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validation of DDR2 or 3
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2012-12-05
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Validation of DDR2/3 Designs
30 May 2007
Page 1
Validation of DDR2/3 Designs
Validation of DDR2/3 Designs
30 May 2007
Page 2
Overview
DDR2 & 3 Design and Validation Challenges
Probing as key to success
Physical Layer Validation
Protocol Layer Validation
Q&A
Validation of DDR2/3 Designs
30 May 2007
Page 3
DDR3 Key Characteristics
• DQ rates from 800-1600Mb/s (C/A rates from 400-800Mb/s)
• Differential strobes
• Dynamic ODT
• Independent CL for Reads and Writes
• Support for “fly-by” DIMM architecture
Validation of DDR2/3 Designs
30 May 2007
Page 4
DDR2 and DDR3 DIMM Architecture
DDR2 DIMM Architecture
• T-branch topology balances the
delay to each memory device,
but makes reflections hard to
manage
DDR3 DIMM Architecture
• Fly-by topology improves C/A
signal integrity but the signals
from the memory controller
arrive at each DRAM at different
times
DDR2
DDR3
Validation of DDR2/3 Designs
30 May 2007
Page 5
Impact on Design and Validation
Clock Speeds reaching 1GHz
Parallel buses reaching the
speeds of serial technology
Tighter timing margins require
calibration and bus training for
DRAM, controller, and analyzer
capture
Crosstalk, impedance, EMI, and
jitter management
Noise susceptibility
Probe load effects are critical
100 MT/s
400 MT/s
800 MT/s
1.6 GT/s
3.2 GT/s
2000
2002
2005
2008+
2010+
Memory Speed
Roadmap
DDR4
DDR3
DDR2
DDR
SDR
Benefits of good signal integrity
Guarantees interoperability with
different vendors
Improved performance
More design margin
“I’m becoming a
microwave designer!”
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