Communication Products BU
Preliminary Product Specification
of
WM-G-MR-09
Wireless LAN Module
SOURCE ORGANIZATION: USI WP/RD/WM/HW1
Document No. 00001 Rev. 1.7
Product Code WM-G-MR-09
Product No.
HW Prepared by︰
Camus Chen Date: 2007/10/12
Checked by︰
Date:
Approved by︰
Date:
Concurrence (MD):
Date:
Concurrence (PM):
Date:
Universal Scientific Industrial Corp.
Doc No.
Rev
1.7
Date.
2007/10/12
Page
2
Description
Product Specification – WM-G-MR-09
1 REVISION HISTORY
Version
No.
Revised
Date
Revised by Description Notes
1.0 2007-05-03
Jaddy Chen Preliminary specification released
1.1 2007-07-03 Jaddy Chen Add Recommend Footprint
1.2 2007-07-04 Jaddy Chen Revise Pin-out and Footprint
1.3 2007-07-12 Jaddy Chen Revise Pin-out pad size
1.4 2007-07-16 Camus Chen
Revise Supply Voltage, Pin-out
and Footprint
1.5 2007-09-14 Camus Chen
Revise Supply Voltage & Pin
Definition
1.6 2007-09-14 Camus Chen
Revise Supply Voltage & Pin
Definition
1.7 2007-10-12 Camus Chen
Change Module Connection to
36pin LGA
Universal Scientific Industrial Corp.
Doc No.
Rev
1.7
Date.
2007/10/12
Page
3
Description
Product Specification – WM-G-MR-09
INDEX
1
REVISION HISTORY ................................................................................................................................. 2
2 PURPOSE...................................................................................................................................................... 4
3 SCOPE........................................................................................................................................................... 4
4 GENERAL FEATURES............................................................................................................................... 5
5 ELECTRICAL SPECIFICATION.............................................................................................................. 6
5.1 SUPPLY VOLTAGE........................................................................................................................................ 6
5.2 RECOMMENDED OPERATION CONDITIONS ................................................................................................ 6
5.2.1 Temperature, humidity.................................................................................................................... 6
5.2.2 (SDIO/SPI/JTAG/RESET/COEXISTENCE/GPIO) ......................................................................... 6
5.2.3 AC electrical.................................................................................................................................... 8
5.3 POWER CONSUMPTION (SDIO MODE)...................................................................................................... 8
5.4 WIRELESS SPECIFICATIONS ....................................................................................................................... 8
5.5 RADIO SPECIFICATIONS .............................................................................................................................. 9
6 INTERFACE............................................................................................................................................... 10
6.1 PIN DEFINITION........................................................................................................................................ 10
6.1.1 MODULE PIN-OUT...................................................................................................................................... 13
6.2 SPEIFICATIONS AND TIMING DIAGRAM..................................................................................................... 14
6.2.1 External sleep clock specification................................................................................................. 14
6.2.2 SDIO protocol timing.................................................................................................................... 14
6.2.3 spi protocol timing ........................................................................................................................ 15
6.2.4 co-existance PROtocol Timing..................................................................................................... 16
6.2.5 Reset and configuration timing ..................................................................................................... 16
6.2.6 power up sequence........................................................................................................................ 17
6.2.7 jtag specification........................................................................................................................... 17
6.2.8 LED Interface................................................................................................................................ 18
6.2.9 Antenna Interface.......................................................................................................................... 18
7 REGULATORY.......................................................................................................................................... 19
8 MECHANICAL SPECIFICATION.......................................................................................................... 20
9 RECOMMANDED REFLOW PROFILE................................................................................................ 21
10 RECOMMAND FOOTPRINT.................................................................................................................. 22
11 PACKAGE AND STORAGE CONDITION............................................................................................ 23
Universal Scientific Industrial Corp.
Doc No.
Rev
1.7
Date.
2007/10/12
Page
4
Description
Product Specification – WM-G-MR-09
2 PURPOSE
The purpose of this document is to define the product specification for
802.11b/g WiFi module WM-G-MR-09.
3 SCOPE
z High speed for wireless LAN connection: IEEE802.11b/g up to
54Mbps data rate by incorporating Direct Sequence Spread
Spectrum (DSSS) and OFDM data modulation.
z Provide seamless roaming within the IEEE 802.11b/g WLAN
infrastructure.
z IEEE 802.11b/g compatible: allow inter-operation among multiple
vendors.
z Auto fallback: 54M, 48M, 36M, 24M, 18M, 12M, 9M, 6M (802.11g);
11M, 5.5M, 2M, 1M (802.11b) data rate with auto fallback.
z WPA (Wi-Fi Protected Access)
z Support 802.11i Security standard through implementation of AES /
CCMP and WEP with TKIP security mechanism.
z Support 802.11e Quality of Service (QoS)
z Interoperability – Complying with WECA WiFi.
z 3-wire, hardware signaling BT WiFi co-existence supported
Universal Scientific Industrial Corp.
Doc No.
Rev
1.7
Date.
2007/10/12
Page
5
Description
Product Specification – WM-G-MR-09
4 GENERAL FEATURES
Item Description Notes
Standard
Complies with the latest IEEE802.11b/g
wireless LAN Physical Layer Specification
(IEEE 802.11g dated 12/6/2003)
Chip Set Marvell 88W8686
Module Interface Type SDIO (1bit and 4 bit) , SDIO_SPI , G-SPI
Module Connection 36pin LGA
Co-existence
Supports 3-wire BT coexistence scheme
for an external BT solution
802.11g: 54, 48, 36, 24, 18, 12, 9, 6
Mbps, auto rate
Data Rate
802.11b: 11, 5.5, 2, 1Mbps, auto rate
OFDM (54, 48, 36, 24, 18, 12, 9, 6Mbps)
CCK (11Mbps, 5.5Mbps)
DQPSK (2Mbps)
Modulation
DBPSK (1Mbps)
Operating Frequency 2.4GHz ISM band
Operating Channels
IEEE Channels 1–14 depending on
Regulatory Domain settings
802.11b/g
Others
Compliance with FCC Class B Part
15.247, R&TTE, TELEC major RF
regulatory requirements