HUAWEI ME909s Series LTE LGA Module
Hardware Guide
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
3.11 JTAG Interface .............................................................................................................................. 46
3.12 RF Antenna Interface ................................................................................................................... 47
3.13 Reserved Interface ....................................................................................................................... 50
3.14 NC Interface ................................................................................................................................. 50
3.15 Test Points Design ........................................................................................................................ 51
4 RF Specifications ......................................................................................................................... 52
4.1 About This Chapter ......................................................................................................................... 52
4.2 Operating Frequencies ................................................................................................................... 52
4.3 Conducted RF Measurement ......................................................................................................... 54
4.3.1 Test Environment ................................................................................................................... 54
4.3.2 Test Standards ....................................................................................................................... 54
4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 54
4.4.1 Conducted Receive Sensitivity .............................................................................................. 54
4.4.2 Conducted Transmit Power ................................................................................................... 56
4.5 Antenna Design Requirements ...................................................................................................... 58
4.5.1 Antenna Design Indicators .................................................................................................... 58
4.5.2 Interference ........................................................................................................................... 60
4.5.3 Antenna Requirements .......................................................................................................... 60
4.6 Suggestions about LTE and 2.4 GHz Wi-Fi Co-existence ............................................................. 62
4.6.1 Theory Analysis ..................................................................................................................... 62
4.6.2 Suggestions about the Interference ...................................................................................... 62
5 Electrical and Reliability Features ........................................................................................... 63
5.1 About This Chapter ......................................................................................................................... 63
5.2 Absolute Ratings ............................................................................................................................ 63
5.3 Operating and Storage Temperatures ............................................................................................ 63
5.4 Power Supply Features .................................................................................................................. 64
5.4.1 Input Power Supply ............................................................................................................... 64
5.4.2 Power Consumption .............................................................................................................. 65
5.5 Reliability Features ......................................................................................................................... 74
5.6 EMC and ESD Features ................................................................................................................. 77
6 Mechanical Specifications ......................................................................................................... 80
6.1 About This Chapter ......................................................................................................................... 80
6.2 Storage Requirement ..................................................................................................................... 80
6.3 Moisture Sensitivity ........................................................................................................................ 80
6.4 Dimensions ..................................................................................................................................... 81
6.5 Packaging ....................................................................................................................................... 81
6.6 Customer PCB Design ................................................................................................................... 84
6.6.1 PCB Surface Finish ............................................................................................................... 84
6.6.2 PCB Pad Design .................................................................................................................... 84
6.6.3 Solder Mask ........................................................................................................................... 84
6.6.4 Requirements on PCB Layout ............................................................................................... 84