2
OPA140
,
OPA2140
,
OPA4140
ZHCSJA0D –JULY 2010–REVISED JANUARY 2019
www.ti.com.cn
Copyright © 2010–2019, Texas Instruments Incorporated
目目录录
1 特特性性.......................................................................... 1
2 应应用用.......................................................................... 1
3 说说明明.......................................................................... 1
4 修修订订历历史史记记录录 ........................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings ............................................................ 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information: OPA140 .................................. 6
6.5 Thermal Information: OPA2140 ................................ 6
6.6 Thermal Information: OPA4140 ................................ 6
6.7 Electrical Characteristics: V
S
= 4.5 V to 36 V; ±2.25 V
to ± 18 V...................................................................... 7
6.8 Typical Characteristics.............................................. 8
7 Detailed Description............................................ 15
7.1 Overview ................................................................. 15
7.2 Functional Block Diagram ....................................... 15
7.3 Feature Description................................................. 15
7.4 Device Functional Modes........................................ 22
8 Application and Implementation ........................ 23
8.1 Application Information............................................ 23
8.2 Typical Application ................................................. 23
9 Power Supply Recommendations...................... 24
10 Layout................................................................... 25
10.1 Layout Guidelines ................................................. 25
10.2 Layout Example .................................................... 25
11 器器件件和和文文档档支支持持 ..................................................... 26
11.1 器件支持................................................................ 26
11.2 文档支持................................................................ 26
11.3 相关链接................................................................ 27
11.4 接收文档更新通知 ................................................. 27
11.5 社区资源................................................................ 27
11.6 商标 ....................................................................... 27
11.7 静电放电警告......................................................... 27
11.8 术语表 ................................................................... 27
12 机机械械、、封封装装和和可可订订购购信信息息....................................... 27
4 修修订订历历史史记记录录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision C (August 2016) to Revision D Page
• Changed Figure 12 x-axis title From: Frequency (Hz) To: Output Amplitude (V
RMS
)........................................................... 10
Changes from Revision B (November 2015) to Revision C Page
• Changed units for E
n
Input voltage noise From: µV To: nV in Electrical Characteristics: V
S
= 4.5 V to 36 V; ±2.25 V
to ±18 V ................................................................................................................................................................................. 7
Changes from Revision A (August 2010) to Revision B Page
• 已添加 添加了 ESD
额定值
表、
特性 说明
部分、
器件功能模式
、
应用和实施
部分、
电源建议
部分、
布局
部分、
器
件和文档支持
部分以及
机械、封装和可订购信息
部分........................................................................................................... 1
• Changed title of Table 1 From: Characteristic Performance Measurements To: Table of Graphs ....................................... 8
• Changed section 7.37 title From: Power Dissipation and Thermal Protection To: Thermal Protection .............................. 18
Changes from Original (July 2010) to Revision A Page
• 已更改 将器件和数据表状态更改成了生产数据状态................................................................................................................ 1
• Added SOIC (8) (MSOP) packages........................................................................................................................................ 3
