1 V

Reference input current 30 nA

ON-CHIP VOLTAGE REFERENCE

Output voltage 2.038 2.048 2.058 V

Output current

(1)

±10 mA

Load regulation 50 mV/mA

Drift

(2)

= –40°C to +105°C 20 50 ppm/°C

Startup time See Table 9 ms

(1) Do not exceed this loading on the internal voltage reference.

(2) Specified by the combination of design and final production test.

Product Folder Link(s): ADS1146 ADS1147 ADS1148

ADS1146

ADS1147

ADS1148

www.ti.com

SBAS453C –JULY 2009–REVISED APRIL 2010

ELECTRICAL CHARACTERISTICS (continued)

Minimum/maximum specifications apply from –40°C to +105°C. Typical specifications are at +25°C. All

specifications at AVDD = +5V, DVDD = +3.3V, AVSS = DGND = 0V, V

REF

= +2.048V, and oscillator frequency =

4.096MHz, unless otherwise noted.

ADS1146, ADS1147, ADS1148

PARAMETER CONDITIONS MIN TYP MAX UNIT

CURRENT SOURCES (IDACS)

50, 100, 250,

Output current 500, 750, 1000, mA

1500

Voltage compliance All currents AVDD – 0.7 V

Initial error All currents, each IDAC –6 ±1.0 6 % of FS

Initial mismatch All currents, between IDACs ±0.03 % of FS

Temperature drift Each IDAC 200 ppm/°C

Temperature drift matching Between IDACs 10 ppm/°C

SYSTEM MONITORS

Voltage T

= +25°C 118 mV

Temperature

sensor reading

Drift 405 mV/°C

GENERAL-PURPOSE INPUT/OUTPUT (GPIO)

0.7AVDD AVDD V

AVSS 0.3AVDD V

Logic levels

= 1mA 0.8AVDD V

= 1mA AVSS 0.2 AVDD V

DIGITAL INPUT/OUTPUT (other than GPIO)

0.7DVDD DVDD V

DGND 0.3DVDD V

Logic levels

= 1mA 0.8DVDD V

= 1mA DGND 0.2 DVDD V

Input leakage DGND < V

DIGITAL IN

< DVDD ±10 mA

Frequency 1 4.5 MHz

Clock input

(CLK)

Duty cycle 25 75 %

Internal oscillator frequency 3.89 4.096 4.3 MHz

POWER SUPPLY

DVDD 2.7 5.25 V

AVSS –2.5 0 V

AVDD AVSS + 2.7 AVSS + 5.25 V

Normal mode, DVDD = 5V,

230 mA

data rate = 20SPS, internal oscillator

DVDD current Normal mode, DVDD = 3.3V,

210 mA

data rate = 20SPS, internal oscillator

Sleep mode 0.2 µA

Converting, AVDD = 5V,

225 µA

data rate = 20SPS, external reference

Converting, AVDD = 3.3V,

212 µA

data rate = 20SPS, external reference

AVDD current

Sleep mode 0.1 µA

Additional current with internal reference

180 mA

enabled

AVDD = DVDD = 5V, data rate = 20SPS,

2.3 mW

external reference, internal oscillator

Power dissipation

AVDD = DVDD = 3.3V, data rate = 20SPS,

1.4 mW

external reference, internal oscillator

TEMPERATURE RANGE

Specified –40 +105 °C

Operating –40 +125 °C

Storage –60 +150 °C

Product Folder Link(s): ADS1146 ADS1147 ADS1148

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wo_shi_star

2013-08-29

呵呵，谢谢，这解决了我的很大问题。
heuwangrui

2013-04-26

标准芯片解释资料

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